Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing

CARLSBAD, Calif.--(BUSINESS WIRE)--Jun 10, 2025--

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.

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PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.

PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.

Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.

Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.

About Nordson Electronics Solutions

Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed.

About Nordson Corporation

Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com.

Nordson’s industry-leading ASYMTEK Vantage® Series fluid dispensing system equipped with the ASYMTEK IntelliJet® Jetting system is driving innovations for underfilling during semiconductor advanced packaging. Nordson worked with Powertech Technology, Inc. (PTI) to develop a panel-level packaging (PLP) solution that achieves yields greater than 99% for underfilling during semiconductor manufacturing. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures. PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency in the transition from 300-mm wafers to panels.

COPENHAGEN, Denmark (AP) — The Danish foreign minister said Monday his country insists that everyone, including the United States, must respect “the territorial integrity of the Kingdom of Denmark” after President Donald Trump ‍​announced ​the appointment of a ‌special envoy to Greenland, who said his goal would be to make the territory part of the U.S.

Greenland's prime minister said that the territory is happy to cooperate with other countries, including the U.S., but stressed that “we decide our own future.” Denmark's foreign minister said in later comments to Danish broadcasters that he plans to summon the U.S. ambassador.

Trump called repeatedly during his presidential transition and the early months of his second term for U.S. jurisdiction over Greenland, a vast, semi-autonomous territory of Denmark, and has not ruled out military force to take control of the mineral-rich, strategically located Arctic island. In March, Vice President JD Vance visited a remote U.S. military base in Greenland and accused Denmark of underinvesting there.

The issue gradually drifted out of the headlines, but in August, Danish officials summoned the U.S. ambassador following a report that at least three people with connections to Trump had carried out covert influence operations in Greenland. Denmark is a NATO ally of the United States.

On Sunday, Trump announced the appointment of Louisiana Gov. Jeff Landry as ‌special envoy to Greenland, saying that “Jeff understands how essential Greenland is to our National Security, and will strongly advance our Country’s Interests for the Safety, Security, and Survival of our Allies, and indeed, the World.”

Landry wrote in a post on X that “it’s an honor to serve you in this volunteer position to make Greenland a part of the U.S.”

Danish Foreign Minister Lars Løkke Rasmussen said in a brief statement emailed by his ministry that “the appointment confirms the continued American interest in Greenland.”

"However, we insist that everyone — including the U.S. — must show respect for the territorial integrity of the Kingdom of Denmark,” he added.

Danish broadcasters TV2 and DR reported that, in comments from the Faroe Islands later Monday, Løkke Rasmussen said he will call in the U.S. ambassador in Copenhagen, Kenneth Howery, for a meeting at the ministry.

Greenland's prime minister, Jens-Frederik Nielsen, wrote on Facebook that the country had again woken up to a new announcement from the U.S. president, but it “does not change anything for us at home.”

Nielsen wrote that “Greenland belongs to the Greenlanders, and its territorial integrity must be respected.” He said that the territory is happy to cooperate with other nations, but that must always be done with respect for Greenlanders and their values and wishes.

Earlier this month, the Danish Defense Intelligence Service said in an annual report that the U.S. is using its economic power to “assert its will” and threaten military force against friend and foe alike.

FILE - Vice President JD Vance and second lady Usha Vance tour the U.S. military's Pituffik Space Base in Greenland, Friday, March 28, 2025. (Jim Watson/Pool via AP, File)

FILE - Denmark's Foreign Minister Lars Loekke Rasmussen speaks during a Security Council meeting at the United Nations headquarters, Tuesday, Sept. 23, 2025, at U.N. headquarters. (AP Photo/Yuki Iwamura, File)