ST. LOUIS, Nov. 18, 2025 /PRNewswire/ -- MSI, a leading global provider of high-performance server solutions, showcases its next-generation computing and AI innovations at SuperComputing 2025 (SC25), Booth #205. MSI introduces its ORv3 rack solution and a comprehensive portfolio of power-efficient, multi-node, and additional AI-optimized platforms built on NVIDIA MGX and desktop NVIDIA DGX, designed for high-density environments and mission-critical workloads. These modular, scalable and rack-scale solutions are engineered for maximum performance, energy efficiency, and flexibility, enabling modern and next-generation data centers to accelerate deployment and scale with ease.
"Through close collaboration with industry leaders AMD, Intel, and NVIDIA, MSI continues to drive innovation across the data center ecosystem," said Danny Hsu, General Manager of the Enterprise Platform Solutions at MSI. "Our goal is to deliver scalable, energy-efficient infrastructure that empowers customers to accelerate AI development and next-generation computing with performance, reliability, and flexibility at scale."
Scaling Data Center Performance — From DC-MHS Architecture to Rack Solutions
MSI's data center building blocks are developed on the DC-MHS (Datacenter Modular Hardware System) architecture, spanning host processor modules, Core Compute servers, Open Compute servers, and AI computing servers. This modular design standardizes hardware components, BMC architecture, and form factors, simplifying operations and reducing deployment complexity. With EVAC CPU heatsink support, data centers can maintain thermal efficiency while rapidly adapting to the growing demands of AI, analytics, and compute-intensive workloads. MSI's modular approach empowers operators to deploy next-generation infrastructure faster and achieve time-to-market value.
ORv3 Rack — Designed for Next-Generation Data Centers
MSI's ORv3 21" 44OU rack is a fully validated, integrated solution that combines power, thermal, and networking systems to streamline engineering and accelerate deployment in hyperscale environments. Featuring sixteen CD281-S4051-X2 2OU DC-MHS servers, the rack utilizes centralized 48V power shelves and front-facing I/O, maximizing space for CPUs, memory, and storage while maintaining optimal airflow and simplifying maintenance.
Single-Socket AMD EPYC™ 9005 Server in ORv3 Architecture:
- CD281-S4051-X2: 2OU 2-node server with 12 DDR5 DIMM slots and 12 E3.S 1T PCIe 5.0 x4 NVMe bays per node
DC-MHS Core Compute Servers — High-Density, Scalable Data Center Solutions
MSI's Core Compute platforms maximize rack density and resource efficiency by integrating multiple compute nodes into a single high-density chassis. Each node is powered by either AMD EPYC 9005 Series processors (up to 500W TDP) or Intel® Xeon® 6 processors (up to 500W/350W TDP). Available in 2U 4-node and 2U 2-node configurations, these platforms deliver exceptional thermal performance and scalability for today's data centers.
Single-Socket AMD EPYC 9005 Servers
- CD270-S4051-X4: 2U 4-node server with 12 DDR5 DIMM slots and 3 PCIe 5.0 x4 U.2 NVMe bays per node.
- CD270-S4051-X2: 2U 2-node server with 12 DDR5 DIMM slots and 6 PCIe 5.0 x4 U.2 NVMe bays per node.
Single-Socket Intel Xeon 6 Servers
- CD270-S3061-X4: 2U 4-node server with 16 DDR5 DIMM slots and 3 PCIe 5.0 x4 U.2 NVMe bays per node.
- CD270-S3071-X2: 2U 2-node server with 12 DDR5 DIMM slots and 6 PCIe 5.0 x4 U.2 NVMe bays per node.
DC-MHS Enterprise Servers — High-Efficiency Platforms for Cloud Workloads
Built on the DC-MHS architecture, MSI's enterprise server platforms deliver exceptional memory capacity, extensive I/O options, and high TDP CPU compatibility to handle demanding cloud, virtualization, and storage applications. Supporting both AMD EPYC 9005 Series and Intel Xeon 6 processors, these modular solutions provide flexible performance for diverse data center workloads.
Single-Socket AMD EPYC 9005 Servers
- CX271-S4056: 2U server with 24 DDR5 DIMM slots and configurations of 8 or 24 PCIe 5.0 U.2 NVMe bays
- CX171-S4056: 1U server with 24 DDR5 DIMM slots and 12 PCIe 5.0 U.2 NVMe bays.
Dual-Socket Intel Xeon 6 Servers
- CX270-S5062: 2U server with 32 DDR5 DIMM slots and configurations of 8 or 24 PCIe 5.0 U.2 NVMe bays.
- CX170-S5062: 1U server with 32 DDR5 DIMM slots and 12 PCIe 5.0 U.2 NVMe bays.
