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Beyond 3D Printing: xTool Partners with MIT Museum, Fab Foundation, and MIT CBA to Redefine the Future of Rapid Prototyping

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Beyond 3D Printing: xTool Partners with MIT Museum, Fab Foundation, and MIT CBA to Redefine the Future of Rapid Prototyping
Business

Business

Beyond 3D Printing: xTool Partners with MIT Museum, Fab Foundation, and MIT CBA to Redefine the Future of Rapid Prototyping

2026-10-14 15:04 Last Updated At:16:45

xTool President Jessie Liu presents "Rapid Prototyping: Beyond 3D Printing," highlighting next-generation laser and UV printing platforms while showcasing groundbreaking multidisciplinary research from the MIT Center for Bits and Atoms (CBA).

CAMBRIDGE, Mass., Oct. 14, 2026 /PRNewswire/ -- xTool, a global leader in desktop digital fabrication solutions, partnered with the MIT Museum, the Fab Foundation, and the MIT Center for Bits and Atoms (CBA) to host a landmark technology talk titled "Rapid Prototyping: Beyond 3D Printing" at the MIT Museum in Cambridge, Massachusetts. Featuring a keynote address by xTool President Jessie Liu, collaborative research presentations from MIT CBA, and live hardware demonstrations, the event explored how advanced laser and digital fabrication tools are supporting new applications in scientific research, education, distributed production, and fine arts.

Redefining Rapid Prototyping Beyond 3D Printing

For years, rapid prototyping was almost synonymous with 3D additive printing. During her keynote speech, Jessie Liu challenged this narrow view, presenting a broader paradigm driven by precise energy application, multi-wavelength laser manipulation, and full-color UV printing on diverse materials.  

"Rapid prototyping was never really about a single machine—it is about tightening the loop between an idea and a tangible object you can hold, test, and learn from," said Jessie Liu, President of xTool. "By combining advanced multi-laser engineering with high-precision digital printing, we are enabling creators and engineers to move seamlessly from concept to finished prototype on a single workbench." 

To demonstrate these capabilities, xTool showcased its latest innovations:

  • xTool X1 (All-In-One Laser Platform): Featuring the breakthrough Hybrid Motion™ System—which unifies gantry scale and high-speed galvo scanning into a single coordinated four-axis system—and Laser Swap™ technology, allowing multiple laser sources (CO₂, Diode, Fiber, MOPA, UV) to operate through a unified precision optical head.  
  • xTool O1 Omni Printer: A multi-surface UV printing platform featuring Pixel-Scan™ Vision Technology for true 1:1 distortion-free positioning, enabling full-color printing and 3D raised texture across rigid, flexible, and fabric materials.

MIT CBA Research: Desktop Fabrication Driving Interdisciplinary Innovation

Highlighting the deep academic and research synergy between xTool and leading research institutions, researchers, alumni, and artists from the MIT Center for Bits and Atoms (CBA) and MIT Media Lab presented real-world applications of xTool's creator ecosystem across cutting-edge science, engineering, and creative art:

  • Powering Advanced Electronics & Cryogenic Hardware: Prof. Wedyan Babatain presented her recently published paper in Advanced Science ("Laser-Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices"), demonstrating E-LIG (selectively electroplated laser-induced graphene). Utilizing xTool CO₂ lasers, the process enables maskless patterning of conductive circuits with double-sided vias down to 50 µm trace widths, seamlessly integrating tactile sensors, heaters, and electrothermal actuators directly onto flexible substrates. Additionally, Alex Wynn (Adiabatic Machines / MIT CBA) demonstrated how they use the xTool F2 Ultra and F2 Ultra UV (MOPA and UV) to fabricate flexible copper test interfaces for superconducting digital circuits operating near 4 Kelvin, enabling rapid physical iteration of cryogenic hardware.  
  • Expanding UV Printing & Custom Applications: Dr. Camron Blackburn (Co-founder and CTO of Adiabatic Machines) presented the applications of the xTool O1 Omni Printer, demonstrating direct UV printing on custom mosaic tiles and paying tribute to structural origami designs and glassblowing art.  
  • Reinventing Robotics, RF & Field Fabrication: The Voxel Assembly Team demonstrated using xTool MetalFab and P2 laser systems for prototyping metal sheet parts, robotic voxel assemblies, and structural components for Toyota personal mobility prototypes. Furthermore, Dr. Quentin Bolsée and Alan Han illustrated rapid PCB iteration, RF ring resonator engraving, and motor control board production for remote Fab Labs.  
  • Bridging AI, Photography & Fine Arts: Eitan Wolf (MIT Media Lab) highlighted 2D-to-3D laser engraving workflows driven by Midjourney, Gemini, and xTool Atomm AI on the F2 Ultra UV. Meanwhile, Alfonso Parra Rubio, Peter Houk and Erik Strand utilized xTool MetalFab to cut and weld custom metal molds on-demand for glassblowing, and photographer Jacob Geiger showcased transmissive photographic works printed directly onto plate glass using xTool UV printers.

