|
DUBAI, UAE, Dec. 9, 2025 /PRNewswire/ -- At the BIG Series Institutional Gala, Bybit Institutional introduced two major upgrades set to redefine the standards of institutional digital asset trading in 2025: an expanded INS Credit Suite and a fully redesigned Market Maker Gateway (MMGW) low-latency execution environment.
The announcements were led by Yoyee Wang, Head of Business to Business of Bybit, who outlined Bybit's integrated institutional blueprint — combining custody, credit, execution, governance, and operational resiliency into one cohesive platform.
Reinventing Institutional Credit
Yoyee highlighted that Bybit's upgraded INS Credit Suite now delivers one of the most advanced and transparent credit environments available to institutional clients.
"Across the industry, one theme is clear: institutions want capital efficiency without compromising control. With up to 5× leverage, TradFi-aligned LTV parameters, and support for 1,000 sub-accounts, we're delivering a true institutional-grade credit architecture," added Yoyee.
The demand reinforces that shift. Bybit's INS loan notional reached USD 1.1 billion this quarter, marking a 26% QoQ increase, driven by active adoption from professional trading firms.
Custody + RWA + Credit: A New Operating Model for Institutions
A headline announcement of Yoyee's presentation was the integration of custody-based RWA tokens into Bybit's off-exchange credit infrastructure — a first-of-its-kind development for digital asset markets.
"For the first time, institutions can keep assets in custody, earn returns through tokenized money-market RWAs, and still unlock institutional credit. It combines control, transparency, and efficiency in a way the market has not seen before," said Yoyee.
This model connects regulated custody, yield, and capital deployment into a single operational workflow — eliminating fragmentation and unlocking new efficiencies for asset managers and trading firms.
A Leap in Execution: Round-Trip Latency Cut from 30ms to 2.5ms
The second major upgrade unveiled was Bybit's next-generation Market Maker Gateway (MMGW) execution architecture, engineered specifically for institutional consistency and predictability.
Yoyee announced that Bybit has brought round-trip latency for INS clients down to 5 milliseconds through its new MMGW architecture, with a next-generation 2.5-millisecond execution channel planned for release in 2026.
"Speed alone isn't the breakthrough — certainty is," she said. "We engineered an execution lane designed for institutional performance: consistent, stable, and resistant to noise."
A Unified Institutional Vision for 2026
Yoyee closed by underscoring Bybit's dedication to shaping the industry's most complete and future-ready institutional ecosystem.
'At Bybit, our philosophy is simple: listen, care, improve. Today's innovations reflect our focus on delivering smarter credit and faster execution — and we are just getting started.'
#Bybit / #CryptoArk
About Bybit
Bybit is the world's second-largest cryptocurrency exchange by trading volume, serving a global community of over 70 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.
For more details about Bybit, please visit Bybit Press
For media inquiries, please contact: media@bybit.com
For updates, please follow: Bybit's Communities and Social Media
Discord | Facebook | Instagram | LinkedIn | Reddit | Telegram | TikTok | X | Youtube
DUBAI, UAE, Dec. 9, 2025 /PRNewswire/ -- At the BIG Series Institutional Gala, Bybit Institutional introduced two major upgrades set to redefine the standards of institutional digital asset trading in 2025: an expanded INS Credit Suite and a fully redesigned Market Maker Gateway (MMGW) low-latency execution environment.
The announcements were led by Yoyee Wang, Head of Business to Business of Bybit, who outlined Bybit's integrated institutional blueprint — combining custody, credit, execution, governance, and operational resiliency into one cohesive platform.
Reinventing Institutional Credit
Yoyee highlighted that Bybit's upgraded INS Credit Suite now delivers one of the most advanced and transparent credit environments available to institutional clients.
"Across the industry, one theme is clear: institutions want capital efficiency without compromising control. With up to 5× leverage, TradFi-aligned LTV parameters, and support for 1,000 sub-accounts, we're delivering a true institutional-grade credit architecture," added Yoyee.
The demand reinforces that shift. Bybit's INS loan notional reached USD 1.1 billion this quarter, marking a 26% QoQ increase, driven by active adoption from professional trading firms.
Custody + RWA + Credit: A New Operating Model for Institutions
A headline announcement of Yoyee's presentation was the integration of custody-based RWA tokens into Bybit's off-exchange credit infrastructure — a first-of-its-kind development for digital asset markets.
"For the first time, institutions can keep assets in custody, earn returns through tokenized money-market RWAs, and still unlock institutional credit. It combines control, transparency, and efficiency in a way the market has not seen before," said Yoyee.
