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Shipments Increase in 2025 Amid Strong AI-driven Demand, While Revenue Softens
MILPITAS, Calif., Feb. 10, 2026 /PRNewswire/ -- Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
2025 marks an inflection year for wafer shipments, with silicon MSI resuming growth supported by strong demand for advanced epitaxial wafers in logic and polished wafers for high-bandwidth memory (HBM), driven by AI applications. Softness in wafer revenue is mostly attributed to the slow momentum in traditional semiconductor applications where the demand and pricing environment are yet to improve.
"The 2025–2026 wafer market is shaped by diverging trends across technology nodes," said Ginji Yada, Chairman of SEMI SMG and Executive Office Deputy General Manager, Sales and Marketing Division at SUMCO Corporation. "Demand for 300mm wafers remains strong in advanced applications, particularly in AI-driven logic and high-bandwidth memory (HBM), supported by the ongoing adoption of sub-3nm processes. These technology transitions are driving increased requirements for wafer quality and consistency, reinforcing the need for advanced material solutions. Investments in data centers and generative AI continue to underpin demand in leading-edge segments, where performance and reliability are critical.
"In contrast, the legacy semiconductor segment shows gradual signs of stabilization. Wafer and chip inventory levels in mature-node applications—such as automotive, industrial, and consumer electronics—have begun to normalize after extended inventory adjustments. While supply-demand conditions are improving sequentially, the pace of recovery remains moderate, with demand recovery still sensitive to macroeconomic factors and end-market dynamics. As a result, the overall market outlook reflects a two-track trajectory: sustained demand and technical advancement in advanced nodes, alongside a cautious and incremental rebound for demand in mature technology segments."
Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 300 mm and serve as the substrate material on which most semiconductors are fabricated.
The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epitaxial). The SMG facilitates collective efforts on issues related to the silicon industry, including the development of statistics about the silicon industry.
For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics or contact the SEMI Market Intelligence Team at mktstats@semi.org. Additional details on SEMI market data are available at SEMI Market Intelligence.
Follow SEMI
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Sherrie Gutierrez/SEMI
Phone: 1-831-889-3800
Email: sgutierrez@semi.org
Stephanie Quinn/Kiterocket (Media Inquiries)
Phone: 1-480-316-8370
Email: squinn@kiterocket.com
Shipments Increase in 2025 Amid Strong AI-driven Demand, While Revenue Softens
MILPITAS, Calif., Feb. 10, 2026 /PRNewswire/ -- Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
2025 marks an inflection year for wafer shipments, with silicon MSI resuming growth supported by strong demand for advanced epitaxial wafers in logic and polished wafers for high-bandwidth memory (HBM), driven by AI applications. Softness in wafer revenue is mostly attributed to the slow momentum in traditional semiconductor applications where the demand and pricing environment are yet to improve.
"The 2025–2026 wafer market is shaped by diverging trends across technology nodes," said Ginji Yada, Chairman of SEMI SMG and Executive Office Deputy General Manager, Sales and Marketing Division at SUMCO Corporation. "Demand for 300mm wafers remains strong in advanced applications, particularly in AI-driven logic and high-bandwidth memory (HBM), supported by the ongoing adoption of sub-3nm processes. These technology transitions are driving increased requirements for wafer quality and consistency, reinforcing the need for advanced material solutions. Investments in data centers and generative AI continue to underpin demand in leading-edge segments, where performance and reliability are critical.
"In contrast, the legacy semiconductor segment shows gradual signs of stabilization. Wafer and chip inventory levels in mature-node applications—such as automotive, industrial, and consumer electronics—have begun to normalize after extended inventory adjustments. While supply-demand conditions are improving sequentially, the pace of recovery remains moderate, with demand recovery still sensitive to macroeconomic factors and end-market dynamics. As a result, the overall market outlook reflects a two-track trajectory: sustained demand and technical advancement in advanced nodes, alongside a cautious and incremental rebound for demand in mature technology segments."
Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 300 mm and serve as the substrate material on which most semiconductors are fabricated.
The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epitaxial). The SMG facilitates collective efforts on issues related to the silicon industry, including the development of statistics about the silicon industry.
