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Global adoption of Physical AI chips accelerates as industry demand expands across robotics, smart factories, and edge AI — backed by a growing partner ecosystem and an early global supply chain spanning Asia, North America, and Europe.
SEOUL, South Korea, March 27, 2026 /PRNewswire/ -- DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders across eight countries within seven months of starting mass production of its first-generation AI chip — a pace that industry observers describe as highly unusual for an emerging fabless company at such an early stage of commercialization.
The orders span seven major Physical AI application domains, including robotics, smart factories, edge AI servers, industrial AI, surveillance, AI IT services, and smart cities, with deployments now active across Asia, North America, and Europe.
Global Expansion at Unusual Speed
The ramp-up was slow at first: only two orders came in during the first five months after production began. But the company added 25 additional orders in less than three months in 2026, indicating rapidly accelerating commercial adoption.
While some semiconductor startups have achieved limited international shipments, DEEPX's simultaneous expansion across multiple countries and application domains at this pace is highly unusual, according to industry observers. The company's chips are now being deployed across eight countries spanning Asia, North America, and Europe.
Early Global Supply Chain Execution
DEEPX established a global distribution network early in its commercialization phase through partnerships with Avnet, DigiKey, and WPG. Industry analysts note that it is rare for an emerging fabless semiconductor company to secure a global supply chain at such an early stage of mass production.
In Europe, DEEPX signed a distribution agreement with Avnet Silica — the European arm of Avnet — establishing a regional supply chain ahead of broader market entry. Avnet Silica has already identified more than 30 prospective customers across high-performance embedded segments including smart city infrastructure, autonomous mobile robots (AMR), machine vision, and smart factories. Both companies are actively expanding purchase contracts as European industrial demand for edge AI inference accelerates.
Partner Ecosystem: From Silicon Vendors to AI Software Leaders
A key driver of DEEPX's commercial momentum is a cross-industry partner ecosystem spanning semiconductor vendors, industrial computing platforms, and open-source AI software leaders — reflecting a deliberate strategy to position its silicon as an embedded AI standard rather than a point solution.
Renesas Electronics: Has integrated DEEPX NPUs into more than three types of industrial boards combining Renesas application processors, delivering solutions applicable to smart factory deployments. The collaboration between a tier-one AP semiconductor company and an AI chip startup has been widely noted as an uncommon signal of hardware ecosystem maturity.
Sixfab and Raspberry Pi: Have jointly developed and released an AI HAT module built around the DX-M1, alongside a real-time smart traffic analysis solution using the CES 2026 Best of Innovation-winning 'ALPON X5' AI PC that integrates DEEPX products.
AAEON (ASUS subsidiary), IEI, WeLink, Endrich, Toradex, and Lanner: Industrial system developers have deployed customized AI hardware solutions for smart cities, automated logistics, and security systems powered by DEEPX chips, extending the company's reach across diverse embedded application segments.
Ultralytics & Network Optix: Ultralytics, developer of the widely-adopted YOLO vision AI model family, has demonstrated 'Open-Source Physical AI Alliance' workloads running on the DEEPX NPU with a one-click deployment flow. Network Optix has validated an intelligent Video Management System capable of managing thousands of camera feeds simultaneously using DEEPX inference.
New Products: DX-M1M and DX-AIPlayer
Alongside its commercial order momentum, DEEPX has launched two mass-production product lines designed to reduce integration friction for industrial developers across its key markets:
DX-M1M (M.2 Module): A standard M.2 form factor module embedding the DX-M1 AI chip, designed to drop into existing industrial PCs and edge servers. The format allows customers to add powerful AI inference capability without redesigning hardware, significantly lowering the barrier to deployment.
DX-AIPlayer: An edge AI acceleration solution integrating the DEEPX NPU with a high-efficiency CPU board. Positioned as a 'one-stop' platform covering the full workflow from model development to industrial deployment, the product enables developers to implement vision AI applications without complex integration overhead.
Large-Scale Global PoC Strategy
The company attributes its rapid adoption to a large-scale pre-production engagement strategy. In the semiconductor industry, it typically takes 9 to 18 months from PoC initiation to full production deployment in customer applications. To shorten this cycle, DEEPX began working with customers well before mass production began.
