EL DORADO HILLS, Calif. and SINGAPORE, March 31, 2026 /PRNewswire/ -- Blaize Holdings, Inc. (Nasdaq: BZAI, Nasdaq: BZAIW) ("Blaize"), a global leader in programmable, energy efficient AI computing, today announced the next phase of its collaboration with Nokia regarding joint validation and ecosystem engagement across Asia Pacific.
Blaize and Nokia are progressing their collaboration through the Nokia Network Innovation Lab in Singapore, designed to support the development, integration, and validation of hybrid AI infrastructure solutions combining Blaize's AI platform with Nokia's networking and infrastructure capabilities.
As part of this next phase, the companies are advancing a joint reference architecture — a pre-integrated, validated solution framework that combines Blaize's AI platform with Nokia's networking and infrastructure capabilities. The reference is intended to support real-world deployment scenarios across edge and data center environments, providing a foundation for evaluation, integration, and ecosystem collaboration.
The collaboration will be highlighted at GITEX Asia 2026 (April 9–10, Singapore), where Blaize and Nokia will jointly showcase their combined capabilities through demonstrations, ecosystem engagement, and participation in industry discussions focused on next-generation AI infrastructure.
The joint engagement at GITEX Asia is expected to include:
- Joint solution showcase, demonstrating hybrid AI deployments across edge and data center environments
- Innovation Lab introduction, outlining the framework for ongoing validation and ecosystem collaboration
- Joint thought leadership participation, including panel discussions on AI infrastructure and edge computing
- Engagement with enterprises, governments, cloud service providers, and data center operators across Asia-Pacific
These initiatives are part of ongoing engagement efforts to evaluate how hybrid AI architectures can be applied to real-world environments where latency, power efficiency, and scalability are critical.
"This next phase reflects continued progress in our collaboration with Nokia across Asia-Pacific," said Joseph Sulistyo, Senior Vice President of Corporate Marketing at Blaize. "Through the Innovation Lab and joint solution efforts, we are focused on validating how hybrid AI infrastructure can support real-world applications and enable scalable deployment models across the region."
"Our collaboration with Blaize continues to evolve as we engage with customers and ecosystem partners across Asia-Pacific," said Dion Leung, Head of AI and Cloud, Asia Pacific at Nokia. "By combining networking infrastructure with AI inference platforms, we are exploring new approaches to support AI workloads across distributed environments."
Learn more at: https://www.blaize.com/blog/events/gitex-asia-2026/
About Blaize
Blaize delivers a programmable AI platform, purpose-built for inference in real world environments. Its Hybrid AI architecture enables Practical AI and Physical AI workloads to run efficiently at the edge while integrating seamlessly with cloud and GPU based infrastructure. Blaize solutions support computer vision, multimodal AI, and sensor driven applications across smart cities, industrial automation, telecommunications, retail, logistics, and defense. Blaize is headquartered in El Dorado Hills, California, with a global presence across North America, Europe, the Middle East, and Asia.
Cautionary Statement Regarding Forward Looking Statements
This press release contains forward-looking statements within the meaning of Section 27A of the U.S. Securities Act of 1933, as amended (the "Securities Act"), and Section 21E of the U.S. Securities Exchange Act of 1934, as amended (the "Exchange Act") that are based on beliefs and assumptions and on information currently available to Blaize, including statements regarding the expected scope of the engagement with Nokia and any potential definitive agreements related thereto; the industry in which Blaize operates, market opportunities, and product offerings. In some cases, you can identify forward-looking statements by the following words: "may," "will," "could," "would," "should," "expect," "intend," "plan," "anticipate," "believe," "estimate," "predict," "project," "potential," "continue," "ongoing," "target," "seek" or the negative or plural of these words, or other similar expressions that are predictions or indicate future events or prospects, although not all forward-looking statements contain these words. Forward-looking statements are predictions, projections, and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual future events to differ materially from the forward-looking statements in this document, including but not limited to: (i) changes in domestic and foreign business, market, financial, political and legal conditions; (ii) failure to realize the anticipated benefits of Blaize's business combination with BurTech Acquisition Corp., which may be affected by, among other things, competition, the ability of the combined company to grow and manage growth profitably, maintain relationships with customers and suppliers and retain its management and key employees; and (iii) those factors discussed under the heading "Risk Factors" in our Annual Report on Form 10-K filed with the Securities and Exchange Commission (SEC) on March 24, 2026, our and other documents filed by Blaize from time to time with the SEC. These filings identify and address other important risks and uncertainties that could cause actual events and results to differ materially from those contained in the forward-looking statements. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and Blaize assumes no obligation to update or revise these forward-looking statements, whether as a result of new information, future events, or otherwise, except as required by law, including the securities laws of the United States and the rules and regulations of the SEC. Blaize does not give any assurance that it will achieve its expectations.
