AI x Fibre: the company will highlight next-generation ultra-low latency optical communication technology, strengthening global AI infrastructure.
BARCELONA, Spain, Feb. 28, 2026 /PRNewswire/ -- Yangtze Optical Fibre and Cable (YOFC) will showcase its latest innovative optical connectivity solutions for the AI era at MWC Barcelona 2026, taking place from March 2 to 5. Under the theme "AI x Fibre – Leading an Intelligent Future," the company will also host a dedicated launch event for its hollow-core fibre (HCF) solutions on March 4 at one of the world's largest and most influential connectivity events.
As AI is rapidly reshaping global industries and societal operations, high-speed, low-latency, and highly reliable optical connectivity is becoming essential infrastructure for an intelligent world. As a key transmission technology supporting next-generation AI computing networks, HCF will take centre stage of YOFC's exhibition at booth 5A30.
"Artificial intelligence is profoundly reshaping the global industrial landscape, placing unprecedented demands on ultra‑high‑speed, ultra‑low‑latency optical connectivity. As a premier global platform for mobile communications and digital technology, MWC provides a vital window to showcase cutting‑edge innovations and deepen international collaboration," remarked Zhuang Dan, Executive Director and President of YOFC.
"We believe that advanced optical connectivity not only drives the efficient flow of computing power and data but also contributes to the development of the digital society, connecting us to a more inclusive and sustainable future. YOFC looks forward to working with global industry partners to co‑create a smarter, greener, and more efficient future of optical connectivity."
Centring on "AI X Fibre," YOFC's exhibition at MWC Barcelona 2026 will especially spotlight five key technological highlights, demonstrating how optical fibre technology serves as the core backbone of global AI computing networks:
- AI computing hub: Ultra-high-speed optical fibre interconnection solutions for AI data centres;
- Connecting global AI networks: Supporting backbone network upgrades and cross-border data transmission;
- Empowering AI applications: Covering high-bandwidth scenarios such as high-frequency financial trading, AI data centre interconnection, and quantum communication;
- All-optical connectivity for home and business: Driving all-optical upgrades in residential and enterprise settings.
- VIP showcase: Featuring cutting-edge achievements in optical communication technology.
As a flagship innovation on display, YOFC's HCF represents the forefront of next-generation optical transmission technology. Offering significant advantages over traditional fibre including lower latency, higher transmission efficiency, and enhanced signal quality, it provides critical infrastructure for ultra-high-speed data transmission and AI computing networks. Further details will be unveiled at the launch event during MWC.
As the world accelerates into the AI era, YOFC reinforced its commitment and unveiled the "AI-2030" strategy in 2025, positioning itself as a global leader in AI optical connectivity infrastructure. Built on its three core preform technologies—PCVD, VAD, and OVD—the company has developed a comprehensive "Superior Fibre" portfolio that includes G.654.E fibre, multi-core fibre, and hollow-core fibre (HFC), designed to meet the most demanding transmission needs.
With over a decade of global expansion, YOFC now operates eight production facilities across six countries, serving more than 100 markets worldwide. Through active participation in international standard-setting and cross-industry collaboration, YOFC continues to drive digital and intelligent transformation on a global scale, making high-speed, reliable optical connectivity a driving force behind the advancement of digital society—supporting a smarter, more connected, and more inclusive digital future.
Global industry partners, customers and media are invited to join YOFC at booth 5A30 at MWC Barcelona 2026 from March 2 to 5.
The press conference for HCF launch will take place from 10 a.m. to 12 p.m. on March 4 at T6, Hall 8.0.
For more information, please visit https://en.yofc.com/
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MWC Barcelona 2026: YOFC to Unveil Hollow-Core Fibre (HCF) Solution, Advancing Optical Connectivity in the Era of AI
At Anker Day 2026, Anker Innovations marks its 15th anniversary by unveiling THUS™ - ANKER's first neural-net Compute-in-Memory AI audio chip - and a new generation of products across soundcore and eufy.
NEW YORK and Bellevue, Wash., May 22, 2026 /PRNewswire/ -- Anker Innovations is hosting Anker Day 2026: Where Ultimate Meets Possible, its annual brand event to showcase the newest product launches and technology break-throughs across its portfolio. Where Ultimate Meets Possible will bring together media, retail buyers and key influencers for an exclusive look at what's next in consumer electronics, spanning premium audio, home energy and the smart home appliances.
Where Ultimate Meets Possible will be held at STORIED in New York City, an invite-only experience featuring keynote presentations, hands-on product demonstrations and a deep dive into the company's latest innovations.
Anker Day 2026 debuted innovations across three brands: soundcore's Liberty 5 Pro and Pro Max — the first earbuds powered by Anker's new THUS™ AI chip — alongside VibeOS AI platform and Nebula SpaceFlow; Anker SOLIX's S2000, the world's longest-lasting 2kWh home backup power station; and eufy's EdgeAgent™, a local AI home security agent, plus new baby care products.
Started With Power
Anker was founded in 2011 and released its first product in the following year: a 4,500mAh ultra-slim power bank. It was a modest beginning, but behind it was an engineering conviction that would shape everything that followed. If technology is going to make a meaningful difference in people's lives, it has to be built to the highest possible standard.
2012 - The Beginning
Anker's first product: a 4,500mAh ultra-slim power bank - the start of a commitment to putting well-engineered, reliable power in people's hands.
