Supermicro Expands NVIDIA Blackwell Portfolio with New 4U and 2-OU (OCP) Liquid-Cooled NVIDIA HGX B300 Solutions Ready for High-Volume Shipment

• Introducing 4U and 2-OU (OCP) liquid-cooled NVIDIA HGX B300 systems for high-density hyperscale and AI factory deployments, supported by Supermicro Data Center Building Block Solutions^® with DLC-2 and DLC technology, respectively
• 4U liquid-cooled NVIDIA HGX B300 systems designed for standard 19-inch EIA racks with up to 64 GPUs per rack, capturing up to 98% of system heat through DLC-2 (Direct Liquid-Cooling) technology
• Compact and power-efficient 2-OU (OCP) NVIDIA HGX B300 8-GPU system designed for 21-inch OCP Open Rack V3 (ORV3) specification with up to 144 GPUs in a single rack

SAN JOSE, Calif., Dec. 10, 2025 /PRNewswire/ -- Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, today announced the expansion of its NVIDIA Blackwell architecture portfolio with the introduction and shipment availability of new 4U and 2-OU (OCP) liquid-cooled NVIDIA HGX B300 systems. These latest additions are a key part of Supermicro's Data Center Building Block Solutions (DCBBS) that deliver unprecedented GPU density and power efficiency for hyperscale data centers and AI factory deployments.

"With AI infrastructure demand accelerating globally, our new liquid-cooled NVIDIA HGX B300 systems deliver the performance density and energy efficiency that hyperscalers and AI factories need today," said Charles Liang, president and CEO of Supermicro. "We're now offering the industry's most compact NVIDIA HGX B300 solutions—achieving up to 144 GPUs in a single rack—while reducing power consumption and cooling costs through our proven direct liquid-cooling technology. Through our DCBBS, this is how Supermicro enables our customers to deploy AI at scale: faster time-to-market, maximum performance per watt, and end-to-end integration from design to deployment."

For more information, please visit https://www.supermicro.com/en/accelerators/nvidia

The 2-OU (OCP) liquid-cooled NVIDIA HGX B300 system, built to the 21-inch OCP Open Rack V3 (ORV3) specification, enables up to 144 GPUs per rack to deliver maximum GPU density for hyperscale and cloud providers requiring space-efficient racks without compromising serviceability. The rack-scale design features blind-mate manifold connections, modular GPU/CPU tray architecture, and state-of-the-art component liquid cooling solutions. The system propels AI workloads with eight NVIDIA Blackwell Ultra GPUs at up to 1,100W TDP each, while dramatically reducing rack footprint and power consumption. A single ORV3 rack supports up to 18 nodes with 144 GPUs total, scaling seamlessly with NVIDIA Quantum-X800 InfiniBand switches and Supermicro's 1.8MW in-row coolant distribution units (CDUs). Combined, eight NVIDIA HGX B300 compute racks, three NVIDIA Quantum-X800 InfiniBand networking racks, and two Supermicro in-row CDUs form a SuperCluster scalable unit with 1,152 GPUs.

Complementing the 2-OU (OCP) model, the 4U Front I/O HGX B300 Liquid-Cooled System offers the same compute performance in a traditional 19-inch EIA rack form factor for large-scale AI factory deployments. The 4U system leverages Supermicro's DLC-2 technology to capture up to 98% of heat generated¹ by the system through liquid-cooling, achieving superior power efficiency with lower noise and greater serviceability for dense training and inference clusters.

Supermicro NVIDIA HGX B300 systems unlock substantial performance speedups, with 2.1TB of HBM3e GPU memory per system to handle larger model sizes at the system level. Above all, both the 2-OU (OCP) and 4U platforms deliver significant performance gains at the cluster level by doubling compute fabric network throughput up to 800Gb/s via integrated NVIDIA ConnectX^®-8 SuperNICs when used with NVIDIA Quantum-X800 InfiniBand or NVIDIA Spectrum-4 Ethernet. These improvements accelerate heavy AI workloads such as agentic AI applications, foundation model training, and multimodal large scale inference in AI factories.

Supermicro developed these platforms to address key customer requirements for TCO, serviceability, and efficiency. With the DLC-2 technology stack, data centers can achieve up to 40 percent power savings¹, reduce water consumption through 45°C warm water operation and eliminate chilled water and compressors in data centers. Supermicro DCBBS delivers the new systems as fully validated, tested racks ready as L11 and L12 solutions before shipment, accelerating time-to-online for hyperscale, enterprise, and federal customers.

