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Amcor Lift-Off to accelerate more sustainable packaging innovation with Winter 2025/26 Challenge

Business

Amcor Lift-Off to accelerate more sustainable packaging innovation with Winter 2025/26 Challenge
Business

Business

Amcor Lift-Off to accelerate more sustainable packaging innovation with Winter 2025/26 Challenge

2025-11-19 00:05 Last Updated At:00:25

ZURICH, Nov. 19, 2025 /PRNewswire/ -- Amcor (NYSE: AMCR, ASX: AMC), a global leader in developing and producing responsible packaging solutions, announced today the launch of the Amcor Lift-Off Winter 2025/26 Challenge. The initiative invites start-ups worldwide to collaborate on breakthrough solutions for more sustainable packaging, reflecting Amcor's commitment to open innovation and advancing circularity.

Building on the success of previous Amcor Lift-Off editions that have fostered partnerships and investments with pioneering companies in areas such as artificial intelligence-powered waste analytics, reusable packaging and bio-based materials, the Amcor Lift-Off Winter 2025/26 Challenge will focus on critical research and development priorities for flexible and paper-based packaging. Start-ups are encouraged to submit solutions that address one of three key areas:

  • Home-compostable adhesives: Certified home-compostable adhesives for flexible packaging providing robust bond strength, regulatory compliance and compatibility with paper and compostable substrates.
  • High-performance compostable oxygen transmission rate (OTR) barriers: Solutions delivering outstanding OTR protection for paper packaging that are suitable for application via dispersion coating and meet stringent sustainability and regulatory standards.
  • Nature-based barrier additives for film formulation: Compostable additives that significantly enhance oxygen, moisture and grease resistance in packaging films, preferably derived from natural products and scalable for commercial use.

The Amcor Lift-Off Winter 2025/26 challenge will proceed in three phases:

  • Applications: Open online until Dec. 12, 2025 (23:59 CET)
  • Screening and feedback: Through Dec. 19, 2025
  • Pitching day: Jan. 13, 2026 (virtual)

Incorporated companies with a Technology Readiness Level (TRL) above five are encouraged to apply, regardless of prior funding history. Selected start-ups will be invited to present their technologies to Amcor's R&D team, for the chance to secure opportunities for joint development and potential investment of up to $500,000.

"As a global leader in packaging, we are proud to champion circularity through innovative and more sustainable solutions," said Frank Lehmann, Vice President Corporate Venturing and Open Innovation at Amcor. "The Lift-Off initiative has delivered outstanding results, and we are eager to carry this success forward. With the launch of our new initiative, we reaffirm Amcor's dedication to advancing circularity and environmental responsibility through collaboration with the brightest minds in the start-up ecosystem."

For more information about Amcor Lift-Off and the Winter 2025/26 Challenge, or to submit your start-up's free-of-charge application, visit Amcor Ventures.

About Amcor

Amcor is the global leader in developing and producing responsible consumer packaging and dispensing solutions across a variety of materials for nutrition, health, beauty and wellness categories. Our global product innovation and sustainability expertise enables us to solve packaging challenges around the world every day, producing a range of flexible packaging, rigid packaging, cartons and closures that are more sustainable, functional and appealing for our customers and their consumers. We are guided by our purpose of elevating customers, shaping lives and protecting the future. Supported by a commitment to safety, over 75,000 people generate $23 billion in annualized sales from operations that span over 400 locations in more than 40 countries. NYSE: AMCR; ASX: AMC

www.amcor.com | LinkedIn | YouTube 

 

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

Amcor Lift-Off to accelerate more sustainable packaging innovation with Winter 2025/26 Challenge

Amcor Lift-Off to accelerate more sustainable packaging innovation with Winter 2025/26 Challenge

