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Laser Redefined, Metrology Reimagined, Data Revisualized

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Laser Redefined, Metrology Reimagined, Data Revisualized
Business

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Laser Redefined, Metrology Reimagined, Data Revisualized

2026-03-05 13:53 Last Updated At:14:15

BEAVERTON, Ore., March 5, 2026 /PRNewswire/ -- Nanoverse Technologies Limited (NVT) announces the release of its new Advanced Packaging line of tools. NVT has recently developed the fastest, most advanced and most versatile laser singulation and metrology tools in the industry. The Advanced Packaging product family includes: 5500, 6600, 7700, and 9900 all based upon a common platform architecture for fleet-wide tool matching. The laser systems represent commercial deployment of a laser design exclusive to Nanoverse Technologies. These are the only tools in the industry offering the integration of a true metrology solution and laser scribing/dicing capability providing an industry first in true process control. NVT CEO Jeff Albelo stated that "We now offer real-time process observability coupled with advanced singulation technology for both rapid prototyping and High-Volume Manufacturing (HVM) alike. It's a game changer."

The flagship NVT 7700, represents the perfect fusion of laser scribing with advanced metrology. The laser process delivers the highest die break strength laser process in the industry (2-3x higher than current processes)! Capable of processing up to 30 wafers per hour with < 3 mm placement accuracy, the system demonstrates a GR&R of less than 300 nm. The Model 7700 includes multiple system modules designed for completely independent and simultaneous execution of scribing, dicing, metrology, coating, cleaning, and post-coat baking of both mounted and unmounted wafers in mixed lot processing. The system software architecture enables flawless, recipe driven, automation with OHV compatibility. The laser scribing and dicing module employs a true ultrafast process capable of on the fly power adjustments. The system is completely SEMI compliant and supports both two and four load port configurations.

The NVT 6600 product family represents the same innovations targeting production environments where integrated metrology is not required and a smaller tool footprint is desirable. The NVT 6600 retains the same coat, clean, bake, scribe, and dice capability as the flagship tool, at higher throughput.

The NVT 5500 is a stand-alone metrology and inspection system utilizing a patented, phase-based, white light approach. The result is a high-speed, high-resolution metrology system capable of whole wafer scanning delivering simultaneous 2D and 3D information without image stitching. As a dedicated metrology system, the NVT 5500 detects bumps, pads, debris and defects on a wide array of substrates. The NVT technology can detect many films currently invisible to competitive systems, including non-conductive films (NCF).

Set for release in mid-2026, the NVT 9900 platform represents the next generation evolution of laser based singulation. The system includes a dual laser configuration to complete high-speed and high-quality full-cut laser scribing and dicing as part of the die prep process. The lasers can be different wavelength, pulse width, power and pulse energy to customize the laser singulation options available to our customers. Paired with or replacing plasma dicing, the NVT technology platforms represents an incredible advancement in back-end processing technology. Please visit our website www.nanovtech.com for further information or to have a chat about how we can enable your advanced packaging roadmap.

BEAVERTON, Ore., March 5, 2026 /PRNewswire/ -- Nanoverse Technologies Limited (NVT) announces the release of its new Advanced Packaging line of tools. NVT has recently developed the fastest, most advanced and most versatile laser singulation and metrology tools in the industry. The Advanced Packaging product family includes: 5500, 6600, 7700, and 9900 all based upon a common platform architecture for fleet-wide tool matching. The laser systems represent commercial deployment of a laser design exclusive to Nanoverse Technologies. These are the only tools in the industry offering the integration of a true metrology solution and laser scribing/dicing capability providing an industry first in true process control. NVT CEO Jeff Albelo stated that "We now offer real-time process observability coupled with advanced singulation technology for both rapid prototyping and High-Volume Manufacturing (HVM) alike. It's a game changer."

The flagship NVT 7700, represents the perfect fusion of laser scribing with advanced metrology. The laser process delivers the highest die break strength laser process in the industry (2-3x higher than current processes)! Capable of processing up to 30 wafers per hour with < 3 mm placement accuracy, the system demonstrates a GR&R of less than 300 nm. The Model 7700 includes multiple system modules designed for completely independent and simultaneous execution of scribing, dicing, metrology, coating, cleaning, and post-coat baking of both mounted and unmounted wafers in mixed lot processing. The system software architecture enables flawless, recipe driven, automation with OHV compatibility. The laser scribing and dicing module employs a true ultrafast process capable of on the fly power adjustments. The system is completely SEMI compliant and supports both two and four load port configurations.