Next-Generation AI Solutions Accelerated by NVIDIA
MSI introduces a new era of AI computing solutions, built on the NVIDIA MGX and NVIDIA DGX Station reference architectures. The lineup includes AI servers and AI station supporting the latest NVIDIA Hopper GPUs, NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, and NVIDIA Blackwell Ultra GPUs, engineered to meet diverse deployment needs, from large-scale data center training to edge inferencing and AI development on the desktop.
MSI's AI servers are purpose-built for high-performance computing and AI workloads. The 4U AI platforms offer flexible configurations with both Intel Xeon and AMD EPYC processors, supporting up to 600W GPUs for maximum performance. These platforms are ideal for large language models (LLMs), deep learning training, and NVIDIA Omniverse workloads.
AI Servers
- CG481-S6053: Dual AMD EPYC 9005 CPUs, eight PCIe 5.0 x16 FHFL dual-width GPU slots, 24 DDR5 DIMMs, eight 2.5-inch U.2 NVMe bays, and eight 400G Ethernet ports powered by NVIDIA ConnectX-8 SuperNICs.
- CG480-S5063: Dual Intel Xeon 6 CPUs, eight PCIe 5.0 x16 FHFL dual-width GPU slots, 32 DDR5 DIMMs, and twenty PCIe 5.0 E1.S NVMe bays.
- CG290-S3063: 2U AI server powered by a single Intel Xeon 6 CPU with 16 DDR5 DIMMs and four FHFL dual-width GPU slots (up to 600W each), ideal for edge computing and small-scale inference deployments.
AI Station
For developers demanding data center-level performance in a workstation form factor, the MSI AI Station CT60-S8060 brings the power of the NVIDIA DGX Station to the desktop. Built with the NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip and up to 784GB of unified memory, it delivers unprecedented compute performance for developing, training, and deploying large-scale AI models all from the deskside.
Supporting Resources:
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
MSI Accelerates AI and Data Center Innovation with Next-Gen Server Solutions at SC25
- Company named "Best Financially Managed Semiconductor Company (Achieving Greater than $1 Billion in Annual Sales)" and "Outstanding Asia-Pacific Semiconductor Company" simultaneously
- Accelerates recovery from market downturn leveraging world-class HBM leadership; Global management performance recognized
- Reflects company's technology leadership and customer-centric execution
- SK Chairman Chey Tae-won emphasizes: "Technological competitiveness must remain unwavering in challenging times"
- Commits to driving new customer value and leading global AI market growth as a "Full-Stack AI Memory Creator"
SEOUL, South Korea, Dec. 7, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has been named the winner of the Best Financially Managed Semiconductor Company Award (Achieving Greater than $1 Billion in Annual Sales)[1] and the Outstanding Asia-Pacific Semiconductor Company Award[2] at the Global Semiconductor Alliance (GSA)[3] Awards 2025, held on December 4 PST in Santa Clara, California.
| [1]The Best Financially Managed Semiconductor Company Award: A category recognizing public semiconductor companies based on financial soundness and operational efficiency. Awards are presented in two categories — annual sales over $1 billion and annual sales under $1 billion — and are considered among the most authoritative honors in the global semiconductor industry. |
| [2]Outstanding Asia-Pacific Semiconductor Company Award: A special category recognizing semiconductor companies headquartered in the Asia-Pacific region based on comprehensive evaluations including product excellence, business vision, leadership, and market success. |
| [3]GSA(Global Semiconductor Alliance): A global CEO-level semiconductor organization serving as a hub for technological information sharing across more than 25 countries and over 250 corporate members. |
The GSA Awards, organized annually since 1996, are regarded as the most prestigious honors in the global semiconductor sector, recognizing outstanding performance in leadership, financial results and industry reputation. SK hynix secured its second win in the financial management category following 2017, and its first recognition as the top Asia-Pacific semiconductor company. The dual achievement reinforces the company's reputation as a leading global technology innovator.
While the semiconductor industry faced a severe downturn just two years ago, the company has been the fastest to rebound thanks to its advanced AI memory technologies including HBM. This performance has resulted in global recognition for its operational excellence and financial execution. SK hynix plans to continue building sustainable growth with its dominant leadership in the AI memory market.
The awards reflect the company's proactive delivery of groundbreaking HBM solutions and its steadfast commitment to customer-centric performance in surging global AI demand. SK Chairman Chey Tae-won has consistently emphasized that securing technological competitiveness must remain unwavering, especially during challenging times. This long-term focus on technology investment and global cooperation network has contributed to the company's improved performance and reinforced financial health.
Driven by this strategy, SK hynix has recorded historic performance throughout 2025. For the first three quarters, the company reported revenue of 64 trillion won and operating profit of 28 trillion won in total, positioning it well to surpass its previous full-year earnings record set in 2024 (66 trillion won in revenue and 23 trillion won in operating profit).
Financial health has also significantly strengthened. As of the end of the third quarter, cash and cash equivalents reached 27.9 trillion won, up 10.9 trillion won quarter-over-quarter, while interest bearing debt decreased to 24.1 trillion won— successfully transitioning into a net cash position of approximately 4 trillion won.
To secure long-term leadership in AI memory, SK hynix is accelerating major investments. The Cheongju M15X fab, which opened its cleanroom earlier than planned in October, is on track to begin HBM mass production in the first half of next year. Construction of the first fab in the Yongin Semiconductor Cluster, launched in February, is also progressing ahead of schedule.
With its recent financial achievements and continued expansion, SK hynix is expected to further solidify its AI memory leadership going forward.
SK hynix was represented at the ceremony by Justin Kim, President & Head of AI Infra at SK hynix, and Sungsoo Ryu, President of SK hynix America. "It is a great honor to receive this award." Kim said, "We will continue to lead the market and create new value for customers as a Full-Stack AI Memory Creator, driving growth across the global AI ecosystem."
About SK hynix Inc.
SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.
SEOUL, South Korea, Dec. 7, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has been named the winner of the Best Financially Managed Semiconductor Company Award (Achieving Greater than $1 Billion in Annual Sales)[1] and the Outstanding Asia-Pacific Semiconductor Company Award[2] at the Global Semiconductor Alliance (GSA)[3] Awards 2025, held on December 4 PST in Santa Clara, California.
| [1]The Best Financially Managed Semiconductor Company Award: A category recognizing public semiconductor companies based on financial soundness and operational efficiency. Awards are presented in two categories — annual sales over $1 billion and annual sales under $1 billion — and are considered among the most authoritative honors in the global semiconductor industry. |
| [2]Outstanding Asia-Pacific Semiconductor Company Award: A special category recognizing semiconductor companies headquartered in the Asia-Pacific region based on comprehensive evaluations including product excellence, business vision, leadership, and market success. |
| [3]GSA(Global Semiconductor Alliance): A global CEO-level semiconductor organization serving as a hub for technological information sharing across more than 25 countries and over 250 corporate members. |
[1]The Best Financially Managed Semiconductor Company Award: A category recognizing public semiconductor companies based on financial soundness and operational efficiency. Awards are presented in two categories — annual sales over $1 billion and annual sales under $1 billion — and are considered among the most authoritative honors in the global semiconductor industry.
[2]Outstanding Asia-Pacific Semiconductor Company Award: A special category recognizing semiconductor companies headquartered in the Asia-Pacific region based on comprehensive evaluations including product excellence, business vision, leadership, and market success.
[3]GSA(Global Semiconductor Alliance): A global CEO-level semiconductor organization serving as a hub for technological information sharing across more than 25 countries and over 250 corporate members.
The GSA Awards, organized annually since 1996, are regarded as the most prestigious honors in the global semiconductor sector, recognizing outstanding performance in leadership, financial results and industry reputation. SK hynix secured its second win in the financial management category following 2017, and its first recognition as the top Asia-Pacific semiconductor company. The dual achievement reinforces the company's reputation as a leading global technology innovator.
While the semiconductor industry faced a severe downturn just two years ago, the company has been the fastest to rebound thanks to its advanced AI memory technologies including HBM. This performance has resulted in global recognition for its operational excellence and financial execution. SK hynix plans to continue building sustainable growth with its dominant leadership in the AI memory market.
The awards reflect the company's proactive delivery of groundbreaking HBM solutions and its steadfast commitment to customer-centric performance in surging global AI demand. SK Chairman Chey Tae-won has consistently emphasized that securing technological competitiveness must remain unwavering, especially during challenging times. This long-term focus on technology investment and global cooperation network has contributed to the company's improved performance and reinforced financial health.
Driven by this strategy, SK hynix has recorded historic performance throughout 2025. For the first three quarters, the company reported revenue of 64 trillion won and operating profit of 28 trillion won in total, positioning it well to surpass its previous full-year earnings record set in 2024 (66 trillion won in revenue and 23 trillion won in operating profit).
Financial health has also significantly strengthened. As of the end of the third quarter, cash and cash equivalents reached 27.9 trillion won, up 10.9 trillion won quarter-over-quarter, while interest bearing debt decreased to 24.1 trillion won— successfully transitioning into a net cash position of approximately 4 trillion won.
To secure long-term leadership in AI memory, SK hynix is accelerating major investments. The Cheongju M15X fab, which opened its cleanroom earlier than planned in October, is on track to begin HBM mass production in the first half of next year. Construction of the first fab in the Yongin Semiconductor Cluster, launched in February, is also progressing ahead of schedule.
With its recent financial achievements and continued expansion, SK hynix is expected to further solidify its AI memory leadership going forward.
SK hynix was represented at the ceremony by Justin Kim, President & Head of AI Infra at SK hynix, and Sungsoo Ryu, President of SK hynix America. "It is a great honor to receive this award." Kim said, "We will continue to lead the market and create new value for customers as a Full-Stack AI Memory Creator, driving growth across the global AI ecosystem."
About SK hynix Inc.
SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
SK hynix Honored with Two Major Titles at GSA Awards 2025