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Blaize and Nokia Advance Collaboration with Joint AI Solution Showcase at GITEX Asia
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SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered large-scale mass production. The commercial launch of this product not only marks a significant milestone in the strategic collaboration between Fibocom and Samsung, but also provides high-performance and highly reliable connectivity solutions for global 5G FWA (Fixed Wireless Access) and broadband IoT applications, such as wireless fixed terminals, MiFi devices, and industrial gateways.
Strong Partnership: Elevating 5G Connectivity to New Era
This mass production milestone represents a key achievement in the deep strategic partnership between Fibocom and Samsung. Samsung's 5G chipset solutions have been widely validated through large-scale global deployments, known for their high stability, outstanding RF performance, and broad global compatibility. By integrating their technological strengths, both parties aim to leverage their expertise in chipset architecture and industry applications to accelerate the adoption and expansion of 5G across global vertical industries.
"At Samsung, we are pleased to deepen our strategic collaboration with Fibocom as we advance next generation 5G connectivity for global markets. The successful mass production of Fibocom's Fx550 module highlights our shared commitment to innovation, performance, and reliability in delivering cutting-edge connectivity for FWA and broadband IoT applications. Together, we are building a foundation for smarter, more connected industries in the AI era." – Jungwon Lee, executive vice president and head of the System LSI Modem Development Team at Samsung Electronics
Simon Tao, VP of Wireless Solutions Business Group and General Manager of MBB BU at Fibocom, stated: "We are honored to establish an exclusive partnership with Samsung Electronics, and to be the first to achieve large-scale mass production and market validation in the broader IoT domain. With the simultaneous rollout of multiple regional variants including Fx550-EAU, Fx550-JP, and Fx550-MEA, Fibocom will empower global enterprises to accelerate their growth on the fast lane of high-speed connectivity."
Key Advantages: Fx550 Empowering Industry Digital Transformation
Built on the Samsung Exynos Modem platform, the Fx550 module sets new benchmarks in process technology, transmission standards, and networking flexibility:
- 3GPP Rel.16 Support for Reliable Communications
Fully compliant with 3GPP Release 16, Fx550 delivers lower latency and higher bandwidth, meeting the demands of real-time data transmission and high-capacity connectivity in FWA and IoT applications. - Carrier Aggregation for Breakthrough Speeds
In NR SA mode, Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), achieving peak downlink speeds of up to 4.67Gbps. Its ability to efficiently aggregate fragmented spectrum enhances operator's live network's performance and user experience globally.
In NSA mode, it supports NR 2CC + LTE 5CC aggregation at maximum, with peak downlink speeds up to 6.47Gbps. Under LTE networks, Fx550 supports up to Cat.20 capability, ensuring strong compatibility with global 4G live networks. This advanced carrier aggregation capability improves spectrum utilization and ensures high-speed connectivity even in complex network scenarios. - Open-architecture for Optimized System Cost
Fx550 adopts a high-performance modem architecture and has been deeply adapted with mainstream application processors (APs/Host CPU) such as Broadcom and Realtek. This compatibility provides developers with greater flexibility, reduces development costs, and enables ODMs to create differentiated products.
In addition, Fx550 supports multiple operating systems including Linux, OpenWRT, RDK-B, and PrplOS, facilitating rapid FWA device development, software stack reusement, and seamless upgrades to the latest Wi-Fi Mesh standards, while enhancing Wi-Fi compatibility for CPE devices.
Global Coverage: Multiple Variants for Key Markets
To meet regional certification and deployment requirements, Fx550 is available already in multiple versions, including FM550-EAU (Europe/Asia/Australia), FG550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East & Africa). The modules are now ready to support customers globally with both products and technical services.
The mass production of Fx550 marks a crucial step in Fibocom's global 5G ecosystem strategy. Moving forward, Fibocom will continue to collaborate with global industry partners such as Samsung to lead 5G even 6G innovation and accelerate the widespread adoption of 5G FWA and IoT applications worldwide.
About Fibocom
Fibocom, founded in 1999, is China's first wireless communication module company listed on both the A-share and H-share markets (300638.SZ, 0638.HK). As a global leading provider of wireless communication modules and AI solutions, Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from "Connect Everything" to "Intelligent Connectivity" across diverse industries.
Fibocom's one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.
SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered large-scale mass production. The commercial launch of this product not only marks a significant milestone in the strategic collaboration between Fibocom and Samsung, but also provides high-performance and highly reliable connectivity solutions for global 5G FWA (Fixed Wireless Access) and broadband IoT applications, such as wireless fixed terminals, MiFi devices, and industrial gateways.
Strong Partnership: Elevating 5G Connectivity to New Era
This mass production milestone represents a key achievement in the deep strategic partnership between Fibocom and Samsung. Samsung's 5G chipset solutions have been widely validated through large-scale global deployments, known for their high stability, outstanding RF performance, and broad global compatibility. By integrating their technological strengths, both parties aim to leverage their expertise in chipset architecture and industry applications to accelerate the adoption and expansion of 5G across global vertical industries.
"At Samsung, we are pleased to deepen our strategic collaboration with Fibocom as we advance next generation 5G connectivity for global markets. The successful mass production of Fibocom's Fx550 module highlights our shared commitment to innovation, performance, and reliability in delivering cutting-edge connectivity for FWA and broadband IoT applications. Together, we are building a foundation for smarter, more connected industries in the AI era." – Jungwon Lee, executive vice president and head of the System LSI Modem Development Team at Samsung Electronics
Simon Tao, VP of Wireless Solutions Business Group and General Manager of MBB BU at Fibocom, stated: "We are honored to establish an exclusive partnership with Samsung Electronics, and to be the first to achieve large-scale mass production and market validation in the broader IoT domain. With the simultaneous rollout of multiple regional variants including Fx550-EAU, Fx550-JP, and Fx550-MEA, Fibocom will empower global enterprises to accelerate their growth on the fast lane of high-speed connectivity."
Key Advantages: Fx550 Empowering Industry Digital Transformation
Built on the Samsung Exynos Modem platform, the Fx550 module sets new benchmarks in process technology, transmission standards, and networking flexibility:
- 3GPP Rel.16 Support for Reliable Communications
Fully compliant with 3GPP Release 16, Fx550 delivers lower latency and higher bandwidth, meeting the demands of real-time data transmission and high-capacity connectivity in FWA and IoT applications. - Carrier Aggregation for Breakthrough Speeds
In NR SA mode, Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), achieving peak downlink speeds of up to 4.67Gbps. Its ability to efficiently aggregate fragmented spectrum enhances operator's live network's performance and user experience globally.
In NSA mode, it supports NR 2CC + LTE 5CC aggregation at maximum, with peak downlink speeds up to 6.47Gbps. Under LTE networks, Fx550 supports up to Cat.20 capability, ensuring strong compatibility with global 4G live networks. This advanced carrier aggregation capability improves spectrum utilization and ensures high-speed connectivity even in complex network scenarios. - Open-architecture for Optimized System Cost
Fx550 adopts a high-performance modem architecture and has been deeply adapted with mainstream application processors (APs/Host CPU) such as Broadcom and Realtek. This compatibility provides developers with greater flexibility, reduces development costs, and enables ODMs to create differentiated products.
In addition, Fx550 supports multiple operating systems including Linux, OpenWRT, RDK-B, and PrplOS, facilitating rapid FWA device development, software stack reusement, and seamless upgrades to the latest Wi-Fi Mesh standards, while enhancing Wi-Fi compatibility for CPE devices.
Global Coverage: Multiple Variants for Key Markets
To meet regional certification and deployment requirements, Fx550 is available already in multiple versions, including FM550-EAU (Europe/Asia/Australia), FG550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East & Africa). The modules are now ready to support customers globally with both products and technical services.
The mass production of Fx550 marks a crucial step in Fibocom's global 5G ecosystem strategy. Moving forward, Fibocom will continue to collaborate with global industry partners such as Samsung to lead 5G even 6G innovation and accelerate the widespread adoption of 5G FWA and IoT applications worldwide.
About Fibocom
Fibocom, founded in 1999, is China's first wireless communication module company listed on both the A-share and H-share markets (300638.SZ, 0638.HK). As a global leading provider of wireless communication modules and AI solutions, Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from "Connect Everything" to "Intelligent Connectivity" across diverse industries.
Fibocom's one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
New Milestone Achieved! Fibocom's Fx550 5G Module Based on Samsung Exynos Modem Enters Global Mass Production
