BEIJING & MUNICH--(BUSINESS WIRE)--Feb 12, 2026--
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has entered into a distribution agreement with SEMITRON, a leading electronic component distributor that specializes with a focus on the DACH region.
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Under the terms of the deal, SEMITRON is set to supply both GigaDevice's leading Flash, MCU, power and sensor lines in conjunction with field application engineering support to customers in the industrial, automotive and communication technology sectors. In particular, SEMITRON offers professional test house services, technical know-how and local on-the-ground expertise and support.
The partnership further extends GigaDevice's reach into this major European market, with on the ground support in Germany, Austria, Switzerland.
Jürgen Rohland, Managing Director of SEMITRON W. Röck GmbH., said: “With GigaDevice, we are gaining a strong and technologically leading partner who perfectly complements our existing offering and opens up new opportunities for our customers in a variety of applications.”
Andreas Wemmer, Director Sales EMEA at GigaDevice, adds: “The collaboration with SEMITRON offers us an excellent platform to expand our presence in the DACH market. They are highly renowned, well trusted and have a 50-year legacy of exceptional services so will be able to offer the best possible service to our customers in the region.”
About GigaDevice
GigaDevice Semiconductor Inc. is a global leading fabless supplier. Founded in April 2005, the company has continuously expanded its international footprint and established its global headquarters in Singapore in 2025. Today, GigaDevice operates branch offices across numerous countries and regions, providing localized support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com
About SEMITRON
SEMITRON W. Röck GmbH, headquartered in Küssaberg, has been a leading distributor of semiconductor and electronic solutions in Germany, Austria and Switzerland since 1975. In addition to a broad product portfolio, SEMITRON offers professional test house services, technical expertise, and local support, assisting customers in the industrial, automotive, communications, and medical technology sectors.
*GigaDevice, GD32, and their logos are trademarks, or registered trademarks of GigaDevice Semiconductor Inc. Other names and brands are the property of their respective owners.
GigaDevice Extends European Reach with SEMITRON Partnership for DACH region
SEOUL, Korea--(BUSINESS WIRE)--Feb 12, 2026--
Samsung Electronics Co., Ltd., a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. This achievement marks a first in the industry, securing an early leadership position in the HBM4 market.
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By proactively leveraging its most advanced 6th-generation 10 nanometer (nm)-class DRAM process (1c), the company achieved stable yields and industry-leading performance from the outset of mass production — all accomplished seamlessly and without any additional redesigns.
“Instead of taking the conventional path of utilizing existing proven designs, Samsung took the leap and adopted the most advanced nodes like the 1c DRAM and 4nm logic process for HBM4,” said Sang Joon Hwang, Executive Vice President and Head of Memory Development at Samsung Electronics. “By leveraging our process competitiveness and design optimization, we are able to secure substantial performance headroom, enabling us to satisfy our customers' escalating demands for higher performance, when they need them.”
Setting the Bar for Maximum Performance and Efficiency
Samsung's HBM4 delivers a consistent processing speed of 11.7 gigabits-per-second (Gbps), exceeding the industry standard of 8Gbps by approximately 46% and setting a new benchmark for HBM4 performance. This represents a 1.22x increase over the maximum pin speed of 9.6Gbps of its predecessor, HBM3E. HBM4's performance can be further enhanced up to 13Gbps, as well, effectively mitigating data bottlenecks that intensify as AI models continue to scale up.
Also, total memory bandwidth per single stack is increased by 2.7x compared to HBM3E, to a maximum of 3.3 terabytes-per-second (TB/s).
Through 12-layer stacking technology, Samsung offers HBM4 in capacities ranging from 24 gigabytes (GB) to 36GB. The company will also keep its capacity options aligned with future customer timelines by utilizing 16-layer stacking, which will expand offerings to up to 48GB.
In order to address power consumption and thermal challenges driven by the doubling of data I/Os from 1,024 to 2,048 pins, Samsung has integrated advanced low-power design solutions into the core die. HBM4 also achieves a 40% improvement in power efficiency by leveraging low-voltage through silicon via (TSV) technology and power distribution network (PDN) optimization, while enhancing thermal resistance by 10% and heat dissipation by 30%, compared to HBM3E.
By bringing outstanding performance, energy efficiency and high reliability to tomorrow’s datacenter environments, Samsung's HBM4 enables customers to achieve maximized GPU throughput and effectively manage their total cost of ownership (TCO).
Comprehensive Yet Agile Production Capabilities
Samsung is committed to advancing its HBM roadmap through its comprehensive manufacturing resources — including one of the largest DRAM production capacities and dedicated infrastructures in the industry — ensuring a resilient supply chain to meet the projected surge in HBM4 demand.
A tightly integrated Design Technology Co-Optimization (DTCO) between the company’s Foundry and Memory Businesses allows it to secure the highest standards of quality and yield. Additionally, extensive in-house expertise in advanced packaging allows for streamlined production cycles and reduced lead times.
Samsung also plans to broaden the scope of its technical partnership with key partners, based on close discussions with global GPU manufacturers and hyperscalers focused on next-generation ASIC development.
Samsung anticipates that its HBM sales will more than triple in 2026 compared to 2025, and is proactively expanding its HBM4 production capacity. Following the successful introduction of HBM4 to market, sampling for HBM4E is expected to begin in the second half of 2026, while custom HBM samples will start reaching customers in 2027, according to their respective specifications.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, digital signage, smartphones, wearables, tablets, home appliances and network systems, as well as memory, system LSI and foundry. Samsung is also advancing medical imaging technologies, HVAC solutions and robotics, while creating innovative automotive and audio products through Harman. With its SmartThings ecosystem, open collaboration with partners, and integration of AI across its portfolio, Samsung delivers a seamless and intelligent connected experience. For the latest news, please visit the Samsung Newsroom at news.samsung.com.
Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
