SHENZHEN, China, Aug. 18, 2026 /PRNewswire/ -- Baseus has maintained its position as the No. 1 non-smartphone brand globally in clip-on Open Wearable Stereo (OWS) shipments in the first half of 2026, according to the latest data from Omdia. Building on its strong Q1 performance, Baseus continues to demonstrate sustained momentum in the fast-growing open-ear audio category.
"As the OWS category continues to evolve, our priority is to stay focused on what users truly value: exceptional sound, lasting comfort, and products that fit naturally into everyday life," said Shiyou He, Founder of Baseus. "We are grateful for the trust of consumers around the world. This achievement motivates us to keep improving—refining every product detail, strengthening our innovation capabilities, and delivering more meaningful open-ear experiences across every price tier."
"The first half of 2026 indicates that clip-on OWS is moving beyond early category adoption and becoming a more established part of the personal audio market. Baseus' continued position among leading non-smartphone vendors reflects its consistency in this evolving segment, as competition increasingly shifts toward long-term product experience and sustained innovation," said Claire Qin, Research Analyst at Omdia.
This continued momentum is rooted in a simple belief: open-ear listening should feel as effortless as it sounds. The recently launched Baseus MC2 clip-on earbuds bring that belief to life, pairing a lightweight and secure fit with refined ergonomic design for comfortable, all-day wear. With its balance of comfort, sound, and accessible value, MC2 offers an easy entry point for consumers looking to experience clip-on OWS—without compromise.
"Exceptional Sound, All-Day Comfort" remains the guiding principle behind every Baseus open-ear product. Rather than treating comfort and sound as separate trade-offs, Baseus continues to evolve both as one seamless experience—from the fit and feel of a clip-on design to the depth and clarity of every listening moment.
Looking ahead, Baseus will continue pushing the boundaries of clip-on OWS design, sound performance, and intelligent audio experiences. More innovations are set to debut at IFA 2026, where Baseus will unveil its next-generation open-ear products. Stay tuned as Baseus continues to shape what is next for open-ear listening.
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Baseus Retains No. 1 Position Among Non-Smartphone Brands in H1 2026 Clip-On OWS Shipments
Enabling scalable RDL manufacturing for CoPoS, FOPLP and Glass Core TGV applications
TAOYUAN, Aug. 18, 2026 /PRNewswire/ -- Manz Asia, a leading provider of semiconductor advanced packaging equipment and process solutions, has pioneered production-proven ECD (electrochemical deposition) platforms supporting 310 mm, 510 mm, and 700 mm panel formats. Building on ECD as a core technology, Manz Asia integrates key wet process tools—including cleaning, developing, etching, and stripping—into the Omni 310, Omni 510, and Omni 700 platforms to enable scalable panel-level RDL manufacturing.
Extending RDL Process Value from Established Applications to Next-Generation Advanced Packaging
As AI and advanced computing drive increasingly complex chiplet-based architectures, larger interposers and substrates are becoming essential to integrate more heterogeneous components within a single package. This evolution is accelerating the shift from 300 mm wafer-based manufacturing toward larger panel formats, while increasing the importance of RDL in enabling high-density interconnects across increasingly complex package architectures.
With expertise spanning equipment and process integration, Manz Asia addresses evolving RDL manufacturing requirements by integrating ECD and key wet processes within a unified equipment portfolio. This approach helps manufacturers simplify process integration, reduce the complexity of managing multiple equipment suppliers, and gain greater flexibility across panel sizes and advanced packaging architectures.
The Omni Series supports advanced packaging applications including FOPLP, CoPoS, and Glass Core TGV, with proven applications for PMIC and RF devices for communication and automotive markets. The platform also provides a foundation for continued technology development toward emerging AI and HPC packaging requirements.
Glass Core TGV Process Enabling High-Performance Interconnects
As Glass Core gains momentum in next-generation advanced packaging, TGV (Through-Glass Via) manufacturing requires precise glass micromachining, microvia formation, metallization, and high-aspect-ratio filling.
Manz Asia is extending its etching and ECD technologies to address these requirements. Its glass etching equipment supports substrates up to 0.4 mm thick and microvias down to 20 μm, with TGV structures featuring aspect ratios of up to 1:20, enabling precise and controlled via formation.
For TGV metallization, Manz Asia's ECD technology supports high-aspect-ratio via filling and can be integrated with seed-layer sputtering and plating chemistry to enable void-free copper filling and uniform metal deposition. This integrated approach addresses critical requirements for fill quality, plating uniformity, and structural reliability in Glass Core TGV manufacturing.
Advancing Panel-Level Packaging from Innovation to Production
"AI-driven semiconductor growth is accelerating the evolution of advanced packaging, driving greater integration, larger package formats, and increasingly complex interconnect architectures," said Robert Lin, CEO of Manz Asia. "RDL is becoming a critical enabling technology, connecting chips, interposers, substrates, and PCBs across emerging architectures such as CoPoS, FOPLP, and Glass Core TGV."
"Our 310 mm, 510 mm, and 700 mm production-proven RDL platforms reflect our commitment to scalable manufacturing across diverse package architectures and substrate formats," Lin continued. "With a broad portfolio covering most of the key process steps in RDL manufacturing, Manz Asia enables customers to streamline supplier coordination, simplify process integration, and deploy more efficient production solutions."
"Manz Asia's role goes beyond equipment delivery. We work closely with customers to bridge the gap between process innovation and high-volume manufacturing, with a focus on productivity, yield, and cost performance. By combining process expertise, equipment integration, and continuous innovation, we aim to accelerate the adoption of panel-level packaging and contribute to a more robust advanced packaging ecosystem for the AI era."
About Manz Asia
Manz Asia delivers semiconductor equipment and solutions built on core technologies in Electrochemical Deposition (ECD), wet chemistry, digital printing, automation, and software integration. Our expertise covers advanced packaging (FOPLP / CoPoS) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry.
www.manz.com.tw/en
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Manz Asia Pioneers Production-Proven 310/510/700 mm ECD and Wet Process Solutions for Panel-Level Packaging