For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics or contact the SEMI Market Intelligence Team at mktstats@semi.org. Additional details on SEMI market data are available at SEMI Market Intelligence.
Follow SEMI
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Sherrie Gutierrez/SEMI
Phone: 1-831-889-3800
Email: sgutierrez@semi.org
Stephanie Quinn/Kiterocket (Media Inquiries)
Phone: 1-480-316-8370
Email: squinn@kiterocket.com
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
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Announced alongside M Series Smart Assist Module launch on Kickstarter
NEW YORK, April 4, 2026 /PRNewswire/ -- Yarbo, a company focused on intelligent yard robotics, today announced the Yarbo Open Platform, a long-term initiative currently under development and planned for release in early 2027. Designed to expand Yarbo's modular yard robot system across both software and hardware, the platform is intended to support deeper customization, broader smart home connectivity, and new forms of user and developer-driven functionality over time. The announcement coincides with the launch of the Smart Assist Module (SAM) for the M Series on Kickstarter.
The Open Platform is not available today. Instead, it reflects Yarbo's roadmap for how its ecosystem may evolve over time, including a three-layer software architecture built around an Open API, SDK, and no-code Automation Editor, as well as a hardware expansion framework designed to support future user-built and developer-built modules.
A Structured Approach to Software Integration and Automation
The Yarbo Open Platform is structured to accommodate different levels of technical expertise, from everyday users to experienced developers. It is designed to provide multiple entry points into the Yarbo ecosystem, enabling both software-driven automation and hardware-level expansion.
On the software side, the platform consists of three layers:
- Yarbo Open API — intended to enable connectivity between Yarbo devices and external platforms, allowing them to participate in broader home automation scenarios.
- Yarbo SDK — a set of development tools, including code libraries and documentation, designed for developers building custom features or integrations.
- Yarbo Automation Editor — a visual, drag-and-drop interface within the Yarbo app that allows users to create automation workflows without writing code.
Together, these components are intended to make automation accessible to a wide range of users, while also supporting more advanced development use cases.
The platform is also designed to support compatibility with widely used smart home ecosystems, including Home Assistant, Google Home, and Amazon Alexa, enabling users to incorporate Yarbo into existing connected home setups.
Extending Capability Through Hardware
In addition to software capabilities, the Open Platform introduces a hardware expansion approach designed to extend Yarbo's functionality beyond its existing modules.
At the center of this is CoreBridge, a standardized hardware interface currently in development that is intended to provide access to Yarbo's mechanical mounting points, power system, and data connections. It is designed to support third-party development and user-built extensions, allowing new types of functionality beyond pre-defined modules.
One example of this extensibility is an electromagnet-based module, which can be attached via CoreBridge to enable Yarbo to latch onto and move objects such as garbage bins. In a potential use scenario, this could enable automated movement of a bin to the curb on collection day and its return afterward.
This combination of software and hardware openness reflects an effort to expand the role of outdoor robotics beyond fixed-function devices.
Smart Assist Module Launch on Kickstarter
Alongside the Open Platform announcement, Yarbo is launching the Smart Assist Module (SAM) for the M Series on Kickstarter.
The module introduces two primary features designed to expand how users interact with their yard robot in everyday use:
- Follow Me Mode — enabling Yarbo to move alongside the user while carrying tools or materials, reducing the need for manual transport during yard work.
- Patrol Mode — allowing Yarbo to move along customizable routes around the property, with features such as remote live view, app-based alerts, and optional audio notifications via its built-in speaker, providing an added layer of awareness and convenience for users managing outdoor spaces.
The Smart Assist Module is positioned as part of Yarbo's broader effort to extend the practical use cases of its modular system.
Looking Ahead
The Yarbo Open Platform is planned for release in early 2027 and is being developed to support both the Y Series and M Series. By introducing a framework that combines software integration, developer tools, and hardware extensibility, Yarbo aims to enable a broader range of applications while allowing users to define how the system evolves over time.
Further details will be shared as development progresses.
About Yarbo
Yarbo is defining a new category of outdoor robotics with its Modular Yard Robot. Known for its automated snow blower robots, Yarbo introduced a modular system designed for year-round use. Powered by a single intelligent core unit, the system supports interchangeable modules for mowing, leaf blowing, snow clearing, and more—creating a more efficient approach to outdoor maintenance for homeowners.