The NVT 6600 product family represents the same innovations targeting production environments where integrated metrology is not required and a smaller tool footprint is desirable. The NVT 6600 retains the same coat, clean, bake, scribe, and dice capability as the flagship tool, at higher throughput.

The NVT 5500 is a stand-alone metrology and inspection system utilizing a patented, phase-based, white light approach. The result is a high-speed, high-resolution metrology system capable of whole wafer scanning delivering simultaneous 2D and 3D information without image stitching. As a dedicated metrology system, the NVT 5500 detects bumps, pads, debris and defects on a wide array of substrates. The NVT technology can detect many films currently invisible to competitive systems, including non-conductive films (NCF).

Set for release in mid-2026, the NVT 9900 platform represents the next generation evolution of laser based singulation. The system includes a dual laser configuration to complete high-speed and high-quality full-cut laser scribing and dicing as part of the die prep process. The lasers can be different wavelength, pulse width, power and pulse energy to customize the laser singulation options available to our customers. Paired with or replacing plasma dicing, the NVT technology platforms represents an incredible advancement in back-end processing technology. Please visit our website www.nanovtech.com for further information or to have a chat about how we can enable your advanced packaging roadmap.

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

Laser Redefined, Metrology Reimagined, Data Revisualized

Laser Redefined, Metrology Reimagined, Data Revisualized

New Wi-Fi and 5G-Series deliver accessible Wi-Fi 7 upgrades and flexible broadband alternatives for modern living

TAIPEI, March 5, 2026 /PRNewswire/ -- D-Link Corporation today announced a strategic focus on making Wi-Fi 7 accessible and practical for everyday use. D-Link's latest portfolio is engineered to address today's most pressing connectivity demands, including remote work, the growing AI ecosystem, and high-definition streaming and gaming. The lineup supports seamless network upgrades for modern apartments while providing high-speed alternatives for fiber-restricted environments.

Smarter Wi-Fi 7 Upgrades for Broadband-Connected Homes

Even with established broadband, today's households are demanding more from their networks. The BE3600 Wi-Fi 7 Router C36 is D-Link's most accessible solution for mainstream households upgrading from legacy Wi-Fi standards. It delivers core Wi-Fi 7 benefits, including improved efficiency and reduced latency, without introducing unnecessary complexity.

For higher-usage environments, the BE7200 Wi-Fi 7 Router C72 offers a higher-capacity option.
Designed to deliver broader network coverage compared to C36, the C72 is the superior choice for larger residences or homes with multiple rooms and challenging layouts.

5G Fixed Wireless: A Practical Alternative Where Fiber is Limited

Building on the same practical Wi-Fi 7 foundation, D-Link extends next-generation connectivity beyond fixed-line broadband. Fiber availability remains uneven, and many modern households require reliable high-speed connectivity that does not depend on fixed-line infrastructure. The 5G NR BE3600 Wi-Fi 7 Router G536 combines 5G NR technology with Wi-Fi 7 to provide a practical alternative to traditional broadband. Its plug-and-play deployment enables instant internet access for renters, rural homes, and temporary living environments without the need for fixed-line installation.

For users requiring maximum continuity, the 5G NR BE7200 Wi-Fi 7 Router G572 is designed for demanding scenarios. Positioned as a robust primary or backup solution, it delivers reliable performance in environments where network availability is critical.

Our Commitment: Practical Solutions for a Connected Future

"At D-Link, we believe that technology should solve problems, not add complexity," said CJ Chang, CEO of D-Link Corporation. "By focusing on practical Wi-Fi 7 solutions like the C36 and the flexible G536, we are helping users navigate the transition to next-generation networking.

Guided by our brand vision, One Connection • Infinite Possibilities., D-Link remains committed to delivering accessible, reliable, and forward-looking connectivity solutions that empower individuals, households, and communities to stay connected regardless of their environment or infrastructure.

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About D-Link

D-Link, a global leader in the networking industry, began expanding worldwide in 1986 and was officially established as D-Link Corporation in 1987. With 90 operational and sales locations across 43 countries, D-Link provides innovative and reliable networking equipment, AI-powered cloud management services, and complete infrastructure solutions for individuals, homes, businesses, and industries. Find out more about D-Link at www.dlink.com

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

D-Link Makes Wi-Fi 7 Practical for Modern Homes and Flexible Broadband Access

D-Link Makes Wi-Fi 7 Practical for Modern Homes and Flexible Broadband Access

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