These new systems expand Supermicro's broad portfolio of NVIDIA Blackwell platforms — including the NVIDIA GB300 NVL72, NVIDIA HGX B200, and NVIDIA RTX PRO 6000 Blackwell Server Edition. Each of these NVIDIA-Certified Systems from Supermicro are tested to validate optimal performance for a wide range of AI applications and use cases – together with NVIDIA networking and NVIDIA AI software, including NVIDIA AI Enterprise and NVIDIA Run:ai. This provides customers with flexibility to build AI infrastructure that scales from a single node to full-stack AI factories.

¹https://www.supermicro.com/en/solutions/liquid-cooling

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

• Introducing 4U and 2-OU (OCP) liquid-cooled NVIDIA HGX B300 systems for high-density hyperscale and AI factory deployments, supported by Supermicro Data Center Building Block Solutions^® with DLC-2 and DLC technology, respectively
• 4U liquid-cooled NVIDIA HGX B300 systems designed for standard 19-inch EIA racks with up to 64 GPUs per rack, capturing up to 98% of system heat through DLC-2 (Direct Liquid-Cooling) technology
• Compact and power-efficient 2-OU (OCP) NVIDIA HGX B300 8-GPU system designed for 21-inch OCP Open Rack V3 (ORV3) specification with up to 144 GPUs in a single rack

SAN JOSE, Calif., Dec. 10, 2025 /PRNewswire/ -- Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, today announced the expansion of its NVIDIA Blackwell architecture portfolio with the introduction and shipment availability of new 4U and 2-OU (OCP) liquid-cooled NVIDIA HGX B300 systems. These latest additions are a key part of Supermicro's Data Center Building Block Solutions (DCBBS) that deliver unprecedented GPU density and power efficiency for hyperscale data centers and AI factory deployments.

"With AI infrastructure demand accelerating globally, our new liquid-cooled NVIDIA HGX B300 systems deliver the performance density and energy efficiency that hyperscalers and AI factories need today," said Charles Liang, president and CEO of Supermicro. "We're now offering the industry's most compact NVIDIA HGX B300 solutions—achieving up to 144 GPUs in a single rack—while reducing power consumption and cooling costs through our proven direct liquid-cooling technology. Through our DCBBS, this is how Supermicro enables our customers to deploy AI at scale: faster time-to-market, maximum performance per watt, and end-to-end integration from design to deployment."

For more information, please visit https://www.supermicro.com/en/accelerators/nvidia

The 2-OU (OCP) liquid-cooled NVIDIA HGX B300 system, built to the 21-inch OCP Open Rack V3 (ORV3) specification, enables up to 144 GPUs per rack to deliver maximum GPU density for hyperscale and cloud providers requiring space-efficient racks without compromising serviceability. The rack-scale design features blind-mate manifold connections, modular GPU/CPU tray architecture, and state-of-the-art component liquid cooling solutions. The system propels AI workloads with eight NVIDIA Blackwell Ultra GPUs at up to 1,100W TDP each, while dramatically reducing rack footprint and power consumption. A single ORV3 rack supports up to 18 nodes with 144 GPUs total, scaling seamlessly with NVIDIA Quantum-X800 InfiniBand switches and Supermicro's 1.8MW in-row coolant distribution units (CDUs). Combined, eight NVIDIA HGX B300 compute racks, three NVIDIA Quantum-X800 InfiniBand networking racks, and two Supermicro in-row CDUs form a SuperCluster scalable unit with 1,152 GPUs.

Complementing the 2-OU (OCP) model, the 4U Front I/O HGX B300 Liquid-Cooled System offers the same compute performance in a traditional 19-inch EIA rack form factor for large-scale AI factory deployments. The 4U system leverages Supermicro's DLC-2 technology to capture up to 98% of heat generated¹ by the system through liquid-cooling, achieving superior power efficiency with lower noise and greater serviceability for dense training and inference clusters.

Supermicro NVIDIA HGX B300 systems unlock substantial performance speedups, with 2.1TB of HBM3e GPU memory per system to handle larger model sizes at the system level. Above all, both the 2-OU (OCP) and 4U platforms deliver significant performance gains at the cluster level by doubling compute fabric network throughput up to 800Gb/s via integrated NVIDIA ConnectX^®-8 SuperNICs when used with NVIDIA Quantum-X800 InfiniBand or NVIDIA Spectrum-4 Ethernet. These improvements accelerate heavy AI workloads such as agentic AI applications, foundation model training, and multimodal large scale inference in AI factories.

Supermicro developed these platforms to address key customer requirements for TCO, serviceability, and efficiency. With the DLC-2 technology stack, data centers can achieve up to 40 percent power savings¹, reduce water consumption through 45°C warm water operation and eliminate chilled water and compressors in data centers. Supermicro DCBBS delivers the new systems as fully validated, tested racks ready as L11 and L12 solutions before shipment, accelerating time-to-online for hyperscale, enterprise, and federal customers.