Announced alongside M Series Smart Assist Module launch on Kickstarter
NEW YORK, April 4, 2026 /PRNewswire/ -- Yarbo, a company focused on intelligent yard robotics, today announced the Yarbo Open Platform, a long-term initiative currently under development and planned for release in early 2027. Designed to expand Yarbo's modular yard robot system across both software and hardware, the platform is intended to support deeper customization, broader smart home connectivity, and new forms of user and developer-driven functionality over time. The announcement coincides with the launch of the Smart Assist Module (SAM) for the M Series on Kickstarter.
The Open Platform is not available today. Instead, it reflects Yarbo's roadmap for how its ecosystem may evolve over time, including a three-layer software architecture built around an Open API, SDK, and no-code Automation Editor, as well as a hardware expansion framework designed to support future user-built and developer-built modules.
A Structured Approach to Software Integration and Automation
The Yarbo Open Platform is structured to accommodate different levels of technical expertise, from everyday users to experienced developers. It is designed to provide multiple entry points into the Yarbo ecosystem, enabling both software-driven automation and hardware-level expansion.
On the software side, the platform consists of three layers:
- Yarbo Open API — intended to enable connectivity between Yarbo devices and external platforms, allowing them to participate in broader home automation scenarios.
- Yarbo SDK — a set of development tools, including code libraries and documentation, designed for developers building custom features or integrations.
- Yarbo Automation Editor — a visual, drag-and-drop interface within the Yarbo app that allows users to create automation workflows without writing code.
Together, these components are intended to make automation accessible to a wide range of users, while also supporting more advanced development use cases.
The platform is also designed to support compatibility with widely used smart home ecosystems, including Home Assistant, Google Home, and Amazon Alexa, enabling users to incorporate Yarbo into existing connected home setups.
Extending Capability Through Hardware
In addition to software capabilities, the Open Platform introduces a hardware expansion approach designed to extend Yarbo's functionality beyond its existing modules.
At the center of this is CoreBridge, a standardized hardware interface currently in development that is intended to provide access to Yarbo's mechanical mounting points, power system, and data connections. It is designed to support third-party development and user-built extensions, allowing new types of functionality beyond pre-defined modules.
One example of this extensibility is an electromagnet-based module, which can be attached via CoreBridge to enable Yarbo to latch onto and move objects such as garbage bins. In a potential use scenario, this could enable automated movement of a bin to the curb on collection day and its return afterward.
This combination of software and hardware openness reflects an effort to expand the role of outdoor robotics beyond fixed-function devices.
Smart Assist Module Launch on Kickstarter
Alongside the Open Platform announcement, Yarbo is launching the Smart Assist Module (SAM) for the M Series on Kickstarter.
The module introduces two primary features designed to expand how users interact with their yard robot in everyday use:
- Follow Me Mode — enabling Yarbo to move alongside the user while carrying tools or materials, reducing the need for manual transport during yard work.
- Patrol Mode — allowing Yarbo to move along customizable routes around the property, with features such as remote live view, app-based alerts, and optional audio notifications via its built-in speaker, providing an added layer of awareness and convenience for users managing outdoor spaces.
The Smart Assist Module is positioned as part of Yarbo's broader effort to extend the practical use cases of its modular system.
Looking Ahead
The Yarbo Open Platform is planned for release in early 2027 and is being developed to support both the Y Series and M Series. By introducing a framework that combines software integration, developer tools, and hardware extensibility, Yarbo aims to enable a broader range of applications while allowing users to define how the system evolves over time.
Further details will be shared as development progresses.
About Yarbo
Yarbo is defining a new category of outdoor robotics with its Modular Yard Robot. Known for its automated snow blower robots, Yarbo introduced a modular system designed for year-round use. Powered by a single intelligent core unit, the system supports interchangeable modules for mowing, leaf blowing, snow clearing, and more—creating a more efficient approach to outdoor maintenance for homeowners.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
Yarbo Introduces Open Platform Strategy, Opening Its Robotics System to Developers and Smart Home Ecosystems
Yarbo Introduces Open Platform Strategy, Opening Its Robotics System to Developers and Smart Home Ecosystems
