ZHITAI at COMPUTEX: Targeting Gamers and High-Performance Creators with Flagship SSD Launches Across the APAC Region

TAIPEI, June 2, 2026 /PRNewswire/ -- As the global SSD market welcomes a new era of diverse choices, ZHITAI, the consumer memory brand under YMTC, is expanding its Asia-Pacific footprint. During COMPUTEX 2026, ZHITAI will unveil three new-generation solid-state drives (SSDs), including the TiPro9000, TiPlus9100, and TiPlus7100s. All utilize YMTC's self-developed and patented core technology – "Xtacking®" architecture 3D NAND flash chips, to provide consumers with a stable and reliable experience along with ultra-fast performance.

Welcoming the New AI Era: ZHITAI Unveils Three New Products at COMPUTEX

At this year's COMPUTEX, ZHITAI unveiled its next-generation SSD lineup for the first time, introducing three new products: the flagship TiPro9000, the high-performance TiPlus9100, and the TiPlus7100s. In addition, ZHITAI has joined forces with ASUS to launch a range of co-branded SSD products, offering users a wider variety of choices.

The TiPro9000 is ZHITAI's first flagship PCIe 5.0 SSD, featuring an independent DRAM design coupled with an intelligent SLC caching mechanism. This significantly enhances SSD read/write and data transmission performance, pushing maximum read speeds up to 14,900 MB/s. Whether loading massive maps in AAA open-world games or editing 8K videos, it delivers full-throttle performance. Additionally, the TiPro9000 is equipped with a detachable heatsink and a single-sided chip layout, balancing highly efficient heat dissipation with installation flexibility, making it the ultimate choice for E-sports players and video creators.

For gamers who want to experience Gen5 high-speed performance, the TiPlus9100, the first PCIe 5.0 SSD product in the TiPlus series, is the ideal choice. It delivers a read performance of up to 12,000 MB/s. Combined with a single-sided PCB design and robust temperature control capabilities, it effectively mitigates the overheating vulnerabilities common to earlier PCIe 5.0 SSDs in thin and light devices, ensuring stable operation without throttling. Even during prolonged use under heavy workloads, it achieves a stable performance release without frequency drops. This allows users to fully immerse themselves in massive 3A games, live streaming, and 4K video editing. It is also perfectly suited for upgrading Ultrabooks and small-form-factor PCs.

The TiPlus7100s is ZHITAI's core SSD product for the PCIe 4.0 market. It reaches a maximum sequential read speed of up to 7,400 MB/s and adopts a single-sided chip layout, featuring low power consumption, low heat generation, and a long lifespan. It is ideal for upgrading older computers as well as expanding memory on gaming consoles such as the PS5. It is tailored to first-time SSD upgraders, casual gamers, and students. It is also suited to daily content creation and high-efficiency office use.

User-Centric Approach with a Strategic Focus on Growth in APAC

From its flagship TiPro9000 and high-end, high-performance TiPlus9100 to the TiPlus7100s that satisfies mass hardware upgrade demands, ZHITAI's varied product portfolio addresses the diverse needs of different users across gaming, professional creation, and everyday memory.

"The Asia-Pacific market is one of the key regions driving demand for high-performance memory upgrades," said Frank Fan, Head of Retail Business at YMTC. Fan noted that with the rapid development of AI applications, content creation, gaming entertainment, and high-performance PC scenarios, consumers' SSD demands are no longer limited to capacity. Instead, they are more focused on speed, stability, reliability, and long-term user experience.

"ZHITAI starts from user needs to pursue technological innovation that will deliver a more efficient, stable and reliable product experience," Fan emphasized. He noted that expanding across the Asia-Pacific region is a key strategic priority for ZHITAI. Starting from COMPUTEX, ZHITAI will progressively expand to other markets, including South Korea and Singapore, bringing its portfolio of high-performance memory products to more consumers across the region. Fan also said that ZHITAI will continually improve its sales channels and localized services in the region so that more users can enjoy the wonderful experience brought by its high-quality memory products.

[Appendix]

Product Specifications for the Three ZHITAI SSD Products

Product	ZHITAI TiPro9000
Capacity	1024 GB	2048 GB	4096 GB
Interface	PCIe™️ Gen 5.0 × 4, NVMe™️2.0
Form Factor	M.2 2280
Warranty Period	5 Years
Sequential Read Speed (MB/s)	14,900	14,900	14,900
Sequential Write Speed (MB/s)	13,500	13,800	13,800
Random Read Speed (K IOPS)	1,750	2,100	2,100
Random Write Speed (K IOPS)	2,200	2,200	2,200
Cache Type	DRAM Cache
Endurance (TBW)	600 TBW	1,200 TBW	2,400 TBW
Management Software	ZhiTai UNIMASTER SSD management software
Encryption Function	Supports TCG Pyrite Protocol

Product

ZHITAI TiPro9000

Capacity

1024 GB

2048 GB

4096 GB

Interface

PCIe™️ Gen 5.0 × 4, NVMe™️2.0

Form Factor

M.2 2280

Warranty Period

5 Years

Sequential Read Speed (MB/s)

14,900

14,900

14,900

Sequential Write Speed (MB/s)

13,500

13,800

13,800

Random Read Speed (K IOPS)

1,750

2,100

2,100

Random Write Speed (K IOPS)

2,200

2,200

2,200

Cache Type

DRAM Cache

Endurance (TBW)

600 TBW

1,200 TBW

2,400 TBW

Management Software

ZhiTai UNIMASTER SSD management software

Encryption Function

Supports TCG Pyrite Protocol

 

Product	ZHITAI TiPlus9100
Capacity	1024 GB	2048 GB	4096 GB
Interface	PCIe™️ Gen 5.0 × 4, NVMe™️2.0
Form Factor	M.2 2280
Warranty Period	5 Years
Sequential Read Speed (MB/s)	12,000	12,000	11,950
Sequential Write Speed (MB/s)	10,700	10,700	10,700
Random Read Speed (K IOPS)	1,850	1,850	1,850
Random Write Speed (K IOPS)	1