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Cognex Launches New Wafer Reader to Help Semiconductor Manufacturers Scale Production

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Cognex Launches New Wafer Reader to Help Semiconductor Manufacturers Scale Production
Business

Business

Cognex Launches New Wafer Reader to Help Semiconductor Manufacturers Scale Production

2026-09-23 21:10 Last Updated At:22:05

In-Sight 1750® helps chipmakers maintain throughput and product quality as demand for advanced semiconductors grows

NATICK, Mass., September 23, 2026 /PRNewswire/ -- Cognex Corporation (NASDAQ: CGNX), the global technology leader in industrial machine vision, today announced the launch of the In-Sight® 1750 Series, a next-generation wafer and panel identification system designed to help semiconductor manufacturers reduce disruptions, improve traceability, and maintain throughput.

As semiconductor manufacturers expand capacity to support AI infrastructure, advanced computing, and next-generation electronics, the ability to accurately track wafers throughout production has become increasingly important. Even a small number of missed reads can create delays, increase work, and impact equipment efficiency.

The In-Sight 1750 helps manufacturers overcome these challenges by reliably reading many difficult wafer and panel markings and IDs, including various degraded marks and challenging substrates that often require intervention. Building on Cognex's long-standing leadership in wafer identification, the system brings together Cognex's latest AI innovations, advanced imaging, and purpose-built illumination to help manufacturers maintain traceability and throughput in challenging semiconductor environments. The result is often fewer interruptions, more consistent process control, and greater confidence in manufacturing operations.

"Investment in AI infrastructure is driving a new wave of expansion across the semiconductor industry, and chipmakers are being asked to bring new capacity online faster than ever while maintaining the highest quality standards," said Matt Moschner, President and CEO of Cognex. "The In-Sight 1750 combines our latest AI technology with decades of semiconductor expertise to help manufacturers scale production without sacrificing quality or traceability."

Key customer benefits

  • More reliable wafer traceability, helping manufacturers maintain quality and process control throughout fabrication and packaging.
  • Fewer production disruptions, reducing the need for operator intervention and manual troubleshooting.
  • Faster upgrades, allowing existing users to transition from previous-generation systems without extensive redesign.
  • Higher equipment utilization, helping manufacturers maintain throughput even when reading difficult marks on challenging wafer and substrate materials.

The In-Sight 1750 is designed to fit seamlessly into existing operations. By integrating advanced AI capabilities into a wafer identification platform refined through decades of semiconductor experience, the system helps manufacturers improve traceability and throughput without requiring significant changes to existing processes. Built with current In-Sight 1740 users in mind, it supports job conversion and straightforward upgrades, helping manufacturers transition to next-generation wafer identification with minimal disruption while taking advantage of Cognex's latest AI-powered capabilities. A new web-based setup experience simplifies configuration and helps users get up and running quickly, while built-in read logging supports quality and process control.

About Cognex Corporation
For over 40 years, Cognex has been making advanced machine vision easy, paving the way for manufacturing and distribution companies to become faster, smarter, and more efficient through automation.

Innovative technology in our vision sensors and systems solves critical manufacturing and distribution challenges, providing unparalleled performance for industries from automotive to consumer electronics to packaged goods.

Cognex makes these tools more capable and easier to deploy thanks to a longstanding focus on AI, helping factories and warehouses improve quality and maximize efficiency without needing highly technical expertise.

We are headquartered near Boston, USA, with locations in over 30 countries and more than 30,000 customers worldwide. Learn more at cognex.com.

Media Contact
Liz Bradley
Head of Communications
Cognex Corporation
pr@cognex.com

IR Contact
Greer Aviv
Head of Investor Relations
Cognex Corporation
ir@cognex.com

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Cognex Launches New Wafer Reader to Help Semiconductor Manufacturers Scale Production

Cognex Launches New Wafer Reader to Help Semiconductor Manufacturers Scale Production

BARCELONA, Spain, Sept. 23, 2026 /PRNewswire/ -- The sixth edition of Tomorrow.Mobility World Congress (TMWC), the global event accelerating the transition to sustainable, inclusive and smart urban mobility, will be held at the Gran Via venue of Fira de Barcelona from 3 to 5 November 2026. Under the theme "Mobility solutions, real impact", the congress will bring together more than 5,000 attendees, over 200 exhibitors and over 240 speakers.

Co-organized by Fira de Barcelona and EIT Urban Mobility, an initiative of the European Institute of Innovation and Technology, TMWC will focus on how cities can seize the tools and strategies developed in recent years to build today the urban mobility of tomorrow. Key topics guiding discussions include Mobility Data Spaces, Mobility as a Service (MaaS) as a driver of seamless multimodal schemes, curbside and parking management as strategic infrastructure, and the arrival of autonomous vehicle (AV) mobility.

The congress will feature three dedicated stages – Main Stage, Move better Stage, and Shaping mobility Stage – and a program covering designing resilient, integrated mobility systems, delivering next-generation public transport, managing urban space in the e-mobility transition, and battery waste management and the circular economy of electric mobility, among other topics.

Among the confirmed speakers headlining the program are Lukas Neckermann, founder of Urban Places Lab and Co-Founder of PAVE Europe; Axel Volkery, Head of the Innovation and Urban Mobility Unit at the European Commission's Directorate-General for Mobility and Transport (DG MOVE); and Teresa Riesgo Alcaide, Secretary General for Innovation at the Spanish Ministry of Science and Innovation.

Exhibition and Innovation zones

TMWC 2026 will include an exhibition area and an Innovation Playground that will showcase cutting-edge solutions from across the mobility ecosystem. Among the confirmed exhibitors are Arrive Group, BIP, Drive Sweden, Government of Catalonia – Departament de Territori, Kentkart, Moventis, PNO Innovation, Ulaşimpark, and Soltráfego.

The event's Startup Zone will highlight disruptive mobility technologies and platforms, offering opportunities for collaboration and investment.

A global event shaping urban futures

As in previous editions, TMWC will be held alongside Smart City Expo World Congress; Tomorrow.Blue Economy, focused on the sustainable use of ocean resources; the Barcelona Deep Tech Summit, organized by Barcelona Activa; and the Barcelona Cybersecurity Congress. Together these events will gather more than 1,000 exhibitors and over 25,000 attendees, transforming Fira de Barcelona into the world's largest hub for urban innovation.

 

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Tomorrow.Mobility 2026 drives real impact on the future of urban mobility

Tomorrow.Mobility 2026 drives real impact on the future of urban mobility

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