Following the academic presentations, attendees gathered at the nearby Fab Hub Kendall for an exclusive hands-on experience, marking the first offline public live demonstration of the xTool X1. Amid enthusiastic audience engagement, attendees watched separate live production demos of both the xTool X1 and xTool O1 Omni Printer, experiencing firsthand how each machine transformed raw materials into finished creations through precision laser cutting and high-resolution UV printing.

"1% for the Makers": Sustaining Global Innovation & Education

Reaffirming its dedication to educational empowerment, xTool hosted its "1% for the Makers" donation ceremony during the event. Under this pledge, xTool commits 1% of its annual net profit in products to schools, non-profits, and makerspaces globally in partnership with the Fab Foundation and Make:.  

With over $1M in total donations distributed across more than 100+ global partners to date, xTool announced new equipment grants to student organizations and campus innovation chapters at premier institutions—including Yale University, Massachusetts College of Art and Design (MassArt), and MIT CBA. By bridging human imagination and physical creation (Mens et Manus), xTool continues to empower the next generation of researchers, designers, and innovators.

About xTool

xTool is a global premium consumer-tech brand dedicated to empowering digital-to-physical creation. As the world's largest and fastest-growing laser engraver innovator, xTool provides a comprehensive ecosystem of laser-based personal creative tools, material printers, user-friendly software, accessories, and consumables. Through these innovations, xTool empowers creators to turn imagination into meaningful creations that deliver emotional fulfillment, commercial success, and personal achievement. Discover more at xtool.com.

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

Beyond 3D Printing: xTool Partners with MIT Museum, Fab Foundation, and MIT CBA to Redefine the Future of Rapid Prototyping

Beyond 3D Printing: xTool Partners with MIT Museum, Fab Foundation, and MIT CBA to Redefine the Future of Rapid Prototyping

Beyond 3D Printing: xTool Partners with MIT Museum, Fab Foundation, and MIT CBA to Redefine the Future of Rapid Prototyping

Beyond 3D Printing: xTool Partners with MIT Museum, Fab Foundation, and MIT CBA to Redefine the Future of Rapid Prototyping

VIENNA, Oct. 14, 2026 /PRNewswire/ -- At NetworkX 2026, Fibocom is showcasing the U6G evolution of its flagship 5G-A FWA module, FG390. Powered by the MediaTek T930 platform, the newly introduced FG390-MEA-30 variant supports U6G (NR n104) and cross-band carrier aggregation with Sub-6GHz, equipping FWA devices for the next phase of 5G-Advanced network evolution.

Upper 6GHz spans 6425 - 7125MHz, providing 700MHz of spectrum with substantial contiguous bandwidth to increase network capacity and throughput. It creates new opportunities for 10-gigabit home broadband, 8K streaming, cloud gaming and immersive AR/VR experiences, as well as enterprise wireless access and smart campus networking.

U6G is moving from technical validation toward commercial deployment worldwide. e& UAE has launched commercial Upper 6GHz network deployment, while Zhejiang Mobile has demonstrated downlink throughput exceeding 10Gbps. European operators are advancing 6GHz spectrum trials and field validation, while markets in Latin America and Central Asia are progressing with live-network testing and use-case validation.

The FG390 adds support for NR n104 and enables U6G to work alongside Sub-6GHz, supporting cross-band carrier aggregation combinations including CA_n41A-n104A and CA_n78A-n104A. Built on the 3GPP Release 18 MediaTek T930 platform, it supports peak 5G downlink speeds of up to 10Gbps. By combining U6G bandwidth with established Sub-6GHz coverage, the module enables higher throughput while maintaining reliable connectivity.

Designed for CPEs, outdoor ODUs and enterprise gateways, the FG390-MEA-30 helps customers simplify product development, streamline certification processes and accelerate time to market.

Evan Su, General Manager of Wireless Communications at MediaTek, stated, "The MediaTek T930 platform is designed to enable high-performance FWA solutions for the next stage of wireless broadband evolution. Working together with Fibocom, we are extending U6G capabilities on T930 and help accelerate 5G-Advanced FWA innovation."

Sunzhi Liu, General Manager of Fibocom's MBB Business Unit, said, "As U6G moves toward commercialization, operators and device makers need to turn new spectrum capabilities into deployable FWA products faster. FG390 provides a flexible path to next-generation FWA development by combining U6G and Sub-6GHz capabilities. We will continue working with MediaTek, global operators and device partners to advance U6G validation and commercialization."

About Fibocom

Fibocom, founded in 1999, is China's first wireless communication module company listed on both the A-share and H-share markets. Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from "Connect Everything" to "Intelligent Connectivity" across diverse industries.

Fibocom's one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

Fibocom FG390 Brings Industry-Leading Support for U6G, Advancing 5G-A FWA Toward 10-Gigabit Wireless Broadband

Fibocom FG390 Brings Industry-Leading Support for U6G, Advancing 5G-A FWA Toward 10-Gigabit Wireless Broadband

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