NEW YORK, Jan. 26, 2026 /PRNewswire/ -- Chaos Labs today launched Chaos Vaults, an AI-powered platform bringing a more disciplined, risk-aware approach to onchain yield for exchanges and institutions.
Chaos Vaults is now live on Kraken DeFi Earn, delivering real-time risk visibility and automated yield strategies to users across the U.S., Canada, and Europe.
The launch builds on Chaos Labs' risk and data systems, which have powered more than $5 trillion in transaction volume across major onchain protocols, including Aave, Ethena, and Pendle.
Until now, exchanges and institutions have lacked a way to deploy onchain yield strategies with continuous risk controls and operational visibility at production scale. Chaos Vaults brings institutional discipline to vault design, aligning onchain yield with the operational expectations of large-scale capital allocators.
Chaos Vaults delivers the following capabilities:
- Unified Strategy + Risk System: Execution, data, and risk analytics operate in a single system for tighter feedback loops and capital efficiency.
- AI-Powered Portfolio Analytics: Real-time monitoring of exposure, risk, and performance helps reduce operational overhead.
- Multi-Venue Optimization: Dynamic allocation across onchain markets and venues as risk constraints and market conditions change.
"Chaos Vaults gives institutions a way to manage yield as markets evolve block by block," said Omer Goldberg, Founder and CEO of Chaos Labs. "Launching with Kraken's DeFi Earn puts this into production for millions of global users."
"We built DeFi Earn to remove the friction that's held DeFi back—no technical setup, no confusing workflows," said John Zettler, Director of Product Management at Kraken. "By integrating risk-managed vaults from partners like Chaos Labs, we're giving users a simple, transparent way to access real-world opportunities in today's onchain markets."
Learn more at chaoslabs.xyz/vaults
About Chaos Labs
Chaos Labs builds financial AI products that power safer, more accessible markets. Its risk management systems, vaults, oracles, and AI platform secure hundreds of billions in value. Since its founding in 2021, Chaos Labs has set the industry standard for onchain risk management.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Chaos Labs Launches AI-Powered Yield Platform on Kraken's DeFi Earn
SHENZHEN, China, Jan. 26, 2026 /PRNewswire/ -- JarnisTech, a specialized PCB manufacturing and assembly provider, today announced the comprehensive qualification of its Hybrid Lamination Solution. This upgraded capability enables the reliable integration of high-frequency materials (such as Rogers or Taconic) with standard FR-4 within a single multilayer board, directly addressing the cost pressures of mass-market 5G infrastructure.
By optimizing the ratio of expensive high-speed laminates to standard epoxy glass, the solution allows telecom manufacturers to reduce bare board Bill of Materials (BOM) costs by approximately 30-40% for antenna modules and base stations, without sacrificing RF performance.
Overcoming CTE Mismatch in Heterogeneous Stacks
Hybrid construction has historically faced yield challenges due to the Coefficient of Thermal Expansion (CTE) mismatch between advanced low-loss materials (often PTFE-based) and standard FR-4.
JarnisTech's approach mitigates these risks through a proprietary "Dynamic Pressure Profiling" technique. By strictly controlling thermal ramp-up rates and pressure dwell times, the process synchronizes the curing behavior of disparate materials, preventing common defects such as delamination and registration shift.
"The primary obstacle in hybrid manufacturing is managing the rheology difference between high-frequency resins and standard epoxies," said Jason Chen, Technical Director at JarnisTech. "Through predictive scaling factors and optimized lamination cycles, we can now bond these dissimilar materials while maintaining the strict flatness requirements needed for high-density BGA assembly."
Key Technical Validations:
- Enhanced Adhesion: Implementation of plasma surface treatment to activate the inert surface of PTFE materials prior to bonding, ensuring structural integrity under thermal stress.
- Advanced Layer Alignment: Utilization of non-linear scaling compensation (X-ray optimization) to achieve high-precision layer-to-layer registration, critical for the high-density interconnects in 5G AAUs.
- Signal Integrity: Verified impedance control tolerance of ±8% on hybrid interfaces, ensuring minimal insertion loss at material transitions.
Optimizing Design for Cost and Performance
This capability provides a tangible competitive advantage for telecom OEMs. It allows designers to isolate expensive materials solely for critical RF signal layers while utilizing cost-effective FR-4 for power, ground, and digital control layers.
JarnisTech is now accepting technical inquiries for hybrid design reviews. The company offers complimentary DFM (Design for Manufacturing) analysis to assist clients in converting fully high-frequency designs into cost-optimized hybrid structures.
About JarnisTech
JarnisTech, founded in 2002, has grown to become one of China's largest and most experienced PCB manufacturers. With over two decades of experience in the development, manufacturing, assembly, and testing of custom printed circuit boards, we can now offer a full range of services, including rapid PCB prototyping, circuit board manufacturing, PCB assembly, and component sourcing, all at a guaranteed quality and cost-effective price.
Contact for the press
Cyndi Xiong
Marketing manager
JarnisTech
Phone: +86 135 3094 7255
Email: sales@jarnistech.com
Learn more at www.jarnistech.com
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs
