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Supermicro Reveals DCBBS® with New NVIDIA Vera Rubin NVL72, HGX Rubin NVL8, and Vera CPU Systems, Designed to Accelerate Customer Time-to-Market

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Supermicro Reveals DCBBS® with New NVIDIA Vera Rubin NVL72, HGX Rubin NVL8, and Vera CPU Systems, Designed to Accelerate Customer Time-to-Market
Business

Business

Supermicro Reveals DCBBS® with New NVIDIA Vera Rubin NVL72, HGX Rubin NVL8, and Vera CPU Systems, Designed to Accelerate Customer Time-to-Market

2026-03-17 04:35 Last Updated At:04:55

  • Supermicro's NVIDIA Vera Rubin NVL72 and HGX Rubin NVL8 systems are built on the DCBBS liquid-cooling stack, targeting up to 10x throughput per watt and one-tenth the token cost, compared to NVIDIA Blackwell solutions.
  • Supermicro's 2U HGX Rubin NVL8 system is the most flexible platform supporting NVIDIA Vera and next-generation x86 CPUs, scaling to 72 Rubin GPUs per rack, as well as a DCBBS Liquid-to-Air (L2A) Sidecar CDU option for data centers without liquid-cooling.
  • Supermicro's new NVIDIA Vera CPU systems include a 2U server supporting up to 6 RTX PRO 4500 Blackwell Server Edition GPUs and a new AI storage system for context memory extension integrated with NVIDIA BlueField-4 DPU.

SAN JOSE, Calif., March 17, 2026 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud Computing, AI/ML, Storage, and 5G/Edge, today unveiled its upcoming system portfolio powered by the NVIDIA Vera Rubin platform. As data centers transform into AI factories, producing intelligence at massive scale, agentic reasoning, long-context AI, and Mixture-of-Experts (MoE) workloads are driving demand for an entirely new class of compute and storage infrastructure. Supermicro's NVIDIA Vera Rubin NVL72, NVIDIA HGX Rubin NVL8, NVIDIA Vera CPU systems are being designed and built with Supermicro's Data Center Building Block Solutions (DCBBS) advanced liquid-cooling technology stack to accelerate time-to-market for customers.

"We are entering a new era where every organization requires an AI factory to win in the marketplace, as the demand for inference workloads is reshaping what data center infrastructure must deliver," said Charles Liang, president and CEO of Supermicro. "Supermicro's DCBBS technology stack is being engineered to empower upcoming NVIDIA Vera Rubin NVL72, HGX Rubin NVL8, and Vera CPU systems to give our customers a fast, clear path to deploying next-generation AI factories, at scale. We are excited to provide an early look at these solutions as a testament to being first to market with the infrastructure that will power the next frontier of AI."

For more information visit NVIDIA Vera Rubin | Supermicro.

Supermicro DCBBS for NVIDIA Vera Rubin and Rubin Platforms

Delivering AI factory performance at scale requires much more than just compute — It demands power, cooling, and networking infrastructure that performs seamlessly. Supermicro's modular DCBBS approach enables data center operators to deploy validated, pre-engineered rack solutions rather than custom-building infrastructure for each project — reducing time-to-online, minimizing integration risk, and lowering total cost of ownership across AI factory deployments of any scale.

Supermicro's DCBBS are engineered specifically to meet the evolving thermal, power, and networking demands needed to enable rapid and robust deployment of upcoming NVIDIA Vera Rubin NVL72, NVIDIA HGX Rubin, and NVIDIA Vera CPU infrastructure. To meet the needs of Vera Rubin platforms, which will be fully liquid-cooled from this generation forward, DCBBS includes a full suite of validated liquid-cooling infrastructure. This expansion includes in-rack and in-row components such as coolant distribution units (CDUs), manifolds, and liquid-to-air sidecar. Also included are infrastructure solutions such as cooling towers and cabling design and implementation services — designed to integrate seamlessly with Supermicro's next-generation system portfolio.

Supermicro NVIDIA Vera Rubin NVL72 SuperCluster

Supermicro is engineering its NVIDIA Vera Rubin NVL72 with new DCBBS liquid-cooling components to fully support the power and thermal envelope at rack and cluster scale. This includes the manufacturing of optimized NVIDIA MGX racks, in-rack or in-row CDU, RDHx and L2A sidecar to streamline production and deployment of the rack-scale AI supercomputer at scale. The Vera Rubin NVL72 operates as a single rack-scale accelerator, unifying six co-designed chips — Rubin GPU, Vera CPU, NVIDIA NVLink 6, NVIDIA ConnectX-9 SuperNIC, NVIDIA BlueField-4 DPU, and NVIDIA Spectrum-X Ethernet — to deliver up to 3.6 Exaflops of inference, 75TB of fast memory, and 1.6 PB/s of HBM4 bandwidth, targeting up to 10x the throughput per watt and one-tenth the token cost compared to NVIDIA Blackwell.

NVIDIA HGX Rubin NVL8 System

The 2U HGX Rubin NVL8 system provides the densest and most flexible HGX platform — and the first HGX platform to offer greater flexibility in CPU selections including NVIDIA Vera CPUs alongside next-generation AMD and Intel x86 processors. Built on the NVIDIA MGX rack architecture with Supermicro's blind mate busbar and manifold for tool-free rack integration, it gives customers the freedom to pair eight Rubin GPUs with the CPU platform that best fits their workload and software stack.

The design supports 9 HGX Rubin NVL8 systems per rack — up to 72 Rubin GPUs total — for large-scale AI training, inference, and accelerated HPC. DCBBS provides in-rack CDU, in-row CDU, RDHx and an optional Liquid-to-air (L2A) sidecar for customers deploying in liquid-cooled or air-cooled data center environments.

NVIDIA Vera CPU System with RTX PRO

Supermicro's Vera CPU next-generation agentic AI system is being engineered as a versatile AI compute node for organizations targeting next-generation agentic AI deployments. The system features dual NVIDIA Vera CPUs supporting up to 6 RTX PRO 4500 Blackwell Server Edition GPUs in a compact 2U chassis — delivering the compute density and energy efficiency that enterprise AI inference, agentic workloads, visualization, and adding accelerated computing to all enterprise workloads. It is a high-bandwidth LPDDR5X memory subsystem and PCIe GPU acceleration in a space-efficient footprint.

NVIDIA BlueField-4 STX Context Memory Storage Platform

Supermicro's upcoming Context Memory Storage Platform (CMX) introduces a new class of AI-native storage for context memory — architected as an intelligent pod-level context memory storage tier that extends GPU KV cache capacity and serves long-context inference data at the throughput that Vera Rubin NVL72 super pod clusters demand. Powered by NVIDIA BlueField-4 processor, NVIDIA Vera CPUs, NVIDIA ConnectX-9 SuperNICs, Spectrum-X Ethernet NVIDIA DOCA, and NVIDIA Dynamo, the system provides the high-bandwidth, low-latency fabric and intelligent data path offload that large-scale AI inference pipelines and RAG workloads require.

Supermicro NVIDIA Blackwell Solutions — Available Now

With next-generation systems in rapid development, Supermicro's current portfolio of NVIDIA Blackwell-based systems is in full production and available for immediate deployment through Supermicro's US and global manufacturing capacity, enabling customers to build and scale production AI infrastructure today. Supermicro is investing across both its current Blackwell lineup and its next-generation systems to ensure customers have the right platform at every stage of this transformation.

Visit Supermicro at GTC San Jose 2026

Supermicro will be unveiling early previews of its Vera Rubin platform systems alongside its current production Blackwell portfolio. Supermicro experts will be available to discuss current procurement options, roadmap planning, and deployment timelines for both near-term and next-generation AI infrastructure in Supermicro booth #1113.

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first-to-market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next-generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

 

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

Supermicro Reveals DCBBS® with New NVIDIA Vera Rubin NVL72, HGX Rubin NVL8, and Vera CPU Systems, Designed to Accelerate Customer Time-to-Market

Supermicro Reveals DCBBS® with New NVIDIA Vera Rubin NVL72, HGX Rubin NVL8, and Vera CPU Systems, Designed to Accelerate Customer Time-to-Market

WASHINGTON, Oct. 4, 2026 /PRNewswire/ -- On October 3, 2026, local time, a Shanghai-themed cultural exchange event was held on the National Mall in Washington, D.C., bringing a taste of Shanghai to the U.S. Titled "Future Resonance — ShanghaiEye Night," the event was also part of the "Shanghai Let's Meet" city promotion initiative and a broader series of China-U.S. people-to-people exchanges. Through a variety of cultural activities and interactions, the event built bridges between people across the Pacific and offered a glimpse of Shanghai as an open, inclusive and dynamic international metropolis.

The event, held by Shanghai Media Group, brought together nearly 100 prominent figures from China and the United States across the political, business, technology, cultural and arts sectors. Song Jiongming, President of Shanghai Media Group, and Susan Lee, Secretary of State of Maryland, attended the event and delivered remarks. Chinese Ambassador to the United States Xie Feng was also in attendance.

In the afternoon, the National Mall was transformed into a "mini Shanghai" carnival. The carnival featured 50 stalls showcasing international cuisine, a "Shanghai Charm" themed exhibition area and displays of China's intangible cultural heritage.

Visitors got a glimpse of Shanghai's cutting-edge technological innovation through a model of the C919 passenger jet, explored the city's latest trends through a model of the Oriental Pearl Tower and popular Chinese cultural and creative IPs, and took a virtual journey through Shanghai's past and present with VR headsets provided by the Shanghai Museum. Time-honored brands such as White Rabbit candy, Hero fountain pens and Lao Feng Xiang offered visitors a taste of Shanghai's iconic homegrown brands. Meanwhile, an IP SHANGHAI lenticular art exhibition brought the city to life through dynamic images that changed as visitors moved around the displays.

From such an immersive experience showcasing Shanghai as a first stop for international visitors entering China to distinctive IPs spanning culture, commerce, tourism, sports and exhibitions, the carnival offered Americans and international visitors a glimpse of the city and a chance to experience Shanghai firsthand at one of Washington's most iconic landmarks. Many visitors said they hoped to visit Shanghai in person and explore the city on foot through a "city walk."

As the sun began to set, its golden glow fell over the Capitol dome. Against an iconic backdrop featuring the two cities, the "Future Resonance" outdoor concert got underway.

Young performers from China and the United States took the stage alongside renowned artists from both countries. The One Voice Children's Choir from the United States and the Manhattan Philharmonic joined forces to perform "We Are Together," a song created in Shanghai to celebrate friendship between the two countries.

The program featured a rich mix of symphonic works, traditional Chinese music, Chinese opera and anime music. Footage from Shanghai's city image film "UP! SHANGHAI" played on the large screen behind the stage throughout the concert.

Later that evening, nearly 100 guests from China and the United States, including prominent figures from politics, business, technology, culture and the arts, took part in the ShanghaiEye Night dialogue session.

Themed "Invest in China for a Win-Win Future," the dialogue highlighted the China International Import Expo and Shanghai's development as an international economic, financial, trade, shipping and technological innovation center. It also showcased the city's world-class business environment and provided a platform for high-level dialogue and practical cooperation between Chinese and U.S. companies.

The dialogue also featured a "Shanghai Charm" city image reception area. On one side, twenty selected historical photographs capturing key "Shanghai moments" in China-U.S. relations were displayed, including the signing of the Shanghai Communiqué, the launch of the first China-U.S. air route, the opening of Apple's first store in China, the Tesla Gigafactory and the 10th anniversary of Shanghai Disney Resort.

On the other side, 20 photographs from the IP SHANGHAI platform, under the theme "Chasing Dreams in Shanghai," showcased Lujiazui Financial City, Yangshan Deep-Water Port, Shanghai Grand Opera House, the North Bund shipping hub, and the Huangpu River and Suzhou Creek. Together, the displays offered guests a visual introduction to the city and created lasting memories of Shanghai.

With the support of the Information Office of the Shanghai Municipal Government and co-hosted by Shanghai Media Group, the World Intangible Cultural Heritage Conservation Center and the Washington Chinese Community Alliance, the event brought together guests from a range of sectors in China and the United States.

The event brought Shanghai closer to American audiences and the international community through city promotion, cultural performances, interactive experiences and high-level dialogue. It also provided a platform for people-to-people and cultural exchange between China and the United States. Reflecting the theme "Future Resonance," the event hoped to give a warm and positive boost to people-to-people exchanges between the two countries.

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

"Future Resonance -- ShanghaiEye Night" Brings Shanghai to Washington, Fosters People-to-People Exchange Across the Pacific

"Future Resonance -- ShanghaiEye Night" Brings Shanghai to Washington, Fosters People-to-People Exchange Across the Pacific

"Future Resonance -- ShanghaiEye Night" Brings Shanghai to Washington, Fosters People-to-People Exchange Across the Pacific

"Future Resonance -- ShanghaiEye Night" Brings Shanghai to Washington, Fosters People-to-People Exchange Across the Pacific

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