These new systems expand Supermicro's broad portfolio of NVIDIA Blackwell platforms — including the NVIDIA GB300 NVL72, NVIDIA HGX B200, and NVIDIA RTX PRO 6000 Blackwell Server Edition. Each of these NVIDIA-Certified Systems from Supermicro are tested to validate optimal performance for a wide range of AI applications and use cases – together with NVIDIA networking and NVIDIA AI software, including NVIDIA AI Enterprise and NVIDIA Run:ai. This provides customers with flexibility to build AI infrastructure that scales from a single node to full-stack AI factories.

¹https://www.supermicro.com/en/solutions/liquid-cooling

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

Supermicro Expands NVIDIA Blackwell Portfolio with New 4U and 2-OU (OCP) Liquid-Cooled NVIDIA HGX B300 Solutions Ready for High-Volume Shipment

• Resumes services to Fukuoka, Japan from September 2026 after nearly two decades
• Expands China footprint with new direct services to Shenzhen and Changsha, commencing July 2026
• "MAG Arena" showcases Asia's Largest Airline Pavilion at MATTA Fair 2026, featuring the region's premier sports partnership activation by an airline
• Increases frequencies across ASEAN, South Asia, Australia and New Zealand and Europe to further strengthen global connectivity

SINGAPORE, April 5, 2026 /PRNewswire/ -- Malaysia Airlines is significantly expanding its East Asia footprint with the return of direct flights to Fukuoka, Japan, and the launch of new services to Shenzhen and Changsha, China. Commencing between July and September 2026, these additions bring the airline's China network to nine key gateways and reinforce its commitment to providing greater travel flexibility across the region.

As part of this expansion, the airline will introduce new services between Kuala Lumpur and Shenzhen (SZX) and Changsha (CSX) in China, alongside the resumption of services to Fukuoka (FUK) in Japan, which the airline last operated in September 2006. With the launch of these destinations, Malaysia Airlines consolidates its presence across a total of nine strategic destinations in China, including Beijing (PKX), Shanghai (PVG), Guangzhou (CAN), Xiamen (XMN), Hong Kong (HKG), Taipei (TPE), and Chengdu Tianfu (TFU). Ticket sales for the new services commence today, supporting the growing travel demand and strengthening connectivity between Malaysia and these high-growth regional hubs.

Captain Nasaruddin A. Bakar, President and Group Chief Executive Officer of Malaysia Aviation Group (MAG), said, "This expansion reflects our strategic focus on scaling our presence in key growth markets across East Asia while cementing Kuala Lumpur's position as a key strategic gateway. Both Shenzhen and Changsha align perfectly with our network strategy, driven by robust demand across both business and leisure segments. The return to Fukuoka further enhances our network depth. As the only carrier operating direct flights on this route, we are proud to offer passengers a seamless non-stop experience that eliminates the need for transit. These developments demonstrate our ongoing commitment to optimising our network and delivering a more integrated travel experience for our customers."

Beyond the East Asia expansion, Malaysia Airlines is increasing flight frequencies across key routes namely Brisbane, Australia; Manila, Philippines and Colombo, Sri Lanka to meet rising demand while supporting growing tourism and trade links. In addition, the airline will operate ad-hoc Kuala Lumpur–London flights on 18 and 22 April 2026 to accommodate passengers affected by recent Middle Eastern carrier disruptions.

As the returning Official Airline Partner and Premier Sponsor of MATTA Fair 2026, MAG unveiled its most ambitious presence yet with the launch of the MAG Arena, recognised by both the Asia Records and ASEAN Records as Asia's Largest Airline Trade Pavilion at a consumer travel fair.

Spanning approximately 46,000 square feet, nearly three times the scale of its participation in September last year, the expanded pavilion transforms the MATTA Fair experience into a fully immersive destination showcasing curated experiences and next-generation travel technology that brings journeys to life before travellers even board the aircraft. Visitors will be able to explore destinations, discover travel innovations and experience the warmth of Malaysian Hospitality through interactive engagements designed to inspire their next journey.

In addition, the pavilion will host Asia's largest sports partnership activation by an airline, celebrating Malaysia Airlines' collaborations with global clubs like Manchester United and national sporting icons Datuk Azizulhasni Awang and others. The dedicated sports experience zone will allow football fans and travellers to engage with legends and their favourite sports personalities — reinforcing how sport and travel connect people across borders and generations.

Through the expansion of its network and increased flight frequencies, the airline continues to strengthen Kuala Lumpur's position as a key gateway to Asia and beyond, while supporting Malaysia's tourism ambitions under Visit Malaysia 2026 and advancing its journey towards becoming one of the world's Top 10 global airlines by 2030.

-ENDS-

New Routes