Silicon Line®, an EverProX® brand, Launches new Ultra-Low-Power SerDes Chipset MSDL™ (MIPI Serial Data Link), Extending 20 Gbps MIPI D-PHY Connectivity to Tens of Meters

New optical/electrical solution aggregates two simultaneous MIPI-DPHY camera streams, at up to 10 Gbps each, over two serialized links while consuming less than 100 mW per link, eliminating bulky cable bundles with optical fiber or differential copper connectivity. Discover more: https://silicon-line.com/msdl

MUNICH, Sept. 3, 2026 /PRNewswire/ -- EverProX Technologies Munich GmbH, under its Silicon Line® brand—a pioneer in ultra-low-power optical and electrical interconnect technology—today announced the launch of "MSDL™ 20G" which is the first product in the new MSDL™ family, an end-to-end interconnect chipset comprising the SL8582x serializer and SL8581x de-serializer. Engineered to overcome the bandwidth, EMI, and reach limitations of traditional MIPI D-PHY signals, the dual-port chipset delivers up to two simultaneous 10 Gbps serialized links for next-generation vision systems.

Breaking Physical Cabling Bottlenecks

As high-resolution multi-camera systems and high-frame-rate displays drive rapidly increasing bandwidth requirements, traditional copper cabling is increasingly constrained by limited reach and susceptibility to electromagnetic interference (EMI). The "MSDL™ 20G" chipset, comprising SL8582x serializer and SL8581x de-serializer resolves this by aggregating multi-stream video over optical fibers or differential copper pairs, extending link distances to tens of meters while eliminating bulky, shielded cable bundles. The highly integrated architecture delivers ultra-low-power consumption in both optical and electrical modes, with total SerDes power well below 100 mW per 10 Gbps link.

Executive Perspective

"Physical AI is changing the way electronic systems are built. We are seeing more and faster cameras, more sensors, and greater intelligence distributed across devices," said Yifeng Liann, CEO and Managing Director of EverProX Technologies Munich GmbH. "As systems get smarter, moving high-bandwidth data between devices reliably and in real time becomes increasingly challenging. Engineers must balance the flexibility to connect across different subsystems, the reliability that mission-critical applications cannot always get from wireless, and the ultra-low power needed to make it all practical. That's the problem the Silicon Line® team set out to solve: making high-bandwidth connectivity more energy-efficient, more reliable, and easier to integrate into the next generation of intelligent systems."

Key Technical Highlights

• Dual-Port Multi-Camera Aggregation: Supports up to two simultaneous transmissions of single- or stereo-camera streams over one or two serialized links, with one transmission per link
• Optical or Copper Connectivity: Integrated VCSEL drivers and TIA enable optical links over tens of meters, while supporting differential copper links up to 2 meters
• Ultra-Low Power: Consumes just 71 mW per optical link and 87 mW per electrical link, excluding the integrated Sideband SerDes:
• Optical Mode: Serializer 17 mW, De-serializer 54 mW (Typical)
• Electrical Mode: Serializer 27 mW, De-serializer 60 mW (Typical)
• Integrated Bidirectional Sideband SerDes: Transports I²C, GPIO, digital audio, SPI/control signals and sensor clocks alongside MIPI data, reducing cable count, connector complexity, and system components.
• Target Applications:
• AR/VR: Enables lighter, more flexible tethering and greater mobility 
• Medical Endoscopy: Supports 4K/8K imaging, ultra-low heat generation, and thin optical connectivity
• Industrial Robotics and Machine Vision: Delivers reliable, EMI-immune high-speed vision connectivity in electrically noisy environments
• Defense and UAVs: Provides lightweight, low-power multi-camera connectivity that reduces cable weight and increases battery life

• Optical Mode: Serializer 17 mW, De-serializer 54 mW (Typical)
• Electrical Mode: Serializer 27 mW, De-serializer 60 mW (Typical)

• AR/VR: Enables lighter, more flexible tethering and greater mobility 
• Medical Endoscopy: Supports 4K/8K imaging, ultra-low heat generation, and thin optical connectivity
• Industrial Robotics and Machine Vision: Delivers reliable, EMI-immune high-speed vision connectivity in electrically noisy environments
• Defense and UAVs: Provides lightweight, low-power multi-camera connectivity that reduces cable weight and increases battery life

Availability & Ecosystem Support

The MSDL™ 20G (SL8582x&SL8581x) are sampling now with early-access customers in bare die or compact 4×4 mm µBGA-78 packages. Evaluation Kits (EVKs) are available now for link validation. Backed by EverProX's turnkey assembly, customers can transition seamlessly from IC design to mass production. For more information, visit https://www.silicon-line.com/ or contact sales@silicon-line.com.