2013 - PowerIQ™
Introduced PowerIQ™, enabling fast-charging compatibility across both iOS and Android - setting the standard for universal charging intelligence.
2018 - GaN from Aerospace
An early adopter of Gallium Nitride (GaN) from aerospace applications for consumer charging - delivering a 40% size reduction without sacrificing output.
2019 - World's Smallest 18W Charger
Delivered the world's smallest 18W charger at the time - proving that ultimate performance and ultra-compact form are not a trade-off.
2022 - GaNPrime™
Pioneered high-power multi-port chargers with dynamic power distribution - intelligently allocating power across multiple devices simultaneously.
2023 - 240W Wall Charger
Delivered the industry's highest-power 240W wall charger at the time - meeting the demands of the most power-hungry professional setups.
2024 - InstaCord™ & UltraDura™
In 2024, InstaCord™ became Anker's most advanced retractable‑cable technology and UltraDura™ achieved industry‑leading durability.
2025 - GaNPrime™ 2.0 • PowerIQ™ 5.0 • AnkerSense™ View • TurboBoost™
GaNPrime™ 2.0 (most advanced fast charging), PowerIQ™ 5.0 (smartest compatibility), AnkerSense™ View (intelligent display technology), and TurboBoost™ for ultra-fast power bank recharging. The pursuit never stops.
Fifteen years. Eight technology generations. Every breakthrough driven by one and only promise: seeking the ultimate innovation, not as an end in itself, but because technology built to its highest standard is how we put the possibilities people want in their lives within reach. Technology in service of people. That is what this pursuit has always meant.
Today's Milestone: Anker Thus™
For 80 years, chip design has followed the same logic established by John von Neumann in 1945: separate the processor from memory, and shuttle data between them one instruction at a time. For eight decades across mainframes, desktops, and data centers, this model worked. AI breaks that assumption. A neural network draws on millions of learned parameters all at once - and in a wearable device, moving that data between memory and processor consumes more than 90 percent of chip power, leaving almost nothing for actual computation.
THUS™ applies a different principle: embed computation directly inside NOR Flash memory cells, where the model already lives. The model parameters never have to move. The energy previously consumed by data movement is redirected entirely to computation.
The first THUS™ AI chip debuts in earbuds, delivering up to 150 times more AI computing power on the environmental noise cancellation task than Anker's previous-generation flagship earphones.
Clear Calls - the chip's first disclosed feature - runs a large neural network entirely on-device, anchored by eight MEMS microphones and two bone conduction sensors, for a significantly clear call in any environment. Additional AI-powered features including Signature Sound and Voice Control debuted at Anker Day.
"Every AI chip built until now stores the model on one side and does the computation on the other. To think, the device has to carry all those parameters across, many times per second, every single inference. THUS™ puts the computation where the model already lives. The model never has to move again."
- Steven Yang, Founder and CEO, Anker Innovations
THUS™ takes inspiration from "Thus have I heard", a Buddhist phrase that reflects direct transmission - knowledge conveyed as it was experienced, without distortion.
All performance figures are based on internal Anker lab tests. The 150× AI computing power figure applies specifically to the environmental noise cancellation task and reflects the architectural change from rule-based to neural-net AI processing. It is not a general performance claim and does not reflect a process node upgrade. The environmental noise cancellation workload referenced here runs as an on-device neural network model on the first THUS™ chip.
Anker soundcore Liberty 5 Pro: The First Product Powered by Anker Thus™
The soundcore Liberty 5 Pro and Liberty 5 Pro Max are the first two products to ship with the THUS™ chip. Their positioning is organized around three on-device intelligence layers the chip enables - understanding, adapting, and tuning - each representing a function earbuds could not credibly perform before neural-net AI became viable at this scale. Coming to the market soon.
15 Years, One Promise
From our first power bank to a proprietary AI chip in 2026 - the categories we build in keep expanding, and so does the scope of what technology can do for people's lives. Our promise has been one and only, seeking the ultimate innovation, with the conviction that technology built to its highest standard makes the possibilities people want in their lives the ones they can actually live. Fifteen years is long enough to know that trust is earned slowly. Fifteen years in. The pursuit continues.
About Anker Innovations
Anker Innovations is a global consumer technology company driven by ultimate innovation, creating products that help people power, create, connect, and live more freely. Founded in 2011, Anker Innovations serves more than 200 million consumers across 146 countries and regions. Learn more at anker.com.
DISCLAIMER
*Statements in this news release that are not statements of historical fact may include forward-looking statements regarding future events or the future financial performance of the company. We wish to caution you that such statements are just predictions and that actual events or results may differ materially. Forward-looking statements involve a number of risks and uncertainties surrounding competitive and industry conditions, market acceptance for the company's products, risks of litigation, technological changes, developing industry standards and other factors related to the company's businesses. The actions referred to in this press release are not an admission or acknowledgement of any claim or allegation. The Company reserves all of its rights.
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15 Years of Seeking Ultimate Innovation: From Power Banks to Proprietary AI THUS™ Chip
15 Years of Seeking Ultimate Innovation: From Power Banks to Proprietary AI THUS™ Chip
15 Years of Seeking Ultimate Innovation: From Power Banks to Proprietary AI THUS™ Chip
