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DEEPX Unveils 'Physical AI' Vision at World Economic Forum

TECH

DEEPX Unveils 'Physical AI' Vision at World Economic Forum
TECH

TECH

DEEPX Unveils 'Physical AI' Vision at World Economic Forum

2025-11-05 09:00 Last Updated At:11-07 17:13

  • DEEPX officially recognized with the WEF MINDS 2025 Award and invited as a speaker at the New Drivers of Industry Transformation Meeting 2025
  • CEO Lokwon Kim presented the future of industrial transformation through 'Physical AI' before global innovation leaders
  • SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Ultra-low-power AI semiconductor company DEEPX (CEO Lokwon Kim) announced that it was an official speaker at the New Drivers of Industry Transformation Meeting 2025 hosted by the World Economic Forum (WEF), where it shared its vision for 'Physical AI' alongside the world's top innovation leaders.

    The WEF selected DEEPX as the first AI semiconductor company to receive the MINDS 2025 Award (Meaningful, Intelligent, Novel, Deployable Solutions), which recognizes technologies that are transforming the world through AI. The forum served as the official platform for award winners to present their achievements to global policymakers and industry leaders.

    The session featured MINDS Award honorees including Foxconn, CATL, Siemens, Lenovo, Fujitsu, and Schneider Electric, each showcasing groundbreaking use cases of AI driving transformation across their respective industries.

    DEEPX presented its collaborative mass-production project with the Hyundai Motor Group Robotics Lab, demonstrating a robot AI solution that achieves more than two times a GPU's level of performance while consuming less than 5 watts of power. The project highlighted one of Korea's most advanced examples of AI commercialization — bringing to life the concept of 'Physical AI,' or intelligence that operates directly in the physical world across industrial, robotics, security, and smart city environments.

    This achievement drew significant global attention from the manufacturing and robotics sectors for its breakthroughs in energy efficiency, cost reduction, and system optimization, marking a milestone for Korea's AI semiconductor competitiveness on the global stage.

    DEEPX also unveiled its roadmap for next-generation generative AI semiconductors based on the Samsung 2 nm process, outlining how its proprietary architecture will accelerate the realization of 'Physical AI' in real-world applications.

    "AI must evolve beyond the data center and become physical intelligence — a real-world force transforming industries and societies," said Lokwon Kim, CEO of DEEPX. "Through ultra-low-power, high-performance AI semiconductors, DEEPX is already creating tangible value across robots, factories, cities, and even human lives. WEF's recognition reaffirms that DEEPX's AI semiconductor technology now stands at the center of the world's industrial transformation."

    Going forward, the WEF will lead a two-year global initiative with MINDS 2025 honorees to jointly advance key agendas such as AI governance, sustainable supply chains, digital health, and future infrastructure. DEEPX will participate as an official member of this international network — working with governments, academia, and corporations worldwide to build a more sustainable and responsible AI ecosystem.

    About DEEPX

    Founded in anticipation of an era when artificial intelligence will be as pervasive as electricity and Wi-Fi, DEEPX develops core technology for high-performance AI semiconductors and computing solutions that bring intelligence to electronic devices. DEEPX currently holds over 400 patents pending in the U.S., China, and Korea—one of the largest patent portfolios in the world for on-device AI chip development.

SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Ultra-low-power AI semiconductor company DEEPX (CEO Lokwon Kim) announced that it was an official speaker at the New Drivers of Industry Transformation Meeting 2025 hosted by the World Economic Forum (WEF), where it shared its vision for 'Physical AI' alongside the world's top innovation leaders.

The WEF selected DEEPX as the first AI semiconductor company to receive the MINDS 2025 Award (Meaningful, Intelligent, Novel, Deployable Solutions), which recognizes technologies that are transforming the world through AI. The forum served as the official platform for award winners to present their achievements to global policymakers and industry leaders.

The session featured MINDS Award honorees including Foxconn, CATL, Siemens, Lenovo, Fujitsu, and Schneider Electric, each showcasing groundbreaking use cases of AI driving transformation across their respective industries.

DEEPX presented its collaborative mass-production project with the Hyundai Motor Group Robotics Lab, demonstrating a robot AI solution that achieves more than two times a GPU's level of performance while consuming less than 5 watts of power. The project highlighted one of Korea's most advanced examples of AI commercialization — bringing to life the concept of 'Physical AI,' or intelligence that operates directly in the physical world across industrial, robotics, security, and smart city environments.

This achievement drew significant global attention from the manufacturing and robotics sectors for its breakthroughs in energy efficiency, cost reduction, and system optimization, marking a milestone for Korea's AI semiconductor competitiveness on the global stage.

DEEPX also unveiled its roadmap for next-generation generative AI semiconductors based on the Samsung 2 nm process, outlining how its proprietary architecture will accelerate the realization of 'Physical AI' in real-world applications.

"AI must evolve beyond the data center and become physical intelligence — a real-world force transforming industries and societies," said Lokwon Kim, CEO of DEEPX. "Through ultra-low-power, high-performance AI semiconductors, DEEPX is already creating tangible value across robots, factories, cities, and even human lives. WEF's recognition reaffirms that DEEPX's AI semiconductor technology now stands at the center of the world's industrial transformation."

Going forward, the WEF will lead a two-year global initiative with MINDS 2025 honorees to jointly advance key agendas such as AI governance, sustainable supply chains, digital health, and future infrastructure. DEEPX will participate as an official member of this international network — working with governments, academia, and corporations worldwide to build a more sustainable and responsible AI ecosystem.

About DEEPX

Founded in anticipation of an era when artificial intelligence will be as pervasive as electricity and Wi-Fi, DEEPX develops core technology for high-performance AI semiconductors and computing solutions that bring intelligence to electronic devices. DEEPX currently holds over 400 patents pending in the U.S., China, and Korea—one of the largest patent portfolios in the world for on-device AI chip development.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

DEEPX Unveils 'Physical AI' Vision at World Economic Forum

DEEPX Unveils 'Physical AI' Vision at World Economic Forum

SHANGHAI, April 1, 2026 /PRNewswire/ -- Smartee Denti-Technology today announced the addition of Material Choice and Trimline Selection features to its digital case management system SmarteeCheck. Available immediately at the case approval stage, these updates provide clinicians with greater flexibility to further customize treatment plans based on personal preferences and dental condition of individual patients.

Material Choice: Balancing Precision and Comfort

Clinicians can now select between Softer and Standard dental sheets when approving a case. This dual-option approach addresses the advanced clinical understanding that different phases of tooth movement require different mechanical properties.

Smartee's Softer material is suited for treatment stages where patient comfort and initial compliance are priorities, while the Standard material provides the sustained force expression needed for robust control. This functionality allows clinicians to select the appropriate material for each treatment phase without having to switch aligner systems.

Trimline Selection: Evidence from Industry Studies

The update also allows clinicians to choose from three distinct trimline styles at case approval: Classic Scalloped, Scalloped Extended, and Straight.

This feature aligns with recent clinical studies on aligner biomechanics and aesthetics. A systematic review published in BMC Oral Health noted that trimline design influences orthodontic tooth movement efficacy by affecting force delivery and aligner retention. Additionally, an eye-tracking study in the American Journal of Orthodontics and Dentofacial Orthopedics (AJODO) confirmed that different trimline designs impact how aligners are visually perceived.

To meet diverse clinical requirements, the system offers:

  • Classic Scalloped Trimline: Precisely conforms to the gingival margin for improved aesthetics and comfort.
  • Scalloped Extended Trimline: Extends beyond the margin to enlarge the surface area in the maxillary posterior buccal region for enhanced retention.
  • Straight Trimline: A straight horizontal trimming at the gingival zenith, delivering maximum retention force.

Clinical Flexibility
While some clear aligner systems offer a single standard trimline, Smartee's update enables doctors to easily toggle between three distinct styles at case approval. This supports personalized treatment planning by allowing orthodontists to balance retention, force control, and gingival aesthetics according to each patient's specific clinical profile.

Availability
The Material Choice and Trimline Selection features are available globally starting March 31, 2026, for all new case approvals through Smartee's digital case management system.

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

Smartee Introduces Material and Trimline Selection Features to Enhance Aligner Customization

Smartee Introduces Material and Trimline Selection Features to Enhance Aligner Customization

Smartee Introduces Material and Trimline Selection Features to Enhance Aligner Customization

Smartee Introduces Material and Trimline Selection Features to Enhance Aligner Customization

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