  • Company named "Best Financially Managed Semiconductor Company (Achieving Greater than $1 Billion in Annual Sales)" and "Outstanding Asia-Pacific Semiconductor Company" simultaneously
  • Accelerates recovery from market downturn leveraging world-class HBM leadership; Global management performance recognized
  • Reflects company's technology leadership and customer-centric execution
  • SK Chairman Chey Tae-won emphasizes: "Technological competitiveness must remain unwavering in challenging times"
  • Commits to driving new customer value and leading global AI market growth as a "Full-Stack AI Memory Creator"
  • SEOUL, South Korea, Dec. 7, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has been named the winner of the Best Financially Managed Semiconductor Company Award (Achieving Greater than $1 Billion in Annual Sales)[1] and the Outstanding Asia-Pacific Semiconductor Company Award[2] at the Global Semiconductor Alliance (GSA)[3] Awards 2025, held on December 4 PST in Santa Clara, California.

    [1]The Best Financially Managed Semiconductor Company Award: A category recognizing public semiconductor companies based on financial soundness and operational efficiency. Awards are presented in two categories  annual sales over $1 billion and annual sales under $1 billion  and are considered among the most authoritative honors in the global semiconductor industry.

    [2]Outstanding Asia-Pacific Semiconductor Company Award: A special category recognizing semiconductor companies headquartered in the Asia-Pacific region based on comprehensive evaluations including product excellence, business vision, leadership, and market success.

    [3]GSA(Global Semiconductor Alliance): A global CEO-level semiconductor organization serving as a hub for technological information sharing across more than 25 countries and over 250 corporate members.

    The GSA Awards, organized annually since 1996, are regarded as the most prestigious honors in the global semiconductor sector, recognizing outstanding performance in leadership, financial results and industry reputation. SK hynix secured its second win in the financial management category following 2017, and its first recognition as the top Asia-Pacific semiconductor company. The dual achievement reinforces the company's reputation as a leading global technology innovator.

    While the semiconductor industry faced a severe downturn just two years ago, the company has been the fastest to rebound thanks to its advanced AI memory technologies including HBM. This performance has resulted in global recognition for its operational excellence and financial execution. SK hynix plans to continue building sustainable growth with its dominant leadership in the AI memory market.

    The awards reflect the company's proactive delivery of groundbreaking HBM solutions and its steadfast commitment to customer-centric performance in surging global AI demand. SK Chairman Chey Tae-won has consistently emphasized that securing technological competitiveness must remain unwavering, especially during challenging times. This long-term focus on technology investment and global cooperation network has contributed to the company's improved performance and reinforced financial health.

    Driven by this strategy, SK hynix has recorded historic performance throughout 2025. For the first three quarters, the company reported revenue of 64 trillion won and operating profit of 28 trillion won in total, positioning it well to surpass its previous full-year earnings record set in 2024 (66 trillion won in revenue and 23 trillion won in operating profit).

    Financial health has also significantly strengthened. As of the end of the third quarter, cash and cash equivalents reached 27.9 trillion won, up 10.9 trillion won quarter-over-quarter, while interest bearing debt decreased to 24.1 trillion won— successfully transitioning into a net cash position of approximately 4 trillion won.

    To secure long-term leadership in AI memory, SK hynix is accelerating major investments. The Cheongju M15X fab, which opened its cleanroom earlier than planned in October, is on track to begin HBM mass production in the first half of next year. Construction of the first fab in the Yongin Semiconductor Cluster, launched in February, is also progressing ahead of schedule.

    With its recent financial achievements and continued expansion, SK hynix is expected to further solidify its AI memory leadership going forward.

    SK hynix was represented at the ceremony by Justin Kim, President & Head of AI Infra at SK hynix, and Sungsoo Ryu, President of SK hynix America. "It is a great honor to receive this award." Kim said, "We will continue to lead the market and create new value for customers as a Full-Stack AI Memory Creator, driving growth across the global AI ecosystem."

    About SK hynix Inc.

    SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.comnews.skhynix.com.

SEOUL, South Korea, Dec. 7, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has been named the winner of the Best Financially Managed Semiconductor Company Award (Achieving Greater than $1 Billion in Annual Sales)[1] and the Outstanding Asia-Pacific Semiconductor Company Award[2] at the Global Semiconductor Alliance (GSA)[3] Awards 2025, held on December 4 PST in Santa Clara, California.

