Forum discussions will feature a moderated panel of experts from across the technology industry to explore the latest trends in AI, Home Appliances, Services and Design
SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- Samsung Electronics Co., Ltd. today announced that it will host a series of four moderated Tech Forum panel discussions at CES 2026, to highlight industry trends and unveil its distinct AI vision and strategy.
Samsung's Tech Forums will be held Jan. 5–6 at Samsung's dedicated exhibition space in the Latour Ballroom at the Wynn Las Vegas. The company will host a total of four moderated panels covering AI, Home Appliances, Services and Design. Samsung executives along with partners, academics, media and industry analysts will participate in each session by topic:
- When Everything Clicks: How Open Ecosystems Deliver Impactful AI (Jan. 5, 9:00 AM) — Yoonho Choi, Digital Appliances Business, Samsung Electronics (Chair, Home Connectivity Alliance)
Description: Collaborating smart home innovators hold an open discussion on the necessity of cross-industry partnership and what it takes for meaningful smart home technology to be woven into daily living.
- In Tech We Trust? Rethinking Security & Privacy in the AI Age (Jan. 5, 2:00 PM) — Shin Baik, Group Head, AI Platform Center, Samsung Electronics
Description: Experts in security and AI examine the science of trust and how transparency and secure systems can spark a meaningful change for AI adoption.
- FAST Forward: How Streaming's Next Wave is Redefining Television (Jan. 5, 4:00 PM) — Salek Brodsky, Executive Vice President, Visual Display Business, Samsung Electronics
Description: Leaders in TV and entertainment explore the next wave of streaming, including free ad-supported streaming television (FAST), hybrid models and creator-led channels to shape a more interactive future.
- The Human Side of Tech: Designing a Future Worth Loving (Jan. 6, 1:00 PM) — Mauro Porcini, President and Chief Design Officer, DX Division, Samsung Electronics
Description: Design leaders urge the tech industry to look beyond minimalist, spec-driven approaches toward more expressive, human-centered design shaped by new materials, AI and creativity.
In covering the latest trends in technology and daily living, the Technology Forum discussions will serve as a complement to the company's latest product innovations, which will be showcased at the Samsung Exhibition Zone at the Wynn from Jan. 5–7.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, digital signage, smartphones, wearables, tablets, home appliances and network systems, as well as memory, system LSI and foundry. Samsung is also advancing medical imaging technologies, HVAC solutions and robotics, while creating innovative automotive and audio products through Harman. With its SmartThings ecosystem, open collaboration with partners, and integration of AI across its portfolio, Samsung delivers a seamless and intelligent connected experience. For the latest news, please visit the Samsung Newsroom at news.samsung.com.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Samsung to Host Series of Tech Forums at CES 2026
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- Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually.
- Boosts durability by up to three times for secure information recognition even with long-term use.
- Mass production tailored to global customers starts in November, accelerating customer acquisition.
SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) Substrate' featuring enhanced performance and reducing carbon emissions generated in its production by half.
The smart IC substrate is an essential component for mounting IC chips that store information on smart cards, such as those in credit cards, electronic passports, and USIMs. When users place a smart card in an ATM or on a passport reader, the IC chip's information is transmitted to the device via electronic signals.
- Carbon emissions from its production cut by 50%, durability boosted by three times, and secure information recognition enabled
This 'Next-Generation Smart IC Substrate' is an eco-friendly product that reduces the carbon emissions generated in its production by half. The product will cut annual carbon dioxide emissions by 8,500 tons—equivalent to planting about 1.3 million trees, the company explained.
LG Innotek applied a new material to this product for the first time in the world, achieving high performance without precious metal plating processes.
Existing smart IC substrates require plating with precious metals such as palladium and gold (Au) on their surfaces. This process prevents corrosion where the substrate makes contact with readers and ensures effective electronic signal transmission.
However, the mining of palladium and gold generates massive amounts of greenhouse gases, and the prices of these metals remain high. Thus, the industry has sought new materials or processes to replace them. By eliminating surface plating, LG Innotek's 'Next-Generation Smart IC Substrate' is thus attracting industry attention.
With environmental regulations tightening in Europe, home to major customers, LG Innotek is poised to gain a competitive edge in the global market with this 'Next-Generation Smart IC Substrate.'
Furthermore, this product's durability is three times greater than existing products. This minimizes information reading errors caused by wear from frequent external contact and long-term smart card use, delivering both higher performance and enhanced user convenience.
- Mass production for global customers began in November, tailored to customer needs, accelerating customer acquisition
LG Innotek aims to accelerate its global market penetration with this 'Next-Generation Smart IC Substrate'. In November, the company began mass production to supply leading global smart card manufacturers.
