TAIPEI, June 5, 2026 /PRNewswire/ -- GIGABYTE, the world's leading computer brand, achieved several milestones in overclocking, including a DDR5-13556 MT/s world record with CORSAIR VENGEANCE DDR5 memory and 10 global first overclocking places on G.SKILL 12th Annual OC World Record Stage at Computex 2026. GIGABYTE's renowned overclocker team, led by Hicookie, achieved the DDR5 record-breaking performances with the OC-enthusiast Z890 AORUS TACHYON DUO X ICE motherboard. The team was also invited by G.SKILL to the overclocking event and topped the competition with new accomplishments in several categories achieved by the newly launched X870 AORUS INFINITY.
The highly anticipated G.SKILL event drew elite overclockers from across the globe, including Hicookie, Sergmann, Saltycroissant, Madness777, and Exaberries from Team GIGABYTE, who boldly pushed the boundaries of hardware performance under extreme conditions. During the competition, Team GIGABYTE and the X870 AORUS INFINITY motherboard became the highlight on stage by delivering the unmatched performance of the G.SKILL Trident Z5 RGB memory frequency and 10 global first places in CPU frequency and other benchmarks with AMD Ryzen™ 9 9950X3D2 processors.
"I believe this not only showcased our overclocking prowess but also our commitment to the whole community." Hicookie added after the record-setting performance on stage, "Shout out to G.SKILL for having us here to compete among many of the most talented overclockers around the world. I am happy that our long-term partnership in memory solutions and GIGABYTE's pursuit of extreme performance and reliability have paid off."
Engineered with the innovative CQDIMM technology, the Z890 AORUS TACHYON DUO X ICE motherboard delivers uncompromising memory performance, enhanced signal integrity, and a suite of upgraded features designed for mainstream gamers and performance-first users. The X870 AORUS INFINITY is engineered to achieve the lowest memory latency ever on the AMD X870 platform for a faster, more responsive gaming and computing experience.
These innovative technologies make the GIGABYTE motherboards the best-in-class choice for PC enthusiasts. Please visit the GIGABYTE official website for more product information about Z890 AORUS TACHYON DUO X ICE and X870 AORUS INFINITY motherboards.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
GIGABYTE Achieves DDR5 World Record and 10 Global First Places in Overclocking at COMPUTEX 2026
SAN JOSE, Calif., July 28, 2026 /PRNewswire/ -- FMS 2026 kicks off in California, USA, August 4–6, 2026. Longsys (301308.SZ) will attend under the theme "Edge AI Storage Fusion," showcasing its deep innovation in edge AI storage.
Comprehensive Innovation for Edge AI, Powered by Storage Fusion
Longsys will focus on three core edge AI scenarios, presenting integrated hardware-software solutions built around a redesigned storage architecture that bridges edge AI computing and storage.
The theme "Edge AI Storage Fusion" carries two layers of meaning. Technological fusion: integrating chips, storage, memory, and intelligent scheduling algorithms to break down traditional storage-memory barriers and achieve true storage-compute synergy. Value fusion: redefining storage's role — from a passive data medium to a computing support hub and resource scheduling core for edge AI — aggregating hardware performance, software efficiency, and ecosystem adaptability to enable lower-cost, higher-performance, more scalable edge AI deployment.
This philosophy underpins Longsys's efficient, deployable, and scalable solutions for terminal AI, helping the industry move from technical exploration to commercial scale.
At FMS 2026, Longsys will showcase integrated storage solutions across three mainstream scenarios: AI Box intelligent hosts, AI PC terminals, and AI Mobile embedded devices — addressing common industry pain points such as insufficient compute adaptation, resource scheduling imbalances, high retrofit costs, and stability issues. Leveraging proprietary technology and supply chain synergy, Longsys delivers multidimensional upgrades in performance, efficiency, and cost across diverse terminal scenarios.
Full-Stack Customization via the Storage Foundry Model
Chief Scientist Dr. Chen Jian will present "Intelligence at the Edge: Powered by the Storage Foundry Model," detailing the innovation logic behind this approach.
The Storage Foundry model moves beyond isolated hardware upgrades, spanning the full value chain — chip design, hardware, firmware, packaging, industrial design, packaging & testing, materials, and manufacturing. Deep cross-functional collaboration enables full-stack, efficient customization from design through delivery, representing an innovative business model that Longsys has deeply invested in.
At FMS 2026, Longsys will share its vision for edge AI storage with global partners. Industry peers are invited to join Longsys in California, August 4–6, to explore new opportunities at the intersection of edge AI and storage.
About Longsys
Founded in 1999, Longsys (301308.SZ) is a globally leading branded semiconductor memory enterprise, integrating R&D, design, packaging and testing, manufacturing, and sales services. For more information please visit https://www.longsys.com/, and follow Longsys on LinkedIn and Facebook.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
Longsys to Unveil "Edge AI Storage Fusion" at FMS 2026, Showcasing In-Depth Innovation in Edge AI Storage
Longsys to Unveil "Edge AI Storage Fusion" at FMS 2026, Showcasing In-Depth Innovation in Edge AI Storage
