Skip to Content Facebook Feature Image

TRUMPF makes glass substrates ready for the next generation of AI chips

Asia Pacific

TRUMPF makes glass substrates ready for the next generation of AI chips
Asia Pacific

Asia Pacific

TRUMPF makes glass substrates ready for the next generation of AI chips

2026-09-01 20:00 Last Updated At:20:06

The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors.

DITZINGEN, GERMANY / TAIPEI, TAIWAN - Media OutReach Newswire - 1 September 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing power into a smaller space in the future, industry leaders are therefore investing in new substrate technologies such as glass substrates. These enable more functions to be integrated into a smaller space and allow data to be transmitted faster and more efficiently within the chip. To achieve this, however, manufacturers must drill millions of microscopic holes into the glass and then coat them with conductive material.

Millions of through-holes must be error-free

TRUMPF has now developed the first industrial process of its kind that enables the production of such structures with high quality and reproducible results. With its HiPIMS products, the high-tech company is supporting the semiconductor industry in bringing glass substrates for the next generation of high-performance AI processors to series production. "The computing power of modern AI chips is increasing rapidly. As a result, the demand for packaging is also growing. Through-glass vias are considered a promising approach for future generations of chips. However, it is crucial that millions of extremely fine structures can be reliably coated. This is exactly where our HiPIMS technology comes into play," says Piotr Lach, Head of Next Technology Demands at TRUMPF Elektronik. The challenge: The holes in the glass substrates are both very deep and very narrow. Even a small number of incorrectly coated through-vias can render an entire glass panel unusable.

For mass production, therefore, reliable processes, consistent results, and a high yield of functional components are crucial. TRUMPF's technology improves process stability and increases production yield compared to conventional methods. This enables TRUMPF to help chip manufacturers economically transition new packaging concepts for AI applications into series production.

HiPIMS products precisely direct charged particles into deep structures

HiPIMS is a particularly high-performance coating process. TRUMPF's industrially manufactured HiPIMS generators produce a highly ionized plasma with a higher proportion of electrically charged particles than conventional methods. These ions can be precisely controlled using additional electric and magnetic fields and directed into deep, narrow structures. This results in a significantly more uniform coating, even in deep trenches.

HiPIMS generates significantly higher ionization, leading to a higher density of deposited molecules. "This improves the quality of the coating. The technology helps increase manufacturing yield and lays the foundation for cost-effective mass production of future AI chips," says Lach.

A Pioneer in the Industry

TRUMPF has many years of experience with HiPIMS technologies in industrial production environments. The company launched its first HiPIMS solutions for other application areas many years ago and has continuously refined the technology. Today, this high-tech company has extensive experience gained from real-world manufacturing processes.

"For our customers, it's not just about technological performance. What matters most is that processes can be scaled and replicated consistently worldwide. With our industrialization expertise and technological lead, we support leading chip manufacturers in bringing advanced packaging technologies into mass production quickly and reliably," says Lach.

TRUMPF covers several key technologies for advanced packaging

In addition to HiPIMS, TRUMPF offers other technologies for advanced packaging. These include ultrashort-pulse lasers for the production of through-glass vias, as well as plasma power supplies for coating and etching processes in semiconductor manufacturing. Together, these technologies form an important foundation for the production of high-performance chips for artificial intelligence, data centers, and high-performance computers.

Please click here to download the media kit.

Digital photographs in print-ready resolution are available to illustrate this press release. They may only be used for editorial purposes. Use is free of charge when credit is given as "Photo: TRUMPF". Graphic editing – except for cropping out the main motif – is prohibited. Additional photos can be accessed at the TRUMPF Media Pool.

Hashtag: #TRUMPF

The issuer is solely responsible for the content of this announcement.

TRUMPF

TRUMPF is a high-tech company offering manufacturing solutions in the fields of machine tools, laser technology and semiconductor industry. It drives digital connectivity in manufacturing through consulting, platform products and software. TRUMPF is one of the technology and market leaders in highly versatile machine tools for sheet metal processing, in the field of industrial lasers and power electronics.

In 2025/26, TRUMPF employed 16,960 people and generated sales of 4.3 billion euros. With about 90 companies, the TRUMPF Group is represented in nearly every European country as well as in North America, South America and Asia. The company has production facilities in Germany, France, the United Kingdom, Italy, Austria, Switzerland, Poland, the Czech Republic, the United States, Mexico and China.

Find out more about TRUMPF at

** This press release is distributed by Media OutReach Newswire through automated distribution system, for which the client assumes full responsibility. **

SINGAPORE – Media OutReach Newswire – 1 September 2026 – The Macao Special Administrative Region (MSAR) Government hosted a reception and the Macao Economic, Trade, Tourism and Investment Promotion Seminar in Singapore on August 31, aiming to practically advance cooperation between Macao and Singapore across multiple official and non-governmental sectors. The event featured over 130 business matching sessions and witnessed the signing of more than 80 agreements, covering key areas such as high technology, traditional Chinese medicine (TCM) and big health, conventions and exhibitions (MICE), tourism, modern finance, and industry-academia-research collaboration.

Macao Economic, Trade and Tourism Investment Promotion Seminar Held in Singapore, Deepening Multi-Domain Cooperation to Empower Regional Growth

Macao Economic, Trade and Tourism Investment Promotion Seminar Held in Singapore, Deepening Multi-Domain Cooperation to Empower Regional Growth

The event gathered over 350 distinguished guests, including Sam Hou Fai, Chief Executive of the MSAR; Gan Siow Huang, Minister of State, Ministry of Foreign Affairs & Ministry of Trade and Industry; representatives from the Embassy of the People's Republic of China in Singapore; members of the MSAR Government delegation; delegates from the Macao-Hengqin and Mainland China economic, trade, and tourism delegation; as well as representatives from Singapore's political, business, cultural, tourism, and trade association sectors.

Sam Hou Fai stated that last June, coinciding with the 35th anniversary of the establishment of diplomatic relations between China and Singapore, Prime Minister Lawrence Wong made a successful visit to China. President Xi Jinping and Prime Minister Wong jointly charted the course for the stable and healthy development of China-Singapore relations in this new phase. He noted that leading the delegation to Singapore this time is both a concrete action to implement the important consensus reached by the leaders of both countries, and a key initiative for Macao to leverage its unique advantages, deepen and expand exchanges and cooperation with Singapore, and inject new momentum into China-Singapore relations.

This year marks the inaugural year of China's "15th Five-Year Plan," and to ensure seamless alignment and coordination, the Macao SAR Government recently promulgated the "Third Five-Year Development Plan for the Economic and Social Development of the Macao Special Administrative Region (2026-2030)." The key strategic deployments of the Plan focus on driving diversified economic development on a solid footing, with four major engineering projects and government-guided funds serving as the primary leverage, while deepening Macao-Hengqin integration to advance the high-quality development of the Guangdong-Macao In-Depth Co-operation Zone in Hengqin. Furthermore, the Plan aims to accelerate urban renewal to build a beautiful and smart Macao, alongside actively participating in the high-quality development of the Guangdong-Hong Kong-Macao Greater Bay Area (GBA) to position Macao as a vital bridgehead for the nation's high-level opening-up and an essential window for mutual learning and exchanges between Chinese and Western civilizations. Concurrently, Macao will actively establish a convenient and highly efficient public service system, fostering a world-class, market-oriented, law-based, and internationalized business environment to earnestly protect the legitimate rights and interests of all market entities and investors, thereby offering foreign investors a more attractive and reliable investment climate.

Gan Siow Huang remarked that Macao and Singapore have long maintained close and friendly relations, achieving fruitful cooperation in fields such as economy, trade, tourism, education, and cultural exchanges. Looking ahead, both sides can leverage their complementary strengths to further deepen cooperation in tourism and urban development, working together to seize new opportunities for regional development and economic growth.

Both Singapore and Macao have established internationally renowned tourism industries and destination brands, allowing the two regions to draw on each other's experiences in crafting premium visitor experiences, developing integrated tourism products, and building vibrant, highly livable cities. Singapore looks forward to sharing practical experiences in tourism industry development with Macao and fostering productive partnerships between their respective business sectors. Furthermore, as enterprises in both regions value their domestic markets while increasingly casting their eyes on broader overseas opportunities, Singapore and Macao can serve as mutually trusted partners to bridge the markets of the Guangdong-Hong Kong-Macao Greater Bay Area (GBA) and Southeast Asia, supporting businesses from both sides in tapping into new opportunities and constructing robust cross-regional networks. At the same time, by pooling corporate strengths, both sides can carve out new avenues of growth in key economic sectors such as digitalization, innovation, sustainable development, and eldercare services.

Hashtag: #MSAR

The issuer is solely responsible for the content of this announcement.

** This press release is distributed by Media OutReach Newswire through automated distribution system, for which the client assumes full responsibility. **

Recommended Articles