LG Innotek holds 20 domestic patents related to the 'Next-Generation Smart IC Substrate' and is pursuing patent registrations in the United States, Europe, and China. The company plans to secure additional global customers through active overseas promotions, leveraging its exclusive technology.
Cho Jitae(Jeffrey Cho), executive vice president and head of LG Innotek's Package Solution Business, said: "The 'Next-Generation Smart IC Substrate' both satisfies customers' ESG requirements and offers technological competitiveness. We will continue presenting innovative products that create differentiated customer value, making us a partner that realizes our customers' visions."
According to market research firm Mordor Intelligence, the global smart card market—currently valued at USD 20.3 billion—is projected to reach USD 30.6 billion by 2030, with an annual growth rate of 8.6%.
In particular, the smart card industry is increasingly adopting dual cards that support both insertion into devices and contactless transactions, boosting demand for replacing existing cards. Additionally, rising credit card issuance in emerging markets such as Africa and India is projected to drive continued growth in the smart card market.
[Glossary]
Smart card
A smart card is a card with a built-in IC chip that offers data storage, provides encryption, and transmits and receives electronic signals to and from readers for information authentication and payment. It is used across various sectors, including finance, transportation, and communication.
- Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually.
- Boosts durability by up to three times for secure information recognition even with long-term use.
- Mass production tailored to global customers starts in November, accelerating customer acquisition.
SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) Substrate' featuring enhanced performance and reducing carbon emissions generated in its production by half.
The smart IC substrate is an essential component for mounting IC chips that store information on smart cards, such as those in credit cards, electronic passports, and USIMs. When users place a smart card in an ATM or on a passport reader, the IC chip's information is transmitted to the device via electronic signals.
- Carbon emissions from its production cut by 50%, durability boosted by three times, and secure information recognition enabled
This 'Next-Generation Smart IC Substrate' is an eco-friendly product that reduces the carbon emissions generated in its production by half. The product will cut annual carbon dioxide emissions by 8,500 tons—equivalent to planting about 1.3 million trees, the company explained.
LG Innotek applied a new material to this product for the first time in the world, achieving high performance without precious metal plating processes.
Existing smart IC substrates require plating with precious metals such as palladium and gold (Au) on their surfaces. This process prevents corrosion where the substrate makes contact with readers and ensures effective electronic signal transmission.
However, the mining of palladium and gold generates massive amounts of greenhouse gases, and the prices of these metals remain high. Thus, the industry has sought new materials or processes to replace them. By eliminating surface plating, LG Innotek's 'Next-Generation Smart IC Substrate' is thus attracting industry attention.
With environmental regulations tightening in Europe, home to major customers, LG Innotek is poised to gain a competitive edge in the global market with this 'Next-Generation Smart IC Substrate.'
Furthermore, this product's durability is three times greater than existing products. This minimizes information reading errors caused by wear from frequent external contact and long-term smart card use, delivering both higher performance and enhanced user convenience.
- Mass production for global customers began in November, tailored to customer needs, accelerating customer acquisition
LG Innotek aims to accelerate its global market penetration with this 'Next-Generation Smart IC Substrate'. In November, the company began mass production to supply leading global smart card manufacturers.
LG Innotek holds 20 domestic patents related to the 'Next-Generation Smart IC Substrate' and is pursuing patent registrations in the United States, Europe, and China. The company plans to secure additional global customers through active overseas promotions, leveraging its exclusive technology.
Cho Jitae(Jeffrey Cho), executive vice president and head of LG Innotek's Package Solution Business, said: "The 'Next-Generation Smart IC Substrate' both satisfies customers' ESG requirements and offers technological competitiveness. We will continue presenting innovative products that create differentiated customer value, making us a partner that realizes our customers' visions."
According to market research firm Mordor Intelligence, the global smart card market—currently valued at USD 20.3 billion—is projected to reach USD 30.6 billion by 2030, with an annual growth rate of 8.6%.
In particular, the smart card industry is increasingly adopting dual cards that support both insertion into devices and contactless transactions, boosting demand for replacing existing cards. Additionally, rising credit card issuance in emerging markets such as Africa and India is projected to drive continued growth in the smart card market.
[Glossary]
Smart card
A smart card is a card with a built-in IC chip that offers data storage, provides encryption, and transmits and receives electronic signals to and from readers for information authentication and payment. It is used across various sectors, including finance, transportation, and communication.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
LG Innotek Launches World's First 'Next-Generation Smart IC Substrate'
