KAOHSIUNG, April 30, 2026 /PRNewswire/ -- E&R Engineering (8027.TW) will showcase advanced laser and plasma solutions at SEMICON Southeast Asia 2026 next week. Targeting critical demands in AI, CPO, and next-generation manufacturing, E&R is partnering with Horng Terng Automation (HTA) and Group Up Industrial (GP) to deliver a fully integrated turnkey solution:
- E&R Engineering: Leading-edge Laser and Plasma processing solutions.
- Horng Terng Automation (HTA): Expertise in integrated thermal interface material (TIM) solutions, incorporating visual AOl inspection technology.
- Group Up Industrial (GP): Laminator, oven, and coater solutions have been successfully implemented into advanced packaging markets—including FOPLP, FOWLP, and TGV—through seamless automated integration.
E&R's 2026 Technology Highlights:
Laser and Plasma Advanced Packaging
- High-precision laser drilling for 2.5D/3D ICs (±5 μm, B/T ratio up to 90%)
- Multi-beam laser marking (±25 μm accuracy, high throughput)
- Controlled thermal laser cutting
- Microwave or RF Plasma cleaning for pre-underfill, surface activation and Redox
- Hybrid plasma solution for high-efficiency dry etching solution
Automation Integration Service (AIS)
Leveraging 30+ years of experience, E&R delivers custom automation meeting complex CIM and factory requirements. By integrating multi-vendor process modules into a unified, high-efficiency system through simulation-driven modeling, we provide a unified UI and a single service window. Our dedicated R&D and sales teams ensure direct engagement and responsive technical support for every project.
FOPLP – Fan-Out Panel Level Packaging (700 × 700 mm)
E&R's total solution supports large panel processes including laser marking, laser cutting, laser descum, plasma cleaning, and post-drill de-smear, with a remarkable warpage control up to 16 mm. The process is further enhanced with laser debonding and plasma dry etching solutions for separation of glass carrier and panel.
Join us at SEMICON SEA 2026 to see how E&R, HTA, and Group Up are driving the future of semiconductor manufacturing — with more precise, efficient, and integrated solutions.
Booth Information
- Booth Number: #1452
- Location: Malaysia International Trade and Exhibition Centre (MITEC)
- Dates: May 5-7, 2026
- E&R Website: https://en.enr.com.tw/
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Leading the AI Wave: E&R Brings Next-Gen Laser and Plasma Tech to SEMICON SEA 2026
Reduces HBM Costs with GPU–Tenstorrent Heterogeneous Distributed Serving
First unveiled at Tenstorrent's launch event, TT-Deploy, in San Francisco on May 1
SANTA CLARA, Calif., May 2, 2026 /PRNewswire/ -- Moreh, an AI infrastructure software company, led by CEO Gangwon Jo, announced that it has successfully validated LLM inference performance on the Tenstorrent Galaxy Wormhole system using its proprietary 'MoAI Inference Framework.'
Based on tests across leading Mixture-of-Experts (MoE) models—including GPT-OSS, Qwen, GLM, and DeepSeek—Moreh achieved LLM inference performance on Tenstorrent Galaxy Wormhole matching or surpassing NVIDIA DGX A100-class systems, demonstrating a compelling alternative to conventional GPU-centric AI infrastructure.
Moreh also improved cost efficiency by implementing a disaggregated serving architecture that combines GPUs with Tenstorrent Wormhole chips. By utilizing Tenstorrent processors as dedicated prefill accelerators, the company reduced reliance on high-cost HBM and lowered overall infrastructure costs.
The results were first unveiled at Tenstorrent's launch event, TT-Deploy, held on May 1 in San Francisco.
As a strategic partner of Tenstorrent and a major external contributor to Metalium, Moreh showcased a live LLM inference demo at the event. Building on its experience operating AMD GPU-based production environments in real-world data centers, the company presented its latest technical achievements in 'Production-Ready LLM Inference on Tenstorrent Galaxy.'
MoAI Inference Framework is a disaggregated inference solution that enables unified operation of heterogeneous GPUs and NPUs—including NVIDIA, AMD, and Tenstorrent—within a single cluster. This allows enterprises to build flexible AI infrastructure strategies without vendor lock-in.
Moreh CEO Gangwon Jo stated, "Achieving production-grade LLM inference performance and stability on Tenstorrent-based systems marks a significant milestone," and added, "We will continue to enhance performance through deeper optimization across heterogeneous architectures and closer integration with Tenstorrent NPUs."
Moreh is developing its own core AI infrastructure engine and, through its foundation LLM subsidiary Motif Technologies, is building end-to-end capabilities spanning both infrastructure and model domains. Simultaneously, the company is making its mark in the global market through collaborations with key partners such as AMD, Tenstorrent, and SGLang.
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MOREH Demonstrates Production-Ready LLM Inference on Tenstorrent Galaxy, Achieving DGX A100-Class Performance with Improved Cost Efficiency
