|
SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered large-scale mass production. The commercial launch of this product not only marks a significant milestone in the strategic collaboration between Fibocom and Samsung, but also provides high-performance and highly reliable connectivity solutions for global 5G FWA (Fixed Wireless Access) and broadband IoT applications, such as wireless fixed terminals, MiFi devices, and industrial gateways.
Strong Partnership: Elevating 5G Connectivity to New Era
This mass production milestone represents a key achievement in the deep strategic partnership between Fibocom and Samsung. Samsung's 5G chipset solutions have been widely validated through large-scale global deployments, known for their high stability, outstanding RF performance, and broad global compatibility. By integrating their technological strengths, both parties aim to leverage their expertise in chipset architecture and industry applications to accelerate the adoption and expansion of 5G across global vertical industries.
"At Samsung, we are pleased to deepen our strategic collaboration with Fibocom as we advance next generation 5G connectivity for global markets. The successful mass production of Fibocom's Fx550 module highlights our shared commitment to innovation, performance, and reliability in delivering cutting-edge connectivity for FWA and broadband IoT applications. Together, we are building a foundation for smarter, more connected industries in the AI era." – Jungwon Lee, executive vice president and head of the System LSI Modem Development Team at Samsung Electronics
Simon Tao, VP of Wireless Solutions Business Group and General Manager of MBB BU at Fibocom, stated: "We are honored to establish an exclusive partnership with Samsung Electronics, and to be the first to achieve large-scale mass production and market validation in the broader IoT domain. With the simultaneous rollout of multiple regional variants including Fx550-EAU, Fx550-JP, and Fx550-MEA, Fibocom will empower global enterprises to accelerate their growth on the fast lane of high-speed connectivity."
Key Advantages: Fx550 Empowering Industry Digital Transformation
Built on the Samsung Exynos Modem platform, the Fx550 module sets new benchmarks in process technology, transmission standards, and networking flexibility:
- 3GPP Rel.16 Support for Reliable Communications
Fully compliant with 3GPP Release 16, Fx550 delivers lower latency and higher bandwidth, meeting the demands of real-time data transmission and high-capacity connectivity in FWA and IoT applications. - Carrier Aggregation for Breakthrough Speeds
In NR SA mode, Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), achieving peak downlink speeds of up to 4.67Gbps. Its ability to efficiently aggregate fragmented spectrum enhances operator's live network's performance and user experience globally.
In NSA mode, it supports NR 2CC + LTE 5CC aggregation at maximum, with peak downlink speeds up to 6.47Gbps. Under LTE networks, Fx550 supports up to Cat.20 capability, ensuring strong compatibility with global 4G live networks. This advanced carrier aggregation capability improves spectrum utilization and ensures high-speed connectivity even in complex network scenarios. - Open-architecture for Optimized System Cost
Fx550 adopts a high-performance modem architecture and has been deeply adapted with mainstream application processors (APs/Host CPU) such as Broadcom and Realtek. This compatibility provides developers with greater flexibility, reduces development costs, and enables ODMs to create differentiated products.
In addition, Fx550 supports multiple operating systems including Linux, OpenWRT, RDK-B, and PrplOS, facilitating rapid FWA device development, software stack reusement, and seamless upgrades to the latest Wi-Fi Mesh standards, while enhancing Wi-Fi compatibility for CPE devices.
Global Coverage: Multiple Variants for Key Markets
To meet regional certification and deployment requirements, Fx550 is available already in multiple versions, including FM550-EAU (Europe/Asia/Australia), FG550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East & Africa). The modules are now ready to support customers globally with both products and technical services.
The mass production of Fx550 marks a crucial step in Fibocom's global 5G ecosystem strategy. Moving forward, Fibocom will continue to collaborate with global industry partners such as Samsung to lead 5G even 6G innovation and accelerate the widespread adoption of 5G FWA and IoT applications worldwide.
About Fibocom
Fibocom, founded in 1999, is China's first wireless communication module company listed on both the A-share and H-share markets (300638.SZ, 0638.HK). As a global leading provider of wireless communication modules and AI solutions, Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from "Connect Everything" to "Intelligent Connectivity" across diverse industries.
Fibocom's one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.
SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered large-scale mass production. The commercial launch of this product not only marks a significant milestone in the strategic collaboration between Fibocom and Samsung, but also provides high-performance and highly reliable connectivity solutions for global 5G FWA (Fixed Wireless Access) and broadband IoT applications, such as wireless fixed terminals, MiFi devices, and industrial gateways.
Strong Partnership: Elevating 5G Connectivity to New Era
This mass production milestone represents a key achievement in the deep strategic partnership between Fibocom and Samsung. Samsung's 5G chipset solutions have been widely validated through large-scale global deployments, known for their high stability, outstanding RF performance, and broad global compatibility. By integrating their technological strengths, both parties aim to leverage their expertise in chipset architecture and industry applications to accelerate the adoption and expansion of 5G across global vertical industries.
"At Samsung, we are pleased to deepen our strategic collaboration with Fibocom as we advance next generation 5G connectivity for global markets. The successful mass production of Fibocom's Fx550 module highlights our shared commitment to innovation, performance, and reliability in delivering cutting-edge connectivity for FWA and broadband IoT applications. Together, we are building a foundation for smarter, more connected industries in the AI era." – Jungwon Lee, executive vice president and head of the System LSI Modem Development Team at Samsung Electronics
Simon Tao, VP of Wireless Solutions Business Group and General Manager of MBB BU at Fibocom, stated: "We are honored to establish an exclusive partnership with Samsung Electronics, and to be the first to achieve large-scale mass production and market validation in the broader IoT domain. With the simultaneous rollout of multiple regional variants including Fx550-EAU, Fx550-JP, and Fx550-MEA, Fibocom will empower global enterprises to accelerate their growth on the fast lane of high-speed connectivity."
