YANTAI, China, Dec. 9, 2025 /PRNewswire/ -- On December 7, Linglong Tire convened its 50th Anniversary Global Partners Conference in Zhaoyuan, Shandong, under the theme "Linglong 50, Always Forward". The gathering brought together industry leaders, academic experts, and global partners to reflect on the company's half-century of growth and outline a forward-looking strategy aimed at sustainable innovation and collaborative value creation.
In his keynote speech, Chairman Wang Feng chronicled Linglong's evolution since its founding in 1975. From its origins as a single factory in the Jiaodong Peninsula, the company has navigated multiple strategic transformations to become a global enterprise with products distributed across 173 countries. Wang expressed gratitude to academic advisors, university partners, financial institutions, suppliers, and clients, emphasizing that Linglong's milestones were made possible by a foundation of mutual trust and collaboration.
Looking ahead, Wang Feng articulated Linglong's ambition to transition from a "large enterprise" to a "great enterprise," anchored in a customer-first philosophy. The company will focus on building an open, inclusive, and synergistic global industrial ecosystem, fostering deeper cooperation across the value chain through technological innovation.
The conference featured high-level dialogues on green and intelligent transformation within the tire industry. Distinguished guests, including Serbian Ambassador to China Maja Stefanović and academician Zhang Liqun, praised Linglong's role in promoting international cooperation and technological progress. During an awards ceremony, Linglong honored long-term partners such as Bekaert and VMI for their unwavering support.
A series of technological achievements were unveiled, highlighting Linglong's commitment to sustainable development:
- Tires made with 79% bio-based materials, boosting resource efficiency;
- Self-healing smart tires that enhance proactive safety;
- Air-free tire technology for future mobility ecosystems;
- An intelligent self-repairing system that elevates tire safety to new heights.
These innovations reflect Linglong's capacity to turn sustainability commitments into tangible products.
The company also signed multiple strategic agreements with leading institutions. These collaborations—spanning new materials, green energy, and digitalization—signal a shift from traditional supply-chain relations to an integrated value-creation ecosystem.
As Linglong embarks on its next chapter, the company reaffirmed its dedication to quality, innovation, and social responsibility. By strengthening global partnerships and embracing an open industrial ecosystem, Linglong aims to overcome future challenges and lead the tire industry toward a more sustainable and brilliant century. Through this conference, Linglong Tire demonstrated not only its historic achievements and innovative strength but also a clear roadmap for long-term, collaborative growth.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Linglong Tire Holds 50th Anniversary Global Partners Conference, Unveiling Green-Tech Innovations and Future Strategy
TAIPEI, Dec. 9, 2025 /PRNewswire/ --
Data Center AI Chip Shipments Continue to Grow
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips (such as Google's TPUs), AI server CPUs, and networking/interconnect-related chips (e.g., Switch ASICs/rack-scale-up Interconnect Chips/DPUs & NICs).
In terms of growth rate, the fastest-growing segments by shipment volume include application-specific AI chips, mid-range GPUs that use GDDR DRAM (such as Nvidia CPX GPUs), and interconnect-related chips, such as NVSwitch ICs. Among these five chip categories, the shipment volume growth rates for high-end GPUs and AI server CPUs are relatively lower over the 2024–2030 period, with a Compound Annual Growth Rate (CAGR) of only about 10%. However, when considering the revenue from high-end packaging and end-market sales, the growth rate will be much higher than the shipment growth rate. The main reasons for this include the increased content value per chip and the adoption of advanced packaging.
For example, AMD recently forecast that the global server CPU revenue Total Addressable Market (TAM) CAGR will reach 18% between 2025 and 2030 (implying that the Average Selling Price CAGR for server CPUs could exceed 7% due to the jump in core count and the adoption of more advanced processes and packaging). For GPUs, despite relatively moderate growth in shipments, wafer foundry and packaging revenue CAGRs are both expected to exceed 40% in 2024-2030, driven by the increasing number of GPU and I/O dies per chip.
Data Center AI Chip Packaging Revenue Remains Focused on GPUs
Recently, application-specific AI chips like Google's TPU and AWS's Trainium have garnered significant attention for their tailored power-efficiency characteristics, sparking speculation that they might replace GPUs. According to the latest "Global Data Center AI Chip Packaging Market Forecast 2024-2030" report published by DIGITIMES Asia, the overall revenue share of data center AI chip packaging will remain GPU-centric throughout the 2024–2030 forecast period. It is estimated that by 2030, packaging revenue for data center GPUs will remain over 40% higher than that of application-specific AI chips.
While AI server CPUs and AI networking-related chips have high shipment volumes, the high-end packaging market will still be overwhelmingly dominated by GPUs and application-specific AI chips.
Drivers and Inhibitors for Advanced Packaging of Data Center AI Chips
DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%. This aligns closely with AMD's recent Financial Analyst Day estimate that the global Data Center TAM CAGR will exceed 40% over the next five years.
Here is a summary of the main drivers and inhibitors for the global market for advanced packaging of data center AI chips:
Key Drivers:
- The AI wave and the compute power arms race among tech giants.
- Advanced packaging driving system-level scaling to extend Moore's Law.
- Geopolitical competition between the U.S. and China, and the rise of Sovereign AI initiatives.
Key Inhibitors:
- The re-evaluation of return on investment (ROI) relative to massive computing power investments.
- The impact of cheaper and more efficient new technologies.
For more details on AI Chip, and the future outlook for major AI chip packaging technologies in data centers, check out: AI Chip packaging https://www.digitimes.com/reports/ai/2025_ai_chip_packaging
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
