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MILPITAS, Calif., Jan. 7, 2025 /PRNewswire/ -- The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI's latest quarterly World Fab Forecast report. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027.
In 2025, the Americas and Japan are the leading regions with four projects each. The China and Europe & Middle East regions are each tied for third place with three planned construction projects. Taiwan has two planned projects, while Korea and Southeast Asia have one project each for 2025.
"The semiconductor industry has reached a pivotal juncture, with investments driving both leading-edge and mainstream technologies to meet evolving global demands," said Ajit Manocha, SEMI President and CEO. "Generative AI and high-performance computing are fueling advancements in the leading-edge logic and memory segments, while mainstream nodes continue to underpin critical applications in automotive, IoT and power electronics. The construction of 18 new semiconductor fabs set to begin in 2025 demonstrates the industry's commitment to support innovation and significant economic growth."
Covering 2023 to 2025, the 4Q 2024 edition of World Fab Forecast report shows that the global semiconductor industry plans to begin operation of 97 new high-volume fabs. This includes 48 projects in 2024 and 32 projects set to launch in 2025, with wafer sizes ranging from 300mm to 50mm.
Advanced Nodes Lead Semiconductor Industry Expansion
Semiconductor capacity is projected to further accelerate, with a 6.6% yearly growth rate forecast to total 33.6 million wafers per month (wpm)** for 2025. This expansion will be primarily driven by leading-edge logic technologies in high-performance computing (HPC) applications and the increasing penetration of generative AI in edge devices.
The semiconductor industry is intensifying efforts to build advanced computing capabilities, responding to the escalating computational demands of large language models (LLMs). Chip manufacturers are aggressively expanding advanced node capacities (7nm and below), which are expected to see an industry-leading 16% yearly growth rate for an increase of more than 300,000 wpm to total 2.2 million wpm in 2025.
Boosted by China's chip self-sufficiency strategy and expected demand from automotive and IoT applications, mainstream nodes (8nm~45nm) are predicted to add another 6% capacity, surpassing the 15 million wpm milestone in 2025.
Mature technology nodes (50nm and above) are experiencing a more conservative expansion, reflecting the market's slow recovery and low utilization rates. This segment is expected to grow 5%, reaching 14 million wpm in 2025.
Foundry Segment Continues Strong Capacity Growth
Foundry suppliers are expected to remain the leaders in semiconductor equipment purchases. The Foundry segment is projected to increase capacity by 10.9% year-over-year, rising from 11.3 million wpm in 2024 to a record 12.6 million wpm in 2025.
The overall memory segment shows a measured capacity expansion, with modest growth of 3.5% in 2024 and 2.9% in 2025. However, strong generative AI demand is driving significant changes in memory markets. High-bandwidth memory (HBM) is experiencing a notable surge, creating divergent capacity growth trends between the DRAM and NAND flash segments.
The DRAM segment is expected to maintain robust growth, projecting approximately a 7% year-over-year increase to 4.5 million wpm in 2025. Conversely, the installed capacity for 3D NAND is anticipated to grow 5%, reaching 3.7 million wpm in the same period.
The latest update of the SEMI World Fab Forecast report, published in December 2024, lists more than 1,500 facilities and lines globally, including 180 volume facilities and lines with various probabilities expected to start operation in 2025 or later.
Download a sample of the SEMI World Fab Forecast report.
For details about SEMI reports on other semiconductor sectors, visit SEMI Market Intelligence or contact us at mktstats@semi.org.
*The fab count does not include research and development (R&D) lines
**200mm equivalent
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Samer Bahou/SEMI Corporate
Phone: 1.408.943.7870
Email: sbahou@semi.org
Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: cdieseldorff@semi.org
Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: cwliu@semi.org
MILPITAS, Calif., Jan. 7, 2025 /PRNewswire/ -- The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI's latest quarterly World Fab Forecast report. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027.
In 2025, the Americas and Japan are the leading regions with four projects each. The China and Europe & Middle East regions are each tied for third place with three planned construction projects. Taiwan has two planned projects, while Korea and Southeast Asia have one project each for 2025.
"The semiconductor industry has reached a pivotal juncture, with investments driving both leading-edge and mainstream technologies to meet evolving global demands," said Ajit Manocha, SEMI President and CEO. "Generative AI and high-performance computing are fueling advancements in the leading-edge logic and memory segments, while mainstream nodes continue to underpin critical applications in automotive, IoT and power electronics. The construction of 18 new semiconductor fabs set to begin in 2025 demonstrates the industry's commitment to support innovation and significant economic growth."
Covering 2023 to 2025, the 4Q 2024 edition of World Fab Forecast report shows that the global semiconductor industry plans to begin operation of 97 new high-volume fabs. This includes 48 projects in 2024 and 32 projects set to launch in 2025, with wafer sizes ranging from 300mm to 50mm.
Advanced Nodes Lead Semiconductor Industry Expansion
Semiconductor capacity is projected to further accelerate, with a 6.6% yearly growth rate forecast to total 33.6 million wafers per month (wpm)** for 2025. This expansion will be primarily driven by leading-edge logic technologies in high-performance computing (HPC) applications and the increasing penetration of generative AI in edge devices.
