STOCKHOLM--(BUSINESS WIRE)--Apr 8, 2026--
Today, Nordic Communications Group AB, parent company of Telness Tech, announced it will divest its mobile virtual network operator (MVNO) Telness to Telia in Sweden. As part of the transaction, Telness will sign a long-term agreement with Telness Tech for continued use of the Seamless OS technology platform, ensuring a smooth digital customer experience. At closing, Telia will become the first mobile network operator (MNO) to deploy Seamless OS.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260408876675/en/
"For Seamless OS to be brought into an MNO environment such as Telia's is a defining moment for us. Our platform was initially developed and proven within Telness, enabling it to become one of Europe’s most digitally advanced operators. With Telia's acquisition of Telness, the technology will continue to serve the end customers. Telness will retain its strong digital experience, with the added significant scaling and marketing capabilities that Telia brings," says Martina Klingvall, Founder and CEO, Telness Tech and Nordic Communications Group.
Telness has until now operated as a mobile virtual network operator (MVNO) on Telia Sweden's mobile network. Following completion of the deal, Telness will continue to operate under its own brand as part of Telia's Swedish B2B-business. Next step in the process is for Telia to seek customary approval from the Swedish national authority, the Inspectorate of Strategic Products (ISP), to close the transaction.
“Telness has made an impressive journey and has become a popular choice among small business owners and entrepreneurs, especially startups. This is the result of a strong digital-first operating model, powered by Telness Tech's technology platform Seamless OS, in combination with our national mobile networks. We are looking forward to helping accelerate Telness growth and strengthen our position in this exciting part of the Swedish B2B-market," says Fredrik Stenberg, Head of B2B at Telia Sweden.
Brand transition
As part of the transaction, Telia has acquired the Telness brand. Pending closing of the deal Telness Tech will initiate a rebranding process to change company name and visual identity and continue to operate as an independent technology company.
About Telness Technologies AB (Telness Tech)
Telness Techs’ flagship product, Seamless OS, is a cloud-native platform that enables mobile operators and digital-first companies to launch and evolve mobile services through AI and automation. Originally developed within the Swedish operator Telness AB (Telness)—one of Europe’s highest-rated mobile operators—the platform now powers more than 24 operators globally, supporting telecom companies across the U.S., Europe, and beyond in automating operations and delivering modern, digital customer experiences.
Telness Tech executive leadership team on the announcement that Telia will be the first Mobile Network Operator (MNO) deploying Seamless OS. From the left, Sergio Budkin; CRO, Martina Klingvall; Founder and CEO, Sebastian Stecki; CMO, Pablo Noguerol; COO, Christina Berggren; VP Customer, Delivery & Product, Jonas Cedenwing; Founder and CTO.
KYOTO, Japan--(BUSINESS WIRE)--Jun 15, 2026--
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis tool Ansys HFSS™ and thermal analysis tool Ansys Icepak®, and marks a significant step toward streamlining the simulation workflow for electronic circuit designers. Murata is also the first company to offer passive component simulation models via Ansys Icepak*.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260615241645/en/
As demand for high-speed, high-capacity communications continues to grow, electronic circuit design has become increasingly complex. Engineers must now account for a range of physical phenomena, from electromagnetic interference (EMI) to component heat generation, within a single design. Addressing these challenges early in the design process is critical; overlooking them can trigger costly redesigns, extend development timelines, and drive up prototyping expenses. This has placed greater pressure on electronic component suppliers to provide ready-to-use, high-quality simulation models that are compatible with the tools engineers already rely on.
Developing accurate models for electromagnetic and thermal analysis is inherently challenging, as both electromagnetic behavior and temperature distribution shift considerably depending on design conditions. Murata's vertically integrated approach, spanning raw material development and manufacturing through to final product processing, enables the company to draw on an extensive proprietary dataset, resulting in simulation models that closely reflect real-world component performance.
The models are compatible with Ansys 2026 R1. Ansys HFSS supports electromagnetic field analysis and covers Murata's RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak supports thermal analysis and covers Murata's power inductors.
Looking ahead, Murata will continue to deepen its collaboration with Synopsys, expanding its model lineup to support more advanced and efficient electronic design.
The following data is available for download from Murata's website:
Electromagnetic field analysis data for Ansys HFSS — RF inductors
Electromagnetic field analysis data for Ansys HFSS — MLCCs
Thermal analysis data for Ansys Icepak — Power inductors
For product data inquiries, please contact Murata regarding inductor products here, or capacitor products here.
Notes:
*Based on Murata research as of June 15, 2026.
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.
© 2026 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available athttps://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners.
About Murata
Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.
![[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys](https://image.bastillepost.com/1200x/wp-content/uploads/global/2026/06/da7ee4d6f1274bf9b8538ed33dffd4a3_Synopsys_Murata_Press_Release_3000x2000px.jpg.webp)
[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