This model connects regulated custody, yield, and capital deployment into a single operational workflow — eliminating fragmentation and unlocking new efficiencies for asset managers and trading firms.
A Leap in Execution: Round-Trip Latency Cut from 30ms to 2.5ms
The second major upgrade unveiled was Bybit's next-generation Market Maker Gateway (MMGW) execution architecture, engineered specifically for institutional consistency and predictability.
Yoyee announced that Bybit has brought round-trip latency for INS clients down to 5 milliseconds through its new MMGW architecture, with a next-generation 2.5-millisecond execution channel planned for release in 2026.
"Speed alone isn't the breakthrough — certainty is," she said. "We engineered an execution lane designed for institutional performance: consistent, stable, and resistant to noise."
A Unified Institutional Vision for 2026
Yoyee closed by underscoring Bybit's dedication to shaping the industry's most complete and future-ready institutional ecosystem.
'At Bybit, our philosophy is simple: listen, care, improve. Today's innovations reflect our focus on delivering smarter credit and faster execution — and we are just getting started.'
#Bybit / #CryptoArk
About Bybit
Bybit is the world's second-largest cryptocurrency exchange by trading volume, serving a global community of over 70 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.
For more details about Bybit, please visit Bybit Press
For media inquiries, please contact: media@bybit.com
For updates, please follow: Bybit's Communities and Social Media
Discord | Facebook | Instagram | LinkedIn | Reddit | Telegram | TikTok | X | Youtube
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Bybit Institutional Head Unveils New Institutional Credit Architecture and Ultra-Low-Latency Execution Layer
TAIPEI, Dec. 9, 2025 /PRNewswire/ --
Data Center AI Chip Shipments Continue to Grow
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips (such as Google's TPUs), AI server CPUs, and networking/interconnect-related chips (e.g., Switch ASICs/rack-scale-up Interconnect Chips/DPUs & NICs).
In terms of growth rate, the fastest-growing segments by shipment volume include application-specific AI chips, mid-range GPUs that use GDDR DRAM (such as Nvidia CPX GPUs), and interconnect-related chips, such as NVSwitch ICs. Among these five chip categories, the shipment volume growth rates for high-end GPUs and AI server CPUs are relatively lower over the 2024–2030 period, with a Compound Annual Growth Rate (CAGR) of only about 10%. However, when considering the revenue from high-end packaging and end-market sales, the growth rate will be much higher than the shipment growth rate. The main reasons for this include the increased content value per chip and the adoption of advanced packaging.
For example, AMD recently forecast that the global server CPU revenue Total Addressable Market (TAM) CAGR will reach 18% between 2025 and 2030 (implying that the Average Selling Price CAGR for server CPUs could exceed 7% due to the jump in core count and the adoption of more advanced processes and packaging). For GPUs, despite relatively moderate growth in shipments, wafer foundry and packaging revenue CAGRs are both expected to exceed 40% in 2024-2030, driven by the increasing number of GPU and I/O dies per chip.
Data Center AI Chip Packaging Revenue Remains Focused on GPUs
Recently, application-specific AI chips like Google's TPU and AWS's Trainium have garnered significant attention for their tailored power-efficiency characteristics, sparking speculation that they might replace GPUs. According to the latest "Global Data Center AI Chip Packaging Market Forecast 2024-2030" report published by DIGITIMES Asia, the overall revenue share of data center AI chip packaging will remain GPU-centric throughout the 2024–2030 forecast period. It is estimated that by 2030, packaging revenue for data center GPUs will remain over 40% higher than that of application-specific AI chips.
While AI server CPUs and AI networking-related chips have high shipment volumes, the high-end packaging market will still be overwhelmingly dominated by GPUs and application-specific AI chips.
Drivers and Inhibitors for Advanced Packaging of Data Center AI Chips
DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%. This aligns closely with AMD's recent Financial Analyst Day estimate that the global Data Center TAM CAGR will exceed 40% over the next five years.
Here is a summary of the main drivers and inhibitors for the global market for advanced packaging of data center AI chips:
Key Drivers:
- The AI wave and the compute power arms race among tech giants.
- Advanced packaging driving system-level scaling to extend Moore's Law.
- Geopolitical competition between the U.S. and China, and the rise of Sovereign AI initiatives.
Key Inhibitors:
- The re-evaluation of return on investment (ROI) relative to massive computing power investments.
- The impact of cheaper and more efficient new technologies.
For more details on AI Chip, and the future outlook for major AI chip packaging technologies in data centers, check out: AI Chip packaging https://www.digitimes.com/reports/ai/2025_ai_chip_packaging
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
