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HKMA Announces Tender for HK$1.75 Billion 5-Year Government Bonds on June 24, 2026

HK

HKMA Announces Tender for HK$1.75 Billion 5-Year Government Bonds on June 24, 2026
HK

HK

HKMA Announces Tender for HK$1.75 Billion 5-Year Government Bonds on June 24, 2026

2026-06-17 18:06 Last Updated At:18:23

Tender of 5-year HKD HKSAR Institutional Government Bonds to be held on June 24

The following is issued on behalf of the Hong Kong Monetary Authority:

The Hong Kong Monetary Authority (HKMA), as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced today (June 17) that a tender of 5-year HKD Institutional Government Bonds (Bonds) under the Infrastructure Bond Programme will be held on June 24, 2026 (Wednesday), for settlement on June 25, 2026 (Thursday).

A total of HK$1.75 billion 5-year HKD Bonds will be tendered. The Bonds will mature on June 25, 2031 and will carry interest at the rate of 2.96 per cent per annum payable semi-annually in arrear.

Tender is open only to Primary Dealers appointed under the Infrastructure Bond Programme. Anyone wishing to apply for the Bonds on offer can do so through any of the Primary Dealers on the latest published list, which can be obtained from the Hong Kong Government Bonds website at www.hkgb.gov.hk. Each tender must be for an amount of HK$50,000 or integral multiples thereof.

Tender results will be published on the HKMA's website, the Hong Kong Government Bonds website, Bloomberg (GBHK ) and Refinitiv (IBPGSBPINDEX). The publication time is expected to be no later than 3pm on the tender day.

HKSAR Institutional Government Bonds Tender Information

Tender information of 5-year HKD HKSAR Institutional Government Bonds:

Issue Number : 05GB3106001
Stock Code : 4206 (HKGB 2.96 3106)
Tender Date and Time : June 24, 2026 (Wednesday)

9.30am to 10.30am

Issue and Settlement Date : June 25, 2026 (Thursday)
Amount on Offer : HK$1.75 billion
Maturity : 5 years
Maturity Date : June 25, 2031 (Wednesday)
Interest Rate : 2.96 per cent p.a. payable semi-annually in arrear
Interest Payment Dates : June 25and December 25in each year, commencing on the Issue Date up to and including the Maturity Date, subject to adjustment in accordance with the terms of the Institutional Issuances Information Memorandum of the Infrastructure Bond Programme and Government Sustainable Bond Programme (Information Memorandum) published on the Hong Kong Government Bonds website.
Method of Tender : Competitive tender
Tender Amount : Each competitive tender must be for an amount of HK$50,000 or integral multiples thereof. Any tender applications for the Bonds must be submitted through a Primary Dealer on the latest published list.
Other Details : Please see the Information Memorandum available on the Hong Kong Government Bonds websiteor approach Primary Dealers.
Expected commencement date of dealing on

the Stock Exchange

of Hong Kong Limited

: June 26, 2026 (Friday)
Use of Proceeds : The Bonds will be issued under the institutional part of the Infrastructure Bond Programme. Proceeds will be invested in infrastructure projects in accordance with the Infrastructure Bond Framework published on the Hong Kong Government Bonds website.

9.30am to 10.30am

the Stock Exchange

of Hong Kong Limited

Source: AI-found images

Source: AI-found images

FS attends Lujiazui Forum in Shanghai

The Financial Secretary, Mr Paul Chan, arrived in Shanghai this afternoon (June 17) to begin his visit to Shanghai and Nanjing. In the evening, he attended the Plenary Session of the Lujiazui Forum and delivered a speech on "Empowering High-standard Financial Opening-up through Shanghai-Hong Kong Financial Synergy".

Mr Chan said that the country has, for the first time, clearly set out in the 15th Five-Year Plan the acceleration of efforts to build a strong financial nation, providing Hong Kong and Shanghaiwith a shared mission. In the face of a complex geopolitical environment and a new round of technological revolution, international investors have growing demand for diversified asset allocation. Hong Kong and Shanghaishould give full play to their complementary strengths and work in synergy to jointly serve the country's high-level two-way opening-up.

He pointed out that Hong Kong and Shanghai connect the Mainland's enormous market on the one hand and global capital and international rules on the other, serving as important channels for international capital to allocate into Chineseassets. The mutual market access mechanisms between the two places have continued to expand and deepen. More than 70 per cent of the Mainland stocks held by foreign investors are allocated through Stock Connect, while about two-thirds of the Mainland bonds held by overseas investors are accessed through Bond Connect. This reflects international investors'trust in the institutional arrangements, settlement security and regulatory collaboration of the two places. He welcomed the announcement made today by the Chairman of the China Securities Regulatory Commission, Mr Wu Qing, supporting the launch of trading of five-year Renminbi government bond futures in Hong Kong in the near future, noting that this would help improve risk management tools for the Renminbi bond market and attract more international investors to participate in the Mainland government bond market.

Mr Chan said that co-operation between the capital markets of Hong Kong and Shanghaihas continued to deepen. As of May this year, 212 Shanghai enterprises were listed in Hong Kong, with a total market capitalisation of over HK$4.3 trillion. Last year, the Government of the Hong Kong Special Administrative Region and the Shanghai Municipal People's Government signed the Action Plan for Collaborative Development of Shanghai and Hong Kong International Financial Centres. This year, Hong Kong and the Shanghai Gold Exchange established a co-operation mechanism, while Hong Kong Exchanges and Clearing Limited and China Financial Futures Exchange will also sign a Memorandum of Understanding during this Forum, demonstrating that co-operation between the two places is moving from individual projects towards systematic linkage and synergistic development.

Looking ahead, he proposed two directions for co-operation. First, the two places should jointly open up full-chain fundraising and financing channels, promote more innovation and technology enterprises in pursuing two-way financing pathways, and jointly develop exchange-traded funds and index products. They should also promote co-operation in patient capital and long-term capital to support the development of emerging and future industries. Second, the two places should jointly enhance the international functions of Renminbi, enrich investment products and risk management tools, and promote the launch of more "China price" products denominated and settled in Renminbi. At the same time, Hong Kong and Shanghaican speed up efforts to promote the synergistic combination of "industries in Shanghai and offshore treasury in Hong Kong", supporting enterprises to go global in a steadier and better manner.

Mr Chan said that Hong Kong is actively taking forward its first five-year plan to align more closely with the country's 15th Five-Year Plan. Hong Kong and Shanghaihave long enjoyed complementary strengths and mutually beneficial co-operation, and there is broad room for synergistic development in the coming five years. He expressed the hope that the two places would make good use of the power of finance to create tangible value for enterprises and the public.

Others who delivered speeches in the relevant session of the Forum included the Vice Mayor of Shanghai, Mr Wu Wei; former Vice-Chairman of the China Securities Regulatory Commission and Vice-President of the China Society for Finance and Banking, Mr Fang Xinghai; the Secretary for Financial Services and the Treasury, Mr Christopher Hui; the Chief Executive Officer of the Securities and Futures Commission, Ms Julia Leung; andrepresentatives of financial institutions from Hong Kong and Shanghai as well as international think tanks.

Mr Chan will continue his itinerary in Shanghai tomorrow morning (June 18) and proceed toNanjing in the afternoon.

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

FS attends Lujiazui Forum in Shanghai Source: HKSAR Government Press Releases

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