NEW YORK--(BUSINESS WIRE)--Jun 24, 2026--
Qualcomm Technologies, Inc. (NASDAQ: QCOM):
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Highlights:
Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced at its Investor Day, new data center solutions, including the Qualcomm Dragonfly™ C1000 CPU, Qualcomm® High Bandwidth Compute (HBC), Qualcomm Dragonfly™ AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput at lower total cost of ownership. The new platforms highlight Qualcomm Technologies’ growing role in building full‑stack data center infrastructure optimized for AI, spanning agentic and data‑center‑class CPUs, AI inference accelerators, high‑performance connectivity, and at scale custom silicon solutions. The Qualcomm Dragonfly AI300 joins the previously announced Qualcomm Dragonfly AI200 and AI250 in its data center solutions portfolio with an annual cadence AI accelerator roadmap.
“Agentic AI is driving a significant increase in demand for AI inference in the data center. As these become the dominant workloads, infrastructure has to deliver much higher performance at lower power and cost,” said Cristiano Amon, President and CEO of Qualcomm Incorporated. “That plays directly to Qualcomm’s strengths, and we’re well positioned for this shift. With Qualcomm Dragonfly, we’re bringing our high-performance, low-power computing into the data center, with multi-year, multi-generation agreements with leading customers.”
Inference-First Platforms Built for Hyperscalers
Qualcomm Technologies draws on decades of expertise in systems-on-chips (SoCs), low-power design, high-performance processing, and leading IP, combined with experience engineering over 40 billion components, to deliver disaggregated, rack-scale AI infrastructure designed for data-center-grade, agent-intensive AI inference workloads at hyper scale. These innovations enable improved token economics, low latency, simplified integration, scalable deployment, and lower total cost of ownership. As agentic AI dramatically increases token demand, Qualcomm Technologies’ solutions are optimized for tokens-per-watt as the key lever to reduce total cost of ownership (TCO).
“What enterprises need now goes far beyond individual components. Orchestrating multiple types of compute across distributed, always-on infrastructure is critical,” said Tony Pialis, EVP and GM of Data Center, Qualcomm Technologies, Inc. “With Qualcomm Dragonfly, we’re bringing together compute, AI, memory, and connectivity into a unified, rack-scale platform designed for increasingly complex, agent-driven workloads while addressing key bottlenecks in memory bandwidth and power consumption. This builds on what Qualcomm Technologies has been delivering for decades: high-performance, low-power compute at scale, now applied to the data center in a way that very few companies can match.”
From Silicon to Rack: A Disaggregated, Rack-Scale AI Inference Platform
Qualcomm Dragonfly C1000 CPU
Qualcomm High Bandwidth Compute (HBC)
Qualcomm Dragonfly AI300 (Card and Rack)
Custom Silicon
Connectivity
Across the Ecosystem
In addition to the new Qualcomm Dragonfly data center portfolio, Qualcomm Technologies announced a multi-year, multi-generation agreement with Meta.
Qualcomm Technologies and Meta today announced a strategic multi-generation collaboration for Qualcomm Technologies to be a supplier for data center CPUs for Meta. Qualcomm Technologies’ data center CPU, the Qualcomm Dragonfly™ C1000, is planned to power Meta’s next-generation server fleet, underscoring the growing importance of high-performance, power-efficient compute in large-scale, scale-out environments.
Additionally, over 35 global leaders across the technology and AI ecosystems are also sharing their support for Qualcomm Technologies’ data center vision and commercial solutions including Advantest, Arista, Astera, Cirrascale, Compal, Confidential Core AI , Core42, Delta, Fibercop, Foxconn, GIGABYTE Technology, HUMAIN, Inventec, IONOS, Lenovo, Master Works, Microchip Technology, Micron Technology, Nanya Technology, NEC, NeuReality, Quanta, Pegatron Corporation, Samsung SDS, Saptiva AI , SK hynix America, Supermicro, Teradyne, TeraHop, UMC, VAST Data, Viettel IDC, VNPT Group, and Wistron. Read ecosystem partner quotes here.
Qualcomm Technologies is committed to a multi-generation data center roadmap with an annual cadence focused on advancing AI inference performance, energy efficiency, and total cost of ownership. For more information, visit our website.
About Qualcomm
Qualcomm is a global computing leader at the center of the AI era, enabling intelligence to scale from the most personal devices to large‑scale infrastructure. Building on more than four decades of innovation, we develop platforms and solutions that bring together advanced AI, high‑performance low-power computing, and industry‑leading connectivity—powering products and services used around the world. At Qualcomm, we are engineering human progress.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated. Qualcomm, Snapdragon, Qualcomm Dragonwing and Qualcomm Dragonfly are trademarks or registered trademarks of Qualcomm Incorporated.
Qualcomm Unveils Comprehensive Data Center Roadmap for the Agentic AI Era with New Qualcomm Dragonfly Portfolio
Qualcomm Unveils Comprehensive Data Center Roadmap for the Agentic AI Era with New Qualcomm Dragonfly Portfolio
Qualcomm Unveils Comprehensive Data Center Roadmap for the Agentic AI Era with New Qualcomm Dragonfly Portfolio
