HONG KONG, Jan. 30, 2026 /PRNewswire/ -- The Hong Kong Productivity Council (HKPC) celebrated the successful conclusion of its "2025 Winter InnoTalent Programme" (Winter Internship Programme) with a graduation ceremony, recognising 30 young global talents for their outstanding performance during their six‑week internship. The Winter Internship Programme proved highly effective in nurturing top I&T talent and reinforced Hong Kong's critical role in connecting the Chinese Mainland with global talent ecosystems.
The Winter Internship Programme received an overwhelming response, attracting over 1,800 applications worldwide. The 30 selected interns came from the Chinese Mainland, Hong Kong, the United States, Australia and India, as well as several Belt and Road countries, including Indonesia, Korea, New Zealand, Russia and Pakistan. They hail from world-renowned institutions, such as the Massachusetts Institute of Technology, Peking University, the University of Melbourne, the University of New South Wales and Fudan University, as well as leading Hong Kong universities including The University of Hong Kong, The Chinese University of Hong Kong and The Hong Kong University of Science and Technology.
Over 60% of the interns have majored in STEM‑related disciplines—including Artificial Intelligence, Mechanical Engineering and Computer Science—while others possess backgrounds in economics, finance and management, reflecting Hong Kong's need for interdisciplinary talent development and underscoring the city's strong appeal to young I&T talent worldwide.
Aligning with the "15th Five-Year Plan" to Nurture I&T Talents with Global Vision
HKPC has proactively aligned with the national "15th Five-Year Plan", which supports developing Hong Kong and Macao as an international hub for high‑calibre tech talent and promotes strategic Belt and Road cooperation. As a flagship HKPC talent initiative, the "InnoTalent Programme" seeks to inspire young people's innovation spirit and unleash their potential. The programme also provides students from Belt and Road economies with valuable opportunities to gain in‑depth exposure to Hong Kong's I&T industry. The goal is to encourage the pursuit of further careers in Hong Kong after graduation and strengthen collaboration and exchange in I&T and talent development between Hong Kong and partner economies.
Diverse Hands‑on Learning to Stay Ahead of I&T Developments
The six‑week internship closely aligns with Hong Kong's I&T development priorities, focusing on technology application, business analysis and innovation management, while equipping interns with a comprehensive understanding of I&T knowledge and industry trends. Under the guidance of HKPC's professional teams, interns actively participated across multiple divisions, applying innovative technologies to address real‑world business challenges and further deepening their understanding of Hong Kong's I&T ecosystem.
To broaden the understanding of interns across the I&T landscape in Hong Kong and the Greater Bay Area (GBA), HKPC arranged a series of field trips. These included a visit to the Electrical and Mechanical Services Department, where interns observed how intelligent technologies are enhancing public service efficiency. They also visited the Hongrita Group's smart factory in Zhongshan, where they learned how automation and smart manufacturing are leveraged to boost productivity. The visits deepened interns' understanding of regional I&T collaboration and supply‑chain integration.
A key highlight of the Winter Internship Programme, the "Dare to Try" competition showcased the standout learning outcomes from the six‑week internship. The 30 interns were divided into five teams and, under the guidance of mentors, developed AI‑driven innovative concepts, which they presented to HKPC's management at the graduation ceremony. Team Echolink was ultimately named as overall programme champion.
Mr. Mohamed D. BUTT, MH, Executive Director of HKPC, said: "HKPC has been actively supporting the development of Hong Kong as a hub for high‑calibre talent, as nurturing young people with a global vision is a vital driver of I&T development. Through hands‑on experience, the 'InnoTalent Programme' enables students to gain a more comprehensive understanding of Hong Kong's and the Greater Bay Area's I&T ecosystem, laying a solid foundation for their future careers in the sector. We believe that this year's young talents gathered from around the world will elevate Hong Kong as an ideal platform in connecting the Chinese Mainland with the global innovation community, while creating greater value for I&T development."
Multiple programme interns shared how the six‑week internship experience had deepened their understanding of Hong Kong's I&T development. Hermione, an intern from Hong Kong currently studying at Peking University, said: "The Winter Internship Programme allowed me to see Hong Kong's I&T landscape in action and gain a deeper understanding of the city's role in connecting the Mainland Chinese with the international community. The professional guidance from HKPC mentors helped me learn how to translate research ideas into application‑ready outcomes, broaden my industry perspective, and lay an important foundation for my future career in the I&T sector."