The semiconductor industry is intensifying efforts to build advanced computing capabilities, responding to the escalating computational demands of large language models (LLMs). Chip manufacturers are aggressively expanding advanced node capacities (7nm and below), which are expected to see an industry-leading 16% yearly growth rate for an increase of more than 300,000 wpm to total 2.2 million wpm in 2025.
Boosted by China's chip self-sufficiency strategy and expected demand from automotive and IoT applications, mainstream nodes (8nm~45nm) are predicted to add another 6% capacity, surpassing the 15 million wpm milestone in 2025.
Mature technology nodes (50nm and above) are experiencing a more conservative expansion, reflecting the market's slow recovery and low utilization rates. This segment is expected to grow 5%, reaching 14 million wpm in 2025.
Foundry Segment Continues Strong Capacity Growth
Foundry suppliers are expected to remain the leaders in semiconductor equipment purchases. The Foundry segment is projected to increase capacity by 10.9% year-over-year, rising from 11.3 million wpm in 2024 to a record 12.6 million wpm in 2025.
The overall memory segment shows a measured capacity expansion, with modest growth of 3.5% in 2024 and 2.9% in 2025. However, strong generative AI demand is driving significant changes in memory markets. High-bandwidth memory (HBM) is experiencing a notable surge, creating divergent capacity growth trends between the DRAM and NAND flash segments.
The DRAM segment is expected to maintain robust growth, projecting approximately a 7% year-over-year increase to 4.5 million wpm in 2025. Conversely, the installed capacity for 3D NAND is anticipated to grow 5%, reaching 3.7 million wpm in the same period.
The latest update of the SEMI World Fab Forecast report, published in December 2024, lists more than 1,500 facilities and lines globally, including 180 volume facilities and lines with various probabilities expected to start operation in 2025 or later.
Download a sample of the SEMI World Fab Forecast report.
For details about SEMI reports on other semiconductor sectors, visit SEMI Market Intelligence or contact us at mktstats@semi.org.
*The fab count does not include research and development (R&D) lines
**200mm equivalent
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Samer Bahou/SEMI Corporate
Phone: 1.408.943.7870
Email: sbahou@semi.org
Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: cdieseldorff@semi.org
Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: cwliu@semi.org
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
SHANGHAI, April 4, 2026 /PRNewswire/ -- From April 2 to 31, the Assembly Character Toys brand Blokees made its debut at the 2026 Thailand Toy Expo. Blokees unveiled its two major categories — Blokees Model Kits and Blokees Wheels, highlighting a diverse product matrix of more than 300 products across 17 globally recognized IPs, including Ultraman, Transformers, DC, Evangelion, Naruto, Minions, Jurassic World, Hatsune Miku, and Hero Infinity. Four new model kits also made their global debut, emerging as key highlights of the event.
Mario Maurer attended the opening ceremony of Blokees Thailand Toy Expo as a special guest and engaged in interactive exchanges with consumers.
In the Blokees Model Kits category, Blokees exhibited its Champion, Legend, and Fantastic Series, featuring popular IPs such as Transformers, DC, Mega Man, Saint Seiya, Evangelion, and Naruto. More than 50 products were presented to consumers. Among them, four newly launched items—including Blokees Saint Seiya-Champion Class-12-Phoenix Ikki, Blokees Saint Seiya-Champion Class-14-Andromeda Shun, Blokees DC-Champion Class 05-Batman (HUSH), and Blokees DC-Champion Class 06-Catwoman (Hush)—drew strong interest from fans.
Blokees also highlighted its HERO5 and HERO10 series, featuring well-known IPs including Transformers, Saint Seiya, and Naruto, catering to consumers of hero-themed collectible models.
The DaaLaMode series introduced a range of products inspired by popular IPs such as Hatsune Miku, appealing to female consumers. Meanwhile, the TERRAVENTURE series presented nature and creature-themed model kits based on Jurassic World, further expanding Blokees' offerings across different consumer segments.
In the Blokees Wheels category, which integrates construction, play, and customization, products are organized into the C, E, and S series. The lineup includes IP-based offerings from Transformers, Ultraman, and Batman, with upcoming collaborations featuring Fast & Furious and Ford.
In addition, Blokees highlighted its global consumer ecosystem, BFC (Blokees Family Creator). Selected works from 2025 The 3rd BFC Creation Contest Stellar Season were exhibited in Thailand for the first time, reflecting strong user creativity and engagement. 2026 The 4th BFC Creation Contest Season of Awakening has officially launched, further encouraging global participation.
Under its "Universally appealing, Stepwise pricing, Globally promoting" strategy, Blokees continues to expand across Southeast Asia, Europe, North America, and Latin America. Thailand is rapidly becoming a strategic hub in its regional expansion, as the company strengthens both product innovation and community-driven growth worldwide.
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Blokees made its debut at 2026 Thailand Toy Expo, exhibiting multiple products
