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LEPAS Ships LEPAS L4 to South Africa, Accelerating Global Market Expansion

Business

LEPAS Ships LEPAS L4 to South Africa, Accelerating Global Market Expansion
Business

Business

LEPAS Ships LEPAS L4 to South Africa, Accelerating Global Market Expansion

2026-01-28 23:10 Last Updated At:23:25

TAICANG, China, Jan. 28, 2026 /PRNewswire/ -- On January 26, the all-new NEV brand LEPAS completed its export shipment at Taicang Port. The first batch of over 500 LEPAS L4 vehicles was officially loaded and shipped to Durban Port, South Africa.

South Africa is one of the key hubs in Africa's vehicle market and also one of the world's major right-hand-drive markets. With its well-developed ports and logistics networks, the country serves as an important gateway for overseas brands expanding into Africa. The LEPAS L4 in this shipment is built on Chery Group's all-new LEX intelligent platform, measuring 4,400 × 1,820 × 1,635 mm with a wheelbase of 2,700 mm. From the consumer perspective, the LEPAS L4 aligns with the global automotive market's ongoing transition toward new energy, meeting potential demand for high-quality NEVs. From the brand perspective, this shipment also signifies that LEPAS's products are fully prepared to deliver an elegant driving and handling experience for users with diverse driving habits, even under complex road conditions. By collecting real-world feedback, LEPAS will progressively refine its products and service systems, laying the groundwork for further market expansion and brand development.

Following the arrival of the first batch at Durban Port, LEPAS will use South Africa as a strategic hub to expand other markets, leveraging the country's mature vehicle distribution system, ports, and logistics networks. While consolidating its own advantages, LEPAS will continue to implement the Group's "In Somewhere, For Somewhere, Be Somewhere" strategy, focusing on localized operations and product innovation to deliver more intelligent and more elegant NEV mobility solutions for local consumers.

South Africa is just the starting point for LEPAS's global expansion. The brand will continue to introduce its products, networks, brand presence, and after-sales services across countries and continents, bringing its philosophy of elegant lifestyle, supporting infrastructure, cutting-edge NEV technologies, and employment opportunities related to the new energy vehicle industry to the world, positioning itself as a long-term contributor to the global NEV mobility ecosystem.

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** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

LEPAS Ships LEPAS L4 to South Africa, Accelerating Global Market Expansion

LEPAS Ships LEPAS L4 to South Africa, Accelerating Global Market Expansion

TAIPEI, Jan. 28, 2026 /PRNewswire/ -- GIGABYTE, the world's leading computer brand, proudly announces the availability of its flagship X870E AORUS XTREME X3D AI TOP motherboard after its debut alongside the X3D series in September. This model is designed to level up performance for AMD Ryzen X3D processors, featuring X3D Turbo Mode 2.0, powered by a built-in dynamic AI overclocking model and hardware chip, and equipped with GIGABYTE's D5 Bionic Corsa to unleash DDR5 performance. By leveraging advanced AI technology, XTREME cooling solution, and enhanced DIY-friendly design, as the flagship, the X870E AORUS XTREME X3D AI TOP integrates the newest, industry-defining capabilities to deliver uncompromising performance for PC enthusiasts.

At the core of this motherboard, X3D Turbo Mode 2.0, is powered by a dynamic AI overclocking model and hardware chip to adjust voltage, frequency, and temperature in real time. Resulting in a up to 25% significant performance enhancement for AMD Ryzen X3D processors in gaming and multi-tasking. While equipped with the revolutionary D5 Bionic Corsa, integrating software, hardware, and firmware to boost DDR5 memory performance up to 9000+ MT/s, pushing performance boundaries even further.

X870E AORUS XTREME X3D AI TOP features a robust thermal solution, including the CPU Thermal Matrix that can reduce VRM and DDR temperatures by up to 8.5°C. Plus, lower memory module temperatures by up to 9°C with DDR Wind Blade XTREME, and M.2 Thermal Guard XTREME is built to decrease SSD temperature by up to 22°C. The omni thermal solution ensures rock-solid stability of all critical components under heavy loads and long-term usage.

For a seamless user experience, this motherboard is equipped with EZ-DIY friendly features, including PCIe EZ-Latch Plus Duo for easy ejection with a single click for two graphics cards, M.2 EZ-Latch Plus and Click for screwless installation of M.2 SSD and its heatsink. The DriverBIOS features instant WiFi connectivity without manual driver download, while the WiFi EZ-Plug integrates WiFi antenna plugs into one adapter for easy installation. Furthermore, the eco-friendly reusable design with premium outlook packaging makes the board an XTREME component for collectors.

For more information, please visit the official GIGABYTE website and check product availability with local retailers and e-tailers.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

Built to Unleash AMD Ryzen X3D Processors: GIGABYTE AI-Powered X870E AORUS XTREME X3D AI TOP Motherboard Now Available

Built to Unleash AMD Ryzen X3D Processors: GIGABYTE AI-Powered X870E AORUS XTREME X3D AI TOP Motherboard Now Available

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