Key Advantages: Fx550 Empowering Industry Digital Transformation
Built on the Samsung Exynos Modem platform, the Fx550 module sets new benchmarks in process technology, transmission standards, and networking flexibility:
- 3GPP Rel.16 Support for Reliable Communications
Fully compliant with 3GPP Release 16, Fx550 delivers lower latency and higher bandwidth, meeting the demands of real-time data transmission and high-capacity connectivity in FWA and IoT applications. - Carrier Aggregation for Breakthrough Speeds
In NR SA mode, Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), achieving peak downlink speeds of up to 4.67Gbps. Its ability to efficiently aggregate fragmented spectrum enhances operator's live network's performance and user experience globally.
In NSA mode, it supports NR 2CC + LTE 5CC aggregation at maximum, with peak downlink speeds up to 6.47Gbps. Under LTE networks, Fx550 supports up to Cat.20 capability, ensuring strong compatibility with global 4G live networks. This advanced carrier aggregation capability improves spectrum utilization and ensures high-speed connectivity even in complex network scenarios. - Open-architecture for Optimized System Cost
Fx550 adopts a high-performance modem architecture and has been deeply adapted with mainstream application processors (APs/Host CPU) such as Broadcom and Realtek. This compatibility provides developers with greater flexibility, reduces development costs, and enables ODMs to create differentiated products.
In addition, Fx550 supports multiple operating systems including Linux, OpenWRT, RDK-B, and PrplOS, facilitating rapid FWA device development, software stack reusement, and seamless upgrades to the latest Wi-Fi Mesh standards, while enhancing Wi-Fi compatibility for CPE devices.
Global Coverage: Multiple Variants for Key Markets
To meet regional certification and deployment requirements, Fx550 is available already in multiple versions, including FM550-EAU (Europe/Asia/Australia), FG550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East & Africa). The modules are now ready to support customers globally with both products and technical services.
The mass production of Fx550 marks a crucial step in Fibocom's global 5G ecosystem strategy. Moving forward, Fibocom will continue to collaborate with global industry partners such as Samsung to lead 5G even 6G innovation and accelerate the widespread adoption of 5G FWA and IoT applications worldwide.
About Fibocom
Fibocom, founded in 1999, is China's first wireless communication module company listed on both the A-share and H-share markets (300638.SZ, 0638.HK). As a global leading provider of wireless communication modules and AI solutions, Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from "Connect Everything" to "Intelligent Connectivity" across diverse industries.
Fibocom's one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
New Milestone Achieved! Fibocom's Fx550 5G Module Based on Samsung Exynos Modem Enters Global Mass Production
TAIPEI, May 28, 2026 /PRNewswire/ -- Compal Electronics Inc. ("Compal"; TWSE: 2324) today announced its collaboration with GMI Cloud, a Silicon Valley-based AI infrastructure provider, to advance the deployment of next-generation AI infrastructure optimized for large-scale inference and emerging agentic AI workloads.
Under this engagement, GMI Cloud will adopt high-performance GPU server platforms designed to support the growing demands of large-scale AI training and inference workloads. The deployment will serve as a key foundation for GMI Cloud's continued expansion in AI-driven services and data-centric applications.
As demand for AI compute continues to accelerate, cloud providers are scaling infrastructure to support increasingly complex workloads, including large language models, large-scale inference services, agentic AI systems, and real-time AI applications. Compal supports this deployment with its expertise in high-density server design, advanced thermal architecture, and system integration, enabling efficient and reliable infrastructure deployment at scale.
"As AI workloads rapidly evolve toward large-scale inference and emerging agentic AI applications, infrastructure requirements are shifting toward higher density, greater efficiency, and faster deployment cycles," said Alan Chang, Vice President of Infrastructure Solutions Business Group at Compal. "We are pleased to support GMI Cloud in building an AI infrastructure optimized for next-generation inference and real-world AI deployment."
"As AI shifts from model experimentation to real-world deployment, scalable inference infrastructure becomes increasingly critical," said Alex Yeh, Founder and CEO of GMI Cloud. "Through this collaboration with Compal, we are expanding the infrastructure foundation needed to support agentic AI workloads and scalable inference services globally."
In addition to the infrastructure deployment, Compal and GMI Cloud will jointly showcase their latest collaboration at COMPUTEX 2026.
At the Compal booth (M0804), visitors will be able to explore GMI Cloud's latest agentic AI and inference-driven application scenarios, demonstrating how advanced infrastructure enables real-world deployment of next-generation AI services.
GMI Cloud will also feature Compal's high-performance AI server platform, the Compal SGX30-2, at its booth (R0302). The system is designed to support NVIDIA HGX B300 platform, delivering the performance and scalability required for large-scale AI training and inference workloads. With an optimized design for high-density deployment, advanced thermal management, and system-level integration, the platform provides a robust foundation for next-generation AI infrastructure.
This collaboration reflects Compal's continued role in supporting emerging cloud providers and AI infrastructure operators as they expand capacity and bring new services to market. With a global manufacturing footprint and a robust supply chain, Compal is well-positioned to support customers in deploying AI systems efficiently across regions.
About Compal
Founded in 1984, Compal is a global technology leader delivering PC platforms, cloud and AI servers, and smart device solutions for leading brands worldwide. Learn more at https://www.compal.com
About GMI Cloud
GMI Cloud is a Silicon Valley-based AI infrastructure company delivering full-stack GPU cloud and AI platform solutions for scalable AI deployment. Learn more at gmicloud.ai.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
Compal and GMI Cloud Announce Collaboration on AI Infrastructure Development
