Hong Kong Launches Alliance of Universities for Enhanced Vocational Education and Training Development

Alliance of Universities of Applied Sciences officially launched

The Government announced today (November 11) that, with support from the Education Bureau (EDB), the Alliance of Universities of Applied Sciences was officially launched, signifying a new journey for the development of vocational and professional education and training (VPET). The Alliance comprises four post-secondary institutions as founding members, with the Hong Kong Metropolitan University (HKMU) and Saint Francis University (SFU) as full members, and Tung Wah College (TWC) and the Technological and Higher Education Institute of Hong Kong (THEi) as associate members.

Speaking at the launch ceremony, the Deputy Chief Secretary for Administration, Mr Cheuk Wing-hing, said that he was pleased that the Government's direction of developing universities of applied sciences (UAS) has received strong support from various sectors. He said he was also glad to see that UAS and other aspiring post-secondary institutions responded to the Government's policies proactively to establish the Alliance, promoting VPET development with concerted efforts and supporting Hong Kong's development into an international post-secondary education hub.

He said that he looked forward to all sectors of society and the Alliance to continue strengthening collaboration, achieving co-operation between industries and education, as well as integration of science and education, and, through sharing of experience and resources, enhance the quality and recognition of VPET, thereby jointly nurturing applied talent for contribution to the development of Hong Kong and the country.

Guests attending the ceremony included the Secretary for Education, Dr Choi Yuk-lin; the Permanent Secretary for Education and Chairman of the Steering Committee on the Alliance, Ms Michelle Li; the Chairman of the Hong Kong Council for Accreditation of Academic and Vocational Qualifications, Mr Rock Chen; representatives of member institutions of the Alliance, namely, the President of the HKMU, Professor Paul Lam; the Acting President of SFU, Professor Lo Tit-wing; the President of TWC, Professor Sally Chan; and the President of THEi, Professor Alan Lau; and representatives from over 80 supporting organisations which included enterprises, chambers of commerce, industry organisations, think tanks, quasi-government organisations, and educational and charitable organisations.

The Alliance also invited representatives from the Chinese General Chamber of Commerce, Hong Kong; the Chinese Manufacturers' Association of Hong Kong; the Federation of Hong Kong Industries; and the Hong Kong General Chamber of Commerce, to a panel discussion. They exchanged and shared insights on how the industries could collaborate with UAS and other post-secondary institutions under the Government's strategy of fostering industry-institution collaboration and diversified development for promoting VPET development and nurturing quality talent with applied knowledge and skills.

As announced in "The Chief Executive's 2024 Policy Address", the Government will continue to press ahead with the development of UAS in Hong Kong. It has allocated a start-up fund of $100 million to support the establishment of the Alliance, which will embark on joint promotions with industries and stakeholders, including organising international conferences, strengthening exchanges and collaboration with applied sciences institutions from other places, and initiating collaboration and research on applied education at the post-secondary level.

All UAS may apply to become full members of the Alliance, whereas institutions aspiring to become UAS may apply to become associate members. The HKMU serves as the secretariat of the Alliance. The EDB has established the Steering Committee on the Alliance to advise on the development and strategy of the Alliance, as well as approving and supervising the use of the start-up fund.

Alliance of Universities of Applied Sciences officially launched Source: HKSAR Government Press Releases

Alliance of Universities of Applied Sciences officially launched Source: HKSAR Government Press Releases

Alliance of Universities of Applied Sciences officially launched Source: HKSAR Government Press Releases

Applications open for Sir Edward Youde Memorial Overseas Fellowships and Scholarships 2027/28

The following is issued on behalf of the Sir Edward Youde Memorial Fund Council:

The Sir Edward Youde Memorial (SEYM) Fund Council reminded interested applicants today (August 3) that the SEYM Overseas Fellowships and Scholarships and the SEYM Overseas Fellowships and Scholarships for Disabled Students for the 2027/28 academic year have been open for applications since June 22. The closing date is September 4, 2026.

The fellowships and scholarships aim at encouraging outstanding students to pursue further studies in renowned institutions overseas. Awardees should aspire to contribute to Hong Kong and be ready to give back to the community upon graduation.

The fellowships are for overseas studies leading to postgraduate degrees either by research or coursework. The maximum value of a fellowship is HK$300,000 per year, tenable for up to three years for a doctoral degree or two years for a master's degree. The scholarships are for overseas studies leading to undergraduate degrees. The maximum value of a scholarship is HK$280,000 per year, tenable for up to three years.

The applicants will be responsible for fulfilling all application procedures and admission requirements of the academic institutions of their choice.

Information notes for the applications are available on the website of the Student Finance Office of the Working Family and Student Financial Assistance Agency (www.wfsfaa.gov.hk/en/resources/forms/form.htm). Applicants should submit the completed form through the GovHK website (eform.cefs.gov.hk/form/sfo031/en/). For details, please visit the website of the Sir Edward Youde Memorial Fund (www.wfsfaa.gov.hk/sfo/seymf/en/whatwedo/index.htm), or call (852) 3752 8711 or (852) 3752 8704.

Shortlisted applicants of the Overseas Fellowships and Scholarships will be invited to attend interviews in Hong Kong. The first round of interviews is scheduled for December 2026 or January 2027. If found suitable, applicants will be invited for a final interview to be held in January or February 2027. For the Overseas Fellowships and Scholarships for Disabled Students, shortlisted applicants will be invited to attend an interview in Hong Kong in January or February 2027.

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