Applications are now open for the "2026 Summer InnoTalent Programme". Local and overseas university students are welcome to apply and experience Hong Kong's vibrant I&T ecosystem first‑hand. For more details and application information, please visit the programme website.
Photo Captions:
Please download the high-res photos here.
About the Hong Kong Productivity Council
The Hong Kong Productivity Council (HKPC) is a statutory body established in 1967, dedicated to enhancing the productivity and competitiveness of Hong Kong enterprises through world-class applied R&D, innovative technology services, and integrated manufacturing solutions. As a market-oriented, international R&D organisation, HKPC leverages its deep expertise and extensive industry experience in key areas such as AI, advanced manufacturing, life and health technology, green technology and new energy to drive new industrialisation and support the growth of emerging and future industries.
HKPC focuses on addressing businesses challenges and industrial technology needs, promoting the full integration between technological and industrial innovation. Through technology transfer, product innovation, intellectual property protection and commercialisation of R&D outcomes, the Council fosters collaboration with the local business community as well as top global R&D institutions, delivering added value to industries and advancing the development of new productive forces. HKPC's world-class R&D achievements have been widely recognised over the years, winning an array of local and overseas accolades, reinforcing Hong Kong's role as an international innovation and technology centre and a smart city.
To help enterprises capitalise on Hong Kong's strengths in international connectivity to expand into global markets, HKPC offers comprehensive overseas expansion services tailored to critical areas including product development, technology, manufacturing, and management, enabling businesses to successfully go global from Hong Kong.
HKPC is also committed to providing timely and practical support to SMEs and startups with timely and practical , assisting them in accessing Government funding programmes. Through its FutureSkills training initiatives, HKPC helps both industry and academia stay ahead in latest digital and STEM technologies, nurturing a future-ready talent pool for Hong Kong.
For more information, please visit HKPC's website: www.hkpc.org/en.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
HKPC "2025 Winter InnoTalent Programme" Gathers Global I&T Talent to Strengthen Hong Kong's Position as an International High‑Calibre Talent Hub
At Anker Day 2026, Anker Innovations marks its 15th anniversary by unveiling THUS™ - ANKER's first neural-net Compute-in-Memory AI audio chip - and a new generation of products across soundcore and eufy.
NEW YORK and Bellevue, Wash., May 22, 2026 /PRNewswire/ -- Anker Innovations is hosting Anker Day 2026: Where Ultimate Meets Possible, its annual brand event to showcase the newest product launches and technology break-throughs across its portfolio. Where Ultimate Meets Possible will bring together media, retail buyers and key influencers for an exclusive look at what's next in consumer electronics, spanning premium audio, home energy and the smart home appliances.
Where Ultimate Meets Possible will be held at STORIED in New York City, an invite-only experience featuring keynote presentations, hands-on product demonstrations and a deep dive into the company's latest innovations.
Anker Day 2026 debuted innovations across three brands: soundcore's Liberty 5 Pro and Pro Max — the first earbuds powered by Anker's new THUS™ AI chip — alongside VibeOS AI platform and Nebula SpaceFlow; Anker SOLIX's S2000, the world's longest-lasting 2kWh home backup power station; and eufy's EdgeAgent™, a local AI home security agent, plus new baby care products.
Started With Power
Anker was founded in 2011 and released its first product in the following year: a 4,500mAh ultra-slim power bank. It was a modest beginning, but behind it was an engineering conviction that would shape everything that followed. If technology is going to make a meaningful difference in people's lives, it has to be built to the highest possible standard.
2012 - The Beginning
Anker's first product: a 4,500mAh ultra-slim power bank - the start of a commitment to putting well-engineered, reliable power in people's hands.
2013 - PowerIQ™
Introduced PowerIQ™, enabling fast-charging compatibility across both iOS and Android - setting the standard for universal charging intelligence.
2018 - GaN from Aerospace
An early adopter of Gallium Nitride (GaN) from aerospace applications for consumer charging - delivering a 40% size reduction without sacrificing output.
2019 - World's Smallest 18W Charger
Delivered the world's smallest 18W charger at the time - proving that ultimate performance and ultra-compact form are not a trade-off.
2022 - GaNPrime™
Pioneered high-power multi-port chargers with dynamic power distribution - intelligently allocating power across multiple devices simultaneously.
2023 - 240W Wall Charger
Delivered the industry's highest-power 240W wall charger at the time - meeting the demands of the most power-hungry professional setups.
2024 - InstaCord™ & UltraDura™
In 2024, InstaCord™ became Anker's most advanced retractable‑cable technology and UltraDura™ achieved industry‑leading durability.
2025 - GaNPrime™ 2.0 • PowerIQ™ 5.0 • AnkerSense™ View • TurboBoost™
GaNPrime™ 2.0 (most advanced fast charging), PowerIQ™ 5.0 (smartest compatibility), AnkerSense™ View (intelligent display technology), and TurboBoost™ for ultra-fast power bank recharging. The pursuit never stops.
Fifteen years. Eight technology generations. Every breakthrough driven by one and only promise: seeking the ultimate innovation, not as an end in itself, but because technology built to its highest standard is how we put the possibilities people want in their lives within reach. Technology in service of people. That is what this pursuit has always meant.
Today's Milestone: Anker Thus™
For 80 years, chip design has followed the same logic established by John von Neumann in 1945: separate the processor from memory, and shuttle data between them one instruction at a time. For eight decades across mainframes, desktops, and data centers, this model worked. AI breaks that assumption. A neural network draws on millions of learned parameters all at once - and in a wearable device, moving that data between memory and processor consumes more than 90 percent of chip power, leaving almost nothing for actual computation.
THUS™ applies a different principle: embed computation directly inside NOR Flash memory cells, where the model already lives. The model parameters never have to move. The energy previously consumed by data movement is redirected entirely to computation.
The first THUS™ AI chip debuts in earbuds, delivering up to 150 times more AI computing power on the environmental noise cancellation task than Anker's previous-generation flagship earphones.
Clear Calls - the chip's first disclosed feature - runs a large neural network entirely on-device, anchored by eight MEMS microphones and two bone conduction sensors, for a significantly clear call in any environment. Additional AI-powered features including Signature Sound and Voice Control debuted at Anker Day.
"Every AI chip built until now stores the model on one side and does the computation on the other. To think, the device has to carry all those parameters across, many times per second, every single inference. THUS™ puts the computation where the model already lives. The model never has to move again."
- Steven Yang, Founder and CEO, Anker Innovations
THUS™ takes inspiration from "Thus have I heard", a Buddhist phrase that reflects direct transmission - knowledge conveyed as it was experienced, without distortion.
All performance figures are based on internal Anker lab tests. The 150× AI computing power figure applies specifically to the environmental noise cancellation task and reflects the architectural change from rule-based to neural-net AI processing. It is not a general performance claim and does not reflect a process node upgrade. The environmental noise cancellation workload referenced here runs as an on-device neural network model on the first THUS™ chip.
Anker soundcore Liberty 5 Pro: The First Product Powered by Anker Thus™
The soundcore Liberty 5 Pro and Liberty 5 Pro Max are the first two products to ship with the THUS™ chip. Their positioning is organized around three on-device intelligence layers the chip enables - understanding, adapting, and tuning - each representing a function earbuds could not credibly perform before neural-net AI became viable at this scale. Coming to the market soon.
15 Years, One Promise
From our first power bank to a proprietary AI chip in 2026 - the categories we build in keep expanding, and so does the scope of what technology can do for people's lives. Our promise has been one and only, seeking the ultimate innovation, with the conviction that technology built to its highest standard makes the possibilities people want in their lives the ones they can actually live. Fifteen years is long enough to know that trust is earned slowly. Fifteen years in. The pursuit continues.
About Anker Innovations
Anker Innovations is a global consumer technology company driven by ultimate innovation, creating products that help people power, create, connect, and live more freely. Founded in 2011, Anker Innovations serves more than 200 million consumers across 146 countries and regions. Learn more at anker.com.
DISCLAIMER
*Statements in this news release that are not statements of historical fact may include forward-looking statements regarding future events or the future financial performance of the company. We wish to caution you that such statements are just predictions and that actual events or results may differ materially. Forward-looking statements involve a number of risks and uncertainties surrounding competitive and industry conditions, market acceptance for the company's products, risks of litigation, technological changes, developing industry standards and other factors related to the company's businesses. The actions referred to in this press release are not an admission or acknowledgement of any claim or allegation. The Company reserves all of its rights.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
15 Years of Seeking Ultimate Innovation: From Power Banks to Proprietary AI THUS™ Chip
15 Years of Seeking Ultimate Innovation: From Power Banks to Proprietary AI THUS™ Chip
15 Years of Seeking Ultimate Innovation: From Power Banks to Proprietary AI THUS™ Chip
