BOSTON--(BUSINESS WIRE)--Jan 12, 2026--
OutSystems, a leading AI development platform, today announced the appointment of Fay Sien Goon as Chief Financial Officer (CFO). In this role, Goon will oversee the company’s global financial operations, planning, and strategy as OutSystems continues to grow its market leadership and accelerate innovation in AI apps and agents.
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“Fay Sien is a world-class financial leader with an incredible depth of experience in scaling some of the most successful companies in the software industry,” said Woodson Martin, CEO of OutSystems. “Her expertise in navigating complex, high-growth environments and her strategic approach to financial operations will be invaluable as we continue to empower organizations with a unified, agile, and enterprise-proven AI development platform. We are thrilled to welcome her to the team.”
A seasoned finance leader with over 20 years of experience in the SaaS and enterprise software industries, Goon has a proven track record of accelerating growth within technology organizations and driving disciplined financial performance. Goon joins OutSystems from AppFolio, where she served as Chief Financial Officer. Prior to AppFolio, Goon spent nearly a decade at ServiceNow during its most transformative years. As Chief Accounting Officer, she led global accounting and finance functions as the company achieved significant financial milestones.
“OutSystems is at the forefront of a massive shift in how software is created, particularly as AI transforms the development lifecycle,” said Goon, CFO at OutSystems. “I am honored to join a company with such a strong and trusted foundation, a visionary leadership team, and a clear mission to help customers embrace an agentic future.”
Learn more about OutSystems leadership team here.
About OutSystems
OutSystems is a leading AI development platform trusted by thousands of customers worldwide. The platform empowers CEOs, management teams, and technology leaders to build mission-critical applications and agentic systems that grow revenue, streamline operations, and deliver exactly what businesses need.
While evolving AI pilots into production success can be challenging due to talent gaps, legacy systems, imperfect data, and sprawling point solutions, OutSystems provides a proven AI development platform and experience that enables innovation up to 10x faster with the assurance of built-in security, scalability, and governance.
Recognized as a leader by analysts, IT executives, business leaders, and developers around the world, global brands trust OutSystems to innovate as fast as the evolving market demands and orchestrate powerful human + AI collaboration in the agentic future.
Founded in 2001, the company’s network spans more than 60 million end users, over 500 partners, and active customers in 75+ countries across 20+ industries. Learn more at www.outsystems.com.
Fay Sien Goon, Chief Financial Officer at OutSystems
GRENOBLE, France--(BUSINESS WIRE)--Sep 15, 2026--
Teledyne e2v, a Teledyne Technologies (NYSE:TDY) company and global innovator of imaging solutions, announces Perciva™ ToF, its new industrial grade 3D Time-of-Flight (ToF) camera. Designed for reliable operation in demanding environments, Perciva ToF combines high-performance depth sensing, on-camera processing, and flexible integration for a wide range of applications, including logistics, robotics, inspection, and surveillance.
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Powered by Teledyne e2v’s Hydra3D™+ CMOS image sensor, Perciva ToF combines 832 x 600 pixel resolution with patented HiRho technology, which increases FFxQE at near-infrared wavelengths while maintaining excellent MTF and modulation contrast. Its 10 µm three-tap pixel architecture captures more light, enabling longer operating distances, reliable detection of low-reflectivity materials, and motion-artifact-free imaging of fast-moving objects. This enables accurate, dependable 3D measurements, even in high-speed industrial applications.
Perciva ToF has been engineered to deliver robust performance in challenging conditions, including varying outdoor illumination and interference caused by other systems, without requiring interconnecting cameras. Factory calibration and embedded processing simplify system integration by providing depth maps and point cloud data directly through the camera’s GigE interface.
The camera's industrial design and embedded intelligence enable developers and system integrators to deploy 3D vision capabilities more quickly in applications requiring reliable depth measurement and real-time performance.
See Perciva ToF in action at VISION in Stuttgart, Germany, from October 6-8, 2026. Visit us in Hall 8, Booth 8B10, or contact us online for more information.
Documentation and samples are available upon request.
About Teledyne Vision Solutions
Teledyne Vision Solutions offers the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Aligned under one umbrella, Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics, and Adimec form an unrivalled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest sensing and related technology portfolio in the world. Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.
About Teledyne
Teledyne Technologies Incorporated is a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne’s operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne’s website at www.teledyne.com.
Teledyne e2v’s Perciva ToF camera delivers reliable 3D depth sensing for industrial applications.