Over more than one year prior to production, the company collaborated with approximately 350 global companies, supporting proof-of-concept testing and system integration. This approach created a large pipeline of customers already familiar with the silicon and ready to transition into commercial orders once production began.
Physical AI Moving from Concept to Reality
CEO Lokwon Kim pointed to the growing volume of PoC activity as the clearest signal that physical AI is no longer a forward-looking concept. "Many people still view Physical AI as a concept for the future. But when we look at the growing number of PoC projects with global companies today, it becomes clear that Physical AI is already becoming a reality," he said.
On the commercial order milestone, Kim was direct. "Securing 27 commercial orders within seven months is one of the early signs that this transition is already happening in the industry."
With distribution in place across Asia, North America, and Europe, and a partner ecosystem spanning silicon vendors, industrial platform makers, and open-source AI software leaders, DEEPX appears positioned to expand its commercial footprint across multiple regions simultaneously. If the current order velocity holds, the company's ambition to establish its NPU as the default physical AI inference chip for embedded developers worldwide may be closer to reality than the industry expected.
Global adoption of Physical AI chips accelerates as industry demand expands across robotics, smart factories, and edge AI — backed by a growing partner ecosystem and an early global supply chain spanning Asia, North America, and Europe.
SEOUL, South Korea, March 27, 2026 /PRNewswire/ -- DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders across eight countries within seven months of starting mass production of its first-generation AI chip — a pace that industry observers describe as highly unusual for an emerging fabless company at such an early stage of commercialization.
The orders span seven major Physical AI application domains, including robotics, smart factories, edge AI servers, industrial AI, surveillance, AI IT services, and smart cities, with deployments now active across Asia, North America, and Europe.
Global Expansion at Unusual Speed
The ramp-up was slow at first: only two orders came in during the first five months after production began. But the company added 25 additional orders in less than three months in 2026, indicating rapidly accelerating commercial adoption.
While some semiconductor startups have achieved limited international shipments, DEEPX's simultaneous expansion across multiple countries and application domains at this pace is highly unusual, according to industry observers. The company's chips are now being deployed across eight countries spanning Asia, North America, and Europe.
Early Global Supply Chain Execution
DEEPX established a global distribution network early in its commercialization phase through partnerships with Avnet, DigiKey, and WPG. Industry analysts note that it is rare for an emerging fabless semiconductor company to secure a global supply chain at such an early stage of mass production.
In Europe, DEEPX signed a distribution agreement with Avnet Silica — the European arm of Avnet — establishing a regional supply chain ahead of broader market entry. Avnet Silica has already identified more than 30 prospective customers across high-performance embedded segments including smart city infrastructure, autonomous mobile robots (AMR), machine vision, and smart factories. Both companies are actively expanding purchase contracts as European industrial demand for edge AI inference accelerates.
Partner Ecosystem: From Silicon Vendors to AI Software Leaders
A key driver of DEEPX's commercial momentum is a cross-industry partner ecosystem spanning semiconductor vendors, industrial computing platforms, and open-source AI software leaders — reflecting a deliberate strategy to position its silicon as an embedded AI standard rather than a point solution.
Renesas Electronics: Has integrated DEEPX NPUs into more than three types of industrial boards combining Renesas application processors, delivering solutions applicable to smart factory deployments. The collaboration between a tier-one AP semiconductor company and an AI chip startup has been widely noted as an uncommon signal of hardware ecosystem maturity.
Sixfab and Raspberry Pi: Have jointly developed and released an AI HAT module built around the DX-M1, alongside a real-time smart traffic analysis solution using the CES 2026 Best of Innovation-winning 'ALPON X5' AI PC that integrates DEEPX products.
AAEON (ASUS subsidiary), IEI, WeLink, Endrich, Toradex, and Lanner: Industrial system developers have deployed customized AI hardware solutions for smart cities, automated logistics, and security systems powered by DEEPX chips, extending the company's reach across diverse embedded application segments.
Ultralytics & Network Optix: Ultralytics, developer of the widely-adopted YOLO vision AI model family, has demonstrated 'Open-Source Physical AI Alliance' workloads running on the DEEPX NPU with a one-click deployment flow. Network Optix has validated an intelligent Video Management System capable of managing thousands of camera feeds simultaneously using DEEPX inference.
New Products: DX-M1M and DX-AIPlayer
Alongside its commercial order momentum, DEEPX has launched two mass-production product lines designed to reduce integration friction for industrial developers across its key markets:
DX-M1M (M.2 Module): A standard M.2 form factor module embedding the DX-M1 AI chip, designed to drop into existing industrial PCs and edge servers. The format allows customers to add powerful AI inference capability without redesigning hardware, significantly lowering the barrier to deployment.
DX-AIPlayer: An edge AI acceleration solution integrating the DEEPX NPU with a high-efficiency CPU board. Positioned as a 'one-stop' platform covering the full workflow from model development to industrial deployment, the product enables developers to implement vision AI applications without complex integration overhead.
Large-Scale Global PoC Strategy
The company attributes its rapid adoption to a large-scale pre-production engagement strategy. In the semiconductor industry, it typically takes 9 to 18 months from PoC initiation to full production deployment in customer applications. To shorten this cycle, DEEPX began working with customers well before mass production began.
Over more than one year prior to production, the company collaborated with approximately 350 global companies, supporting proof-of-concept testing and system integration. This approach created a large pipeline of customers already familiar with the silicon and ready to transition into commercial orders once production began.
Physical AI Moving from Concept to Reality
CEO Lokwon Kim pointed to the growing volume of PoC activity as the clearest signal that physical AI is no longer a forward-looking concept. "Many people still view Physical AI as a concept for the future. But when we look at the growing number of PoC projects with global companies today, it becomes clear that Physical AI is already becoming a reality," he said.
On the commercial order milestone, Kim was direct. "Securing 27 commercial orders within seven months is one of the early signs that this transition is already happening in the industry."
With distribution in place across Asia, North America, and Europe, and a partner ecosystem spanning silicon vendors, industrial platform makers, and open-source AI software leaders, DEEPX appears positioned to expand its commercial footprint across multiple regions simultaneously. If the current order velocity holds, the company's ambition to establish its NPU as the default physical AI inference chip for embedded developers worldwide may be closer to reality than the industry expected.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
DEEPX Secures 27 Commercial Orders Across 8 Countries Within 7 Months of Mass Production
SAN FRANCISCO, March 27, 2026 /PRNewswire/ -- Mobvoi Inc., the company behind the popular Wear OS–powered TicWatch smartwatch line and TicNote AI recorder, today officially launches TicNote Pods, the world's first 4G-connected AI note-taking earbuds, alongside the next generation of its AI agent platform Shadow AI 2.0. Designed for professionals, students, creators, and distributed teams, TicNote Pods capture conversations anywhere — meetings, calls, interviews, or lectures — and instantly convert them into structured knowledge, summaries, and actionable tasks.
The First AI Earbuds Designed for Knowledge Capture
TicNote Pods combine premium wireless audio with built-in 4G connectivity and AI processing, enabling users to capture conversations and process them instantly — even without a phone.
Unlike traditional recorders that only capture environmental sound, TicNote Pods record both the surrounding environment and voices transmitted through the earbuds, ensuring complete conversation capture. Once recorded, audio is automatically transcribed, summarized, and synced to TicNote Cloud, where Shadow Agent can begin working with the content. This transforms everyday conversations into a searchable knowledge base and collaborative workspace.
Key Features
4G AI Recording — No Phone Required
Built-in 4G connectivity allows TicNote Pods to upload recordings directly to the cloud, delivering transcripts and summaries faster than standard connections.
Dual Recording Modes
- Earbuds recording: captures calls and online meetings
- Charging-case recording: captures in-person conversations hands-free
Shadow AI Transcription & Smart Summaries
Automatically produces speaker-labeled transcripts, key insights, and actionable to-do lists.
Multilingual Intelligence
Real-time transcription and translation support 100+ languages, making TicNote Pods ideal for global teams.
AI Collaboration in TicNote Cloud
Conversations become documents, project files, and tasks, editable by both users and Shadow Agent.
All-Day Comfort
Lightweight open-ear design (7g per earbud) with titanium frame and liquid silicone hooks.
Premium Earbuds Experience
ENC + AEC noise cancellation, Bluetooth 6.0 connectivity, and responsive touch controls.
Hardware & Connectivity
Behind TicNote Pods is a compact system designed for real-time AI processing.
Built-in 4G eSIM
Allows recording and AI uploading without Wi-Fi or a smartphone.
Smart Connectivity Switching
Automatically switches between 4G, Wi-Fi, and Bluetooth depending on network availability.
Dual-Mic AI Noise Cancellation
Cloud-assisted noise suppression isolates voices to ensure accurate transcription.
Battery & Storage
- 5 hours continuous recording
- 25 hours total recording time with case
- 40 hours music playback
- 32GB onboard storage (≈2000 hours audio) with cloud backup.
From Conversations to Real Work
Traditional AI note-taking tools stop at transcription or summaries.
TicNote goes further.
Powered by Shadow AI 2.0, the TicNote platform turns recorded conversations into living project assets that teams can work on together with an AI collaborator.
Inside TicNote Cloud, users can:
- Ask Shadow to analyze recordings and uploaded files together
- Generate structured documents, slides, PRDs, landing pages directly from discussions
- Update files across an entire project
- Assign and track tasks created during meetings
- Collaborate with teammates and the AI agent in the same workspace
This means meetings no longer end with notes — they end with work already in progress.
The system allows professionals in different fields to move from conversation to execution instantly.
How It Works
Specifications
Form Factor: True Wireless Stereo (TWS) design with precision engineering
Microphones: Dual directional ENC + AEC mics and charging-case array for 10 m capture
Connectivity: 4G eSIM, Wi-Fi, Bluetooth 6.0 seamless switching
Transcription: Full audio transcribed quickly with 4G
Languages: 100 + languages with real-time written translation
Battery & Charging: 40 h music play total use • 25 h recording • 15 min charge = 3h use
Storage: 32 GB local storage (≈ 2000 + h of audio) • Unlimited cloud sync
Standby Time: 45 days Bluetooth/Wi-Fi• 7 days active 4G standby
Weight: 7 g each • 65 g with case
Durability: IPX4 splash-proof and daily wear ready
Security: End-to-end encrypted cloud storage • Manual control of recordings
Compatibility: iOS / Android
Colors: Navy Blue and Pearl White
Pricing & Availability
TicNote Pods launches globally on March 27, 2026 at 7:00 AM EST.
Retail MSRP:
TicNote Pods (4G Version): $299
TicNote Pods (WiFi Version, coming soon): $249
Available in:
Each device includes 600 free transcription minutes per month, with optional subscription upgrades.
Pro Plan: $119/year – 2,100 minutes per month
Business Plan: $299/year – 6,600 minutes per month
All recordings sync automatically to TicNote Cloud, where users can search, analyze, and collaborate with Shadow Agent.
4G Connectivity (Supported Regions)
North America (North America Version)
United States, Canada
Europe (EU Version)
Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Poland, Portugal, Romania, Slovenia, Spain, Sweden, Switzerland, United Kingdom
Note: Slovakia is not supported.
Oceania (EU Version)
Australia, New Zealand
About Mobvoi
Mobvoi is an innovative AI tech company with in-house core technologies in the areas including speech recognition, natural language understanding, vertical search, etc. Its core consumer products include the TicWatch line of smartwatches and the AI voice recorder TicNote. Mobvoi recently achieved a successful listing on the Hong Kong Stock Exchange (HKEX: 02438), signaling a new chapter in the company's commitment to innovation and technology-driven solutions for its users.
Mobvoi is dedicated to redefining the next generation of human-machine interaction by bringing hardware/software integrated products into people's daily life with a strong AI-centered approach.
To find out more about Mobvoi: www.mobvoi.com
Media Contact
Email: rongrong.zhao@mobvoi.com
Press Kit: [https://drive.google.com/drive/folders/1zvxCjq8-qP7O_3EwbQpH5z0za9d5inMk?usp=sharing]
Launch Official Page: https://www.mobvoi.com/ticnotepods/
Kickstarter page: https://www.kickstarter.com/projects/mobvoi/ticnote-pods-worlds-smartest-4g-ai-note-taking-earbuds
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
TicNote Pods: The World's First 4G AI Note-Taking Earbuds