[1]The Best Financially Managed Semiconductor Company Award: A category recognizing public semiconductor companies based on financial soundness and operational efficiency. Awards are presented in two categories  annual sales over $1 billion and annual sales under $1 billion  and are considered among the most authoritative honors in the global semiconductor industry.

[2]Outstanding Asia-Pacific Semiconductor Company Award: A special category recognizing semiconductor companies headquartered in the Asia-Pacific region based on comprehensive evaluations including product excellence, business vision, leadership, and market success.

[3]GSA(Global Semiconductor Alliance): A global CEO-level semiconductor organization serving as a hub for technological information sharing across more than 25 countries and over 250 corporate members.

[1]The Best Financially Managed Semiconductor Company Award: A category recognizing public semiconductor companies based on financial soundness and operational efficiency. Awards are presented in two categories  annual sales over $1 billion and annual sales under $1 billion  and are considered among the most authoritative honors in the global semiconductor industry.

[2]Outstanding Asia-Pacific Semiconductor Company Award: A special category recognizing semiconductor companies headquartered in the Asia-Pacific region based on comprehensive evaluations including product excellence, business vision, leadership, and market success.

[3]GSA(Global Semiconductor Alliance): A global CEO-level semiconductor organization serving as a hub for technological information sharing across more than 25 countries and over 250 corporate members.

The GSA Awards, organized annually since 1996, are regarded as the most prestigious honors in the global semiconductor sector, recognizing outstanding performance in leadership, financial results and industry reputation. SK hynix secured its second win in the financial management category following 2017, and its first recognition as the top Asia-Pacific semiconductor company. The dual achievement reinforces the company's reputation as a leading global technology innovator.

While the semiconductor industry faced a severe downturn just two years ago, the company has been the fastest to rebound thanks to its advanced AI memory technologies including HBM. This performance has resulted in global recognition for its operational excellence and financial execution. SK hynix plans to continue building sustainable growth with its dominant leadership in the AI memory market.

The awards reflect the company's proactive delivery of groundbreaking HBM solutions and its steadfast commitment to customer-centric performance in surging global AI demand. SK Chairman Chey Tae-won has consistently emphasized that securing technological competitiveness must remain unwavering, especially during challenging times. This long-term focus on technology investment and global cooperation network has contributed to the company's improved performance and reinforced financial health.

Driven by this strategy, SK hynix has recorded historic performance throughout 2025. For the first three quarters, the company reported revenue of 64 trillion won and operating profit of 28 trillion won in total, positioning it well to surpass its previous full-year earnings record set in 2024 (66 trillion won in revenue and 23 trillion won in operating profit).

Financial health has also significantly strengthened. As of the end of the third quarter, cash and cash equivalents reached 27.9 trillion won, up 10.9 trillion won quarter-over-quarter, while interest bearing debt decreased to 24.1 trillion won— successfully transitioning into a net cash position of approximately 4 trillion won.

To secure long-term leadership in AI memory, SK hynix is accelerating major investments. The Cheongju M15X fab, which opened its cleanroom earlier than planned in October, is on track to begin HBM mass production in the first half of next year. Construction of the first fab in the Yongin Semiconductor Cluster, launched in February, is also progressing ahead of schedule.

With its recent financial achievements and continued expansion, SK hynix is expected to further solidify its AI memory leadership going forward.

SK hynix was represented at the ceremony by Justin Kim, President & Head of AI Infra at SK hynix, and Sungsoo Ryu, President of SK hynix America. "It is a great honor to receive this award." Kim said, "We will continue to lead the market and create new value for customers as a Full-Stack AI Memory Creator, driving growth across the global AI ecosystem."

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.comnews.skhynix.com.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

SK hynix Honored with Two Major Titles at GSA Awards 2025

SK hynix Honored with Two Major Titles at GSA Awards 2025

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