HO CHI MINH CITY, Vietnam, May 27, 2026 /PRNewswire/ -- Club Med, the global leader in premium all-inclusive holiday experiences, once again delivered strong performance in 2025 in an increasingly challenging macroeconomic and geopolitical environment. Consistent with the performance of the past two years, Club Med continues to deliver solid profitability and resilient growth with key global achievements including:
- Business Volume (BV): €2,222 million, +4% vs. 2024, operating margin up year‑on‑year
- Average Daily Rate: €241, +5% vs. 2024
- Welcomed over 1.4 million travellers worldwide
- Average room occupancy rate: 75.8%, up +1.8 percentage points vs. 2024
- BV growth +10% in mountain Resorts, +4% in sun Resorts, and +5% for Exclusive Collection
- In the East, South Asia, and Pacific (ESAP), BV jumped 13% year-on-year, welcomed over 300,000 guests to 10 regional properties. This was fueled by an increase of 21% in Mountain portfolio spanning Japan, China, and the European Alps, and an impressive 20% rise for the Club Med 2 sailing yacht.
Bruno Courbet, Country Director of Club Med Thailand, Indonesia, India and New Markets, said "Travelers from Vietnam, Philippines, Brunei and other new markets in Southeast Asia are no longer just looking for leisure; they want active, social, and culturally rich experiences. As we expand our footprint in 2026 with new flagship openings like Borneo, we are ready to offer these emerging markets a more vibrant way to explore unique destinations."
As the global travel landscape continues to evolve, three key trends will shape ESAP travellers over the next 12 months are "Whycation," Sports Tourism, and Hushpitality - modern luxury redefined to sensory well-being and decision fatigue elimination.
Club Med is accelerating its global expansion through a strategic pipeline of new flagship resorts and transformative renovations:
- Club Med South Africa Beach & Safari (July 2026): A unique dual-experience coastal resort introducing the brand's first-ever Surf School alongside a safari lodge
- Club Med Borneo, Malaysia (November 2026): A 400-key rainforest property, Asia Pacific's first large-scale, BREEAM-certified beach resort
- Club Med Koh Samui, Thailand (2028): Thailand's first Exclusive Collection beach resort, offering 200 meters of private beachfront
- Club Med Tremblant, Canada (2028): A premium four-season alpine escape in North America
- Club Med San Sicario, Italy (2028): A premium, bi-seasonal mountain haven with direct access to 400km of ski pistes
- Club Med Musandam, Oman (2028): An exclusive 300-room property nestled amidst breathtaking fjords
- Club Med Manado, Indonesia (2029): A premium gateway to pristine marine biodiversity in North Sulawesi
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Club Med celebrates strong performance in 2025 and primed for 2026 expansion
Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI and HPC Accelerate Demand for Advanced Packaging Technologies
MILPITAS, Calif., May 27, 2026 /PRNewswire/ -- SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC). The Glass Core Substrate Market and Development Trends Report examines the emerging market for glass core substrates, a potential next-generation packaging technology attracting increased attention as AI and high-performance computing (HPC) drive demand for larger and more advanced semiconductor packages.
"As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation," said Clark Tseng, Senior Director of Market Intelligence, SEMI. "Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption."
The report highlights increasing industry activity and investment around glass core substrates as companies prepare for the next phase of advanced packaging—providing an independent view of the technology's market potential, development status, key players, and remaining barriers to commercialization. Under the report's market-development scenarios, initial production could begin around 2028 in selected high-performance applications, with adoption expanding over time across larger and more complex package architectures. Based on the average of its Positive, Base, and Negative scenarios, the report projects a compound annual growth rate (CAGR) of 67.2% from 2028 to 2040. It also maps an increasingly active global development ecosystem, with companies and research organizations across Asia, North America and Europe advancing glass core substrate technologies.
Key topics covered in the report include:
- Market outlook and adoption scenarios for glass core substrates
- Technology drivers and barriers to commercialization
- Expected applications in AI, HPC, advanced processors, co-packaged optics, and image sensors
- Company activities across substrates, glass materials, equipment, processing, inspection, and related supply-chain segments
- Development hubs, consortia, and supply-chain structure
- Forecast scenarios through 2040
The Glass Core Substrate Market and Development Trends report is available in English and Japanese editions through SEMI Market Intelligence. Download the report.
For more information, please visit the Glass and Core Substrate: Market and Development Trends page or contact the SEMI Market Intelligence Team at mktstats@semi.org.
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About Global Net Corp.
Global Net Corp. is a Tokyo-based company serving the semiconductor and electronics industries. Established in 1990, the company provides wafer processing, equipment sales, consulting, technical seminars, research groups, and industry publishing services. Its technical and market coverage spans semiconductors, electronics, FPD, packaging, CMP, and related manufacturing processes.
About SEMI
SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology coalitions, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Sherrie Gutierrez/SEMI
Phone: 1-831-889-3800
Email: sgutierrez@semi.org
Stephanie Quinn/Bodewell Group (Media Inquiries)
Phone: 1-480-316-8370
Email: squinn@bodewellgroup.com
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SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors