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TAIPEI, May 23, 2025 /PRNewswire/ -- From May 20 to 23, 2025, TWSC made its debut at COMPUTEX 2025, one of the world's leading technology exhibitions, under the theme "Transcending Intelligence, Ascending Full-Stack Solutions." The company showcased a full range of storage products and solutions designed to support next-generation AI and computing applications.
As AI adoption accelerates, storage technology is becoming more scenario-driven. TWSC provides tailored "One Solution for One Scenario" services based on its full-chain capabilities in chips, algorithms, and application scenarios, accurately addressing the diverse needs of smart terminals, industrial control, servers, and other fields.
Full-Stack Storage Matrix Unleashes Efficiency
TWSC highlighted high-throughput, low-latency solutions at the event, including PCIe 5.0 SSDs, DDR5, eMMC, UFS, and LPDDR series. Combining performance and efficiency, these products enable AI inference and edge computing applications.
According to TWSC's 2024 annual report, the company reported revenue of RMB 4.773 billion, a 168.74% increase year-over-year. Embedded storage sales reached RMB 843 million, rising by 1730.6%, while high-speed PCIe SSD sales grew 979%, becoming a major growth driver.
The company now offers scenario-based solutions across enterprise, embedded, consumer, and industrial applications, building a strong foundation for global growth through advanced storage modules.
Full-Stack Self-Developed Capabilities Build Competitive Edge
To enhance control over the industrial chain, TWSC has developed an integrated "wafer-to-product" scenario-based service capability, enabling differentiation through media analysis, chip design, firmware optimization, and packaging control.
TWSC uses its "5+1+N" global supply chain network to ensure smooth coordination across R&D, production, and delivery. With a robust validation system and adaptive quality control, the company aligns product quality closely with customer needs.
From chips to scenarios, and data to value — TWSC's participation highlights the shift of storage technology from basic functions to intelligent services. By integrating industrial resources and expanding application scenarios, the company is building an open and collaborative innovation ecosystem for smart storage.
About TWSC: Shenzhen Techwinsemi Technology Co., Ltd. (Stock Code: 001309.SZ) was established in 2008 and specializes in integrated circuit solutions for storage controllers and modules. The product line covers four major series: SSD, embedded storage, DDR, and portable storage — offering reliable storage solutions for high-value applications such as smart terminals, data centers.
For more information please visit https://en.twsc.com.cn/, and follow TWSC on Facebook and Linkedin.
TAIPEI, May 23, 2025 /PRNewswire/ -- From May 20 to 23, 2025, TWSC made its debut at COMPUTEX 2025, one of the world's leading technology exhibitions, under the theme "Transcending Intelligence, Ascending Full-Stack Solutions." The company showcased a full range of storage products and solutions designed to support next-generation AI and computing applications.
As AI adoption accelerates, storage technology is becoming more scenario-driven. TWSC provides tailored "One Solution for One Scenario" services based on its full-chain capabilities in chips, algorithms, and application scenarios, accurately addressing the diverse needs of smart terminals, industrial control, servers, and other fields.
Full-Stack Storage Matrix Unleashes Efficiency
TWSC highlighted high-throughput, low-latency solutions at the event, including PCIe 5.0 SSDs, DDR5, eMMC, UFS, and LPDDR series. Combining performance and efficiency, these products enable AI inference and edge computing applications.
According to TWSC's 2024 annual report, the company reported revenue of RMB 4.773 billion, a 168.74% increase year-over-year. Embedded storage sales reached RMB 843 million, rising by 1730.6%, while high-speed PCIe SSD sales grew 979%, becoming a major growth driver.
The company now offers scenario-based solutions across enterprise, embedded, consumer, and industrial applications, building a strong foundation for global growth through advanced storage modules.
Full-Stack Self-Developed Capabilities Build Competitive Edge
To enhance control over the industrial chain, TWSC has developed an integrated "wafer-to-product" scenario-based service capability, enabling differentiation through media analysis, chip design, firmware optimization, and packaging control.
TWSC uses its "5+1+N" global supply chain network to ensure smooth coordination across R&D, production, and delivery. With a robust validation system and adaptive quality control, the company aligns product quality closely with customer needs.
From chips to scenarios, and data to value — TWSC's participation highlights the shift of storage technology from basic functions to intelligent services. By integrating industrial resources and expanding application scenarios, the company is building an open and collaborative innovation ecosystem for smart storage.
About TWSC: Shenzhen Techwinsemi Technology Co., Ltd. (Stock Code: 001309.SZ) was established in 2008 and specializes in integrated circuit solutions for storage controllers and modules. The product line covers four major series: SSD, embedded storage, DDR, and portable storage — offering reliable storage solutions for high-value applications such as smart terminals, data centers.
For more information please visit https://en.twsc.com.cn/, and follow TWSC on Facebook and Linkedin.
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TWSC Debuts at COMPUTEX 2025: Empowering AI with Full-Stack Storage Solutions
SHANGHAI, April 5, 2026 /PRNewswire/ -- DFRobot, a global leader in open-source hardware, recently participated in the Robot Hokoten @ Akihabara event in Tokyo, appearing at the DigiKey booth. The company presented two AI-driven projects based on open-source hardware—an "Electronic Nose" gas recognition system and an AI-powered cell recognition teaching system—demonstrating how AI and open hardware can be effectively applied in STEAM education and maker scenarios.
Electronic Nose: Integrating TinyML with On-Device AI
The "Electronic Nose" project combines edge AI with embedded hardware. It uses four MEMS gas sensors connected to an ESP32 running a TinyML model for real-time odor analysis.
During the demonstration, the sensor probe was placed above a glass of beer. Within 20 to 30 seconds, the system completed odor sampling and analysis. The results were then transmitted to the LattePanda Sigma, a compact x86 computing module, which generated descriptive content or tasting notes using a locally deployed language model. The entire process was executed on-device, without relying on network connectivity.
Xia Qing, Senior Engineer at DFRobot, commented: "This demonstration shows how makers can combine TinyML-based sensing with local AI models to transform sensor data into intuitive insights. Potential applications include coffee flavor analysis, fermentation monitoring, and food freshness detection."
AI Cell Recognition: Bringing AI into the STEAM Classroom
Another featured project focused on educational applications. DFRobot presented an AI-powered cell recognition teaching system designed to integrate artificial intelligence into middle school biology education. The system is built using the HUSKYLENS 2 AI vision sensor and the UNIHIKER K10 development board.
Powered by the K230 processor with up to 6 TOPS of AI computing performance, HUSKYLENS 2 can efficiently run both pre-trained and user-trained models with low latency. In the demonstration, the system performed real-time identification and classification of cells under a microscope, making abstract AI and machine learning concepts tangible through hands-on interaction.
The project showcases the complete AI workflow—from data collection and model training to edge inference—highlighting its practical applicability in educational settings.
Partnering with DigiKey to Expand the Open-Source Hardware Ecosystem
DFRobot and DigiKey jointly showcased at Robot Hokoten to promote open-source hardware and AI education. The two parties will continue collaborating on technical content, global marketing, and educational solutions, lowering the barrier to AI and open hardware adoption, and accelerating the transition from maker projects to real STEAM classroom applications.
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DFRobot Showcases AI Maker Projects at Robot Hokoten in Akihabara
