Semtech Advances Next-Gen AI Optical Interconnects for XPO

CAMARILLO, Calif.--(BUSINESS WIRE)--Sep 21, 2026--

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, today announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), an industry initiative to enable high-bandwidth optical interconnects for AI network infrastructure. As a technology partner to the MSA, Semtech brings a broad portfolio of 200G/lane modulator driver and transimpedance amplifier (TIA) integrated circuits designed to support XPO transceiver development and volume deployment.

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AI infrastructure buildouts continue to demand higher network throughput and bandwidth density at lower power, driving the industry toward new transceiver form factors capable of meeting these requirements at scale. XPO addresses these demands in a groundbreaking new pluggable optical transceiver form factor with industry-leading faceplate density.

“AI requires datacom optics with the highest performance, speed and density, and the market is poised to rapidly shift to 200G/lane electrical solutions this year,” said Scott Wilkinson, lead analyst for optical components at Cignal AI. “As AI operators transition to these high-speed optics, demand will continue to rapidly expand from $9 billion at the start of the AI revolution in 2024 to an estimated $37 billion in 2026.”

“XPO represents an innovative and practical approach to addressing network density challenges while preserving the field-serviceability and configurability benefits of pluggable optics,” said Scott Schube, vice president of applications engineering and product definition at Semtech. “Semtech’s portfolio of high-performance modulator drivers and TIAs is designed to support the XPO ecosystem from early prototyping through volume deployment.”

Semtech’s 200G/lane Optical IC Portfolio for XPO

Semtech provides a broad portfolio of high-performance linear modulator driver and TIA ICs with low power, ultra-low latency and high density designed to support XPO transceiver applications.

Semtech’s XPO product family includes:

Key capabilities of the family include:

About the XPO MSA

The XPO MSA is an industry initiative to define a new 12.8T high-density optical transceiver form factor for AI infrastructure. The current generation delivers 12.8T per module at 200G/lane using an integrated liquid-cooling design, with the MSA outlining a roadmap toward a future generation based on 400G/lane electrical interfaces. The MSA includes module, photonics and technology partners working to accelerate XPO development and deployment.

Semtech will demonstrate its high-speed driver and TIA solutions for XPO and other optical and copper interconnect applications at the European Conference on Optical Communication (ECOC) 2026, booth #2054, from Sept. 21–23 in Málaga, Spain.

About Semtech Corporation

Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected IoT devices worldwide. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.

Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners.

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Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry's transition to XPO for AI network infrastructure

NORTH READING, Mass.--(BUSINESS WIRE)--Sep 21, 2026--

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced Iris 100, a production-ready optical test platform for microLED devices. Teradyne Iris 100 brings semiconductor-grade optical test to microLED manufacturing, measuring every individual emitter in an array and integrating directly with the Teradyne UltraFLEXplus platform for combined optical and electrical test.

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MicroLED technology underpins two of the fastest-moving areas in advanced electronics, augmented reality (AR) microdisplays and optical data interconnects for AI data center architectures. Both depend on devices that contain hundreds of thousands to millions of individual emitters, each of which must be characterized with production-level precision and throughput. Bench-top optical instruments can characterize these devices in the lab, but they cannot deliver the throughput and cost-per-unit economics that volume manufacturing requires.

Teradyne Iris 100 was engineered for high-volume precision manufacturing with its spectrometer and high-resolution camera that measure the spectral response of the array, and per-pixel luminance and uniformity. Advanced test parallelization and image-processing algorithms enable characterization of a full array containing millions of microLEDs with high throughput. Leveraging Teradyne’s widely adopted IG-XL software, Iris 100 detects optical defects such as dead/stuck pixels and cluster defects early in the manufacturing process. Its NIST-traceable calibration workflow enables absolute measurements that correlate lots, wafers, and manufacturing sites.

"MicroLED is shifting from lab to volume production for both AR microdisplays and, increasingly, optical interconnects, which are becoming foundational to how AI data centers scale beyond copper," said Shannon Poulin, president of the Semiconductor Test division at Teradyne. "Both technologies demand per-emitter test at production throughput, and Iris 100 delivers that today on test infrastructure our customers already run at scale."

Teradyne Iris 100 follows the introduction of Teradyne Photon 100 for silicon photonics and co-packaged optics test earlier this year and the acquisition of photonic test specialist Quantifi Photonics in 2025, extending Teradyne’s test capabilities across the full spectrum of emerging optical test requirements. Iris 100 supports wafer and final test, letting manufacturers add microLED test to fleets they already run, with a roadmap to support photodetector test capabilities in the same insertion.

For more information, find Teradyne at ECOC, stand 2118, September 21-23 in Malaga, Spain, and visit teradyne.com/products/iris-100.

About Teradyne

Teradyne (NASDAQ: TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its semiconductor and electronics test solutions span the full AI device supply chain, from wafer to data center, enabling customers to meet the quality and reliability standards the AI era demands. Its advanced robotics business deploys intelligent automation across manufacturing, logistics, and data center operations for customers worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

Teradyne Iris 100 brings semiconductor-grade optical test to microLED manufacturing, measuring every individual emitter in an array and integrating directly with the Teradyne UltraFLEXplus platform for combined optical and electrical test.