About EverProX Technologies Munich GmbH and Silicon Line®

Silicon Line® — a brand of EverProX Technologies Munich GmbH — is a leading IC developer of ultra-low-power optical and electrical interconnect solutions for high-speed video and data transmission. Based in Munich, Germany, the Silicon Line® portfolio includes ultra low power MIPI SerDes ICs (from MSDL™ 2G up to MSDL™ 20G), TIA&VCSEL drivers that enable ultra-thin, lightweight, and EMI-immune active optical cables (AOCs) and embedded optical links for VR/AR, medical, industrial, robotics, defense and consumer markets.

Media Contact:

Emre Oralli
Product Marketing Manager 
EverProX Technologies Munich GmbH / Silicon Line® 
Email: emre.Oralli@silicon-line.com
Phone: +49 151 20620735

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Silicon Line®, an EverProX® brand, Launches new Ultra-Low-Power SerDes Chipset MSDL™ (MIPI Serial Data Link), Extending 20 Gbps MIPI D-PHY Connectivity to Tens of Meters

NEW YORK, Sept. 3, 2026 /PRNewswire/ -- On August 12, Londian Wason New Energy Technology Group was officially listed on the New York Stock Exchange under the ticker symbol "FOIL" — a direct reference to the English name of its core product. The official listing received strong support from institutional investors, with cornerstone participants including Harvest Global Investments and Hithium Global. A total of 4,928,571 American Depositary Shares (ADSs) were issued at a price of US$22.00 per ADS, resulting in the total offering size of approximately US$108.43 million (including the over-allotment option).

Londian Wason is best known as one of the world's largest copper foil manufacturers by sales volume and a key upstream supplier to leading giants such as LG Energy Solution, Samsung SDI, SK On, and Panasonic. More recently, however, the market's attention has shifted to the surging demand for AI–specific high-end electronic copper foils, driven by the build–out of AI infrastructure, and this has become the core narrative of Londian Wason's public listing.

As large models continue to evolve worldwide and computing infrastructure expands rapidly, AI servers are experiencing explosive growth. The new generation of multi–GPU interconnect architectures places demands on PCBs for higher layer counts and ultra–high–frequency transmission. Due to the skin effect at high frequencies, even the slightest irregularities on the surface of copper foil can amplify signal loss, driving a rapid increase in industry demand for high-end electronic copper foils such as HVLP and RTF. Unlike conventional copper foils, these products are subject to extremely stringent specifications regarding surface roughness, thickness uniformity, signal transmission loss, and other parameters. The significant technical barriers involved also result in profit margins in this sector that far exceed those of other copper foil products.

Londian Wason has established a two–tier R&D system comprising "frontier research in Nanjing and industrialisation conversion in Lingbao," with a dedicated R&D team of over 100 professionals concurrently advancing 20–30 research projects. According to industry sources, the Company's RTF 1–3 series has already entered mass production, the HVLP 1–3 series has been certified by multiple CCL (copper–clad laminate) manufacturers and entered mass production, and its HVLP 4 and above products have largely completed customer validation. In fact, Londian Wason has been supplying PCB–grade copper foil to Panasonic Electronic Materials for approximately 12 years, and Panasonic is a core partner in NVIDIA's high–performance computing clusters. Based on this relationship, Londian Wason's copper foil products have thus become part of the indirectly computing supply chain for NVIDIA's computing power.

Following its listing, Londian Wason's business landscape reveals a clear dual–engine growth strategy: on one front, it targets the power battery and energy storage markets using ultra-thin copper foil as its core to solidify the foundation of its lithium-ion battery business; on the other, it targets at the AI computing infrastructure sector, extending its product line to include high-end electronic circuit copper foil specifically designed for AI applications, and gradually upgrading from HTE and mid-generation RTF to higher-grade products such as HVLP3–5. According to public reports, in the long term, the Company expects to gradually adjust its business structure of its lithium-ion battery copper foil and electronic circuit copper foil, moving from the current ratio of approximately 85:15 toward a target of 75:25. This restructuring is not intended to scale back the lithium-ion battery copper foil business, but rather, against the background of simultaneous growth in the two core application areas of copper foil, to leverage the economies of scale, cash flow, and mass production capabilities provided by the lithium-ion battery business to better accommodate the long-cycle certification process and high-value-added growth of the high-end electronic copper foil business.

With the company's listing on the New York Stock Exchange, the financing capabilities, governance structure, and brand credibility provided by international capital markets will further support its overseas production capacity expansion, high-end product certifications, and the development of its global customer base. Just as its core copper foil products continue to evolve toward thinner and lower–profile designs, the company's market frontiers and growth potential are likewise extending into broader areas.

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Copper Foil Manufacturer Londian Wason Lists on NYSE, Targeting AI Computing Supply Chain