Skip to Content Facebook Feature Image

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

Business

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
Business

Business

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

2025-12-09 14:44 Last Updated At:15:05

TAIPEI, Dec. 9, 2025 /PRNewswire/ -- 

Data Center AI Chip Shipments Continue to Grow

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips (such as Google's TPUs), AI server CPUs, and networking/interconnect-related chips (e.g., Switch ASICs/rack-scale-up Interconnect Chips/DPUs & NICs).

In terms of growth rate, the fastest-growing segments by shipment volume include application-specific AI chips, mid-range GPUs that use GDDR DRAM (such as Nvidia CPX GPUs), and interconnect-related chips, such as NVSwitch ICs. Among these five chip categories, the shipment volume growth rates for high-end GPUs and AI server CPUs are relatively lower over the 2024–2030 period, with a Compound Annual Growth Rate (CAGR) of only about 10%. However, when considering the revenue from high-end packaging and end-market sales, the growth rate will be much higher than the shipment growth rate. The main reasons for this include the increased content value per chip and the adoption of advanced packaging.

For example, AMD recently forecast that the global server CPU revenue Total Addressable Market (TAM) CAGR will reach 18% between 2025 and 2030 (implying that the Average Selling Price CAGR for server CPUs could exceed 7% due to the jump in core count and the adoption of more advanced processes and packaging). For GPUs, despite relatively moderate growth in shipments, wafer foundry and packaging revenue CAGRs are both expected to exceed 40% in 2024-2030, driven by the increasing number of GPU and I/O dies per chip.

Data Center AI Chip Packaging Revenue Remains Focused on GPUs

Recently, application-specific AI chips like Google's TPU and AWS's Trainium have garnered significant attention for their tailored power-efficiency characteristics, sparking speculation that they might replace GPUs. According to the latest "Global Data Center AI Chip Packaging Market Forecast 2024-2030" report published by DIGITIMES Asia, the overall revenue share of data center AI chip packaging will remain GPU-centric throughout the 2024–2030 forecast period. It is estimated that by 2030, packaging revenue for data center GPUs will remain over 40% higher than that of application-specific AI chips.

While AI server CPUs and AI networking-related chips have high shipment volumes, the high-end packaging market will still be overwhelmingly dominated by GPUs and application-specific AI chips.

Drivers and Inhibitors for Advanced Packaging of Data Center AI Chips

DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%. This aligns closely with AMD's recent Financial Analyst Day estimate that the global Data Center TAM CAGR will exceed 40% over the next five years.

Here is a summary of the main drivers and inhibitors for the global market for advanced packaging of data center AI chips:

Key Drivers:

  • The AI wave and the compute power arms race among tech giants.
  • Advanced packaging driving system-level scaling to extend Moore's Law.
  • Geopolitical competition between the U.S. and China, and the rise of Sovereign AI initiatives.

Key Inhibitors:

  • The re-evaluation of return on investment (ROI) relative to massive computing power investments.
  • The impact of cheaper and more efficient new technologies.

For more details on AI Chip, and the future outlook for major AI chip packaging technologies in data centers, check out: AI Chip packaging https://www.digitimes.com/reports/ai/2025_ai_chip_packaging

 

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

SINGAPORE, Jan. 16, 2026 /PRNewswire/ -- Panduit, a global leader in electrical and network infrastructure solutions, announced the promotion of Holly Garcia to Chief Commercial Officer on 13 January 2026. In this role, Garcia will lead the company's global commercial strategy, focusing on the company's commitment to innovation and delivering a best-in-class experience for customers. Garcia will report directly to Panduit President, Marc Naese.

"Holly has the vision and expertise to position our company for continued growth and success while deepening our customer relationships," said Naese. "Holly's leadership as Chief Commercial Officer will be instrumental in strengthening the customer experience and delivering the value our markets expect."

In her most recent role as Vice President of Panduit's Data Center business unit, Garcia spearheaded global growth and innovation initiatives. She led the development of business strategy and directed new product introductions to strengthen Panduit's position in the rapidly evolving data center market. With more than 25 years of experience in sales, marketing, and business unit leadership, Garcia brings a proven track record of driving commercial success and transformative growth.

"I'm honored to take on the role of Chief Commercial Officer and excited to lead our commercial strategy during this time of growth," explained Garcia. "Our team's commitment to innovation and customer success has positioned us as a trusted partner globally, and I look forward to driving even greater value for our customers and stakeholders."

About Panduit

Panduit is a leading global manufacturer of high-quality electrical and network infrastructure and connectivity solutions. Operating from our headquarters in Tinley Park, Ill., USA, and across 112 worldwide locations, we drive innovation through strategic R&D investments and breakthrough product development while providing seamless global support and service. Since 1955, our commitment to our customers and partners has remained constant. And together, with them, we create exceptional solutions that support their businesses in a way that's good for them and good for the world. Panduit is making the connections that matter. For more information, visit www.panduit.com.

SINGAPORE, Jan. 16, 2026 /PRNewswire/ -- Panduit, a global leader in electrical and network infrastructure solutions, announced the promotion of Holly Garcia to Chief Commercial Officer on 13 January 2026. In this role, Garcia will lead the company's global commercial strategy, focusing on the company's commitment to innovation and delivering a best-in-class experience for customers. Garcia will report directly to Panduit President, Marc Naese.

"Holly has the vision and expertise to position our company for continued growth and success while deepening our customer relationships," said Naese. "Holly's leadership as Chief Commercial Officer will be instrumental in strengthening the customer experience and delivering the value our markets expect."

In her most recent role as Vice President of Panduit's Data Center business unit, Garcia spearheaded global growth and innovation initiatives. She led the development of business strategy and directed new product introductions to strengthen Panduit's position in the rapidly evolving data center market. With more than 25 years of experience in sales, marketing, and business unit leadership, Garcia brings a proven track record of driving commercial success and transformative growth.

"I'm honored to take on the role of Chief Commercial Officer and excited to lead our commercial strategy during this time of growth," explained Garcia. "Our team's commitment to innovation and customer success has positioned us as a trusted partner globally, and I look forward to driving even greater value for our customers and stakeholders."

About Panduit

Panduit is a leading global manufacturer of high-quality electrical and network infrastructure and connectivity solutions. Operating from our headquarters in Tinley Park, Ill., USA, and across 112 worldwide locations, we drive innovation through strategic R&D investments and breakthrough product development while providing seamless global support and service. Since 1955, our commitment to our customers and partners has remained constant. And together, with them, we create exceptional solutions that support their businesses in a way that's good for them and good for the world. Panduit is making the connections that matter. For more information, visit www.panduit.com.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

Panduit Strengthens Commitment to Customer Excellence with Appointment of Holly Garcia to Chief Commercial Officer

Panduit Strengthens Commitment to Customer Excellence with Appointment of Holly Garcia to Chief Commercial Officer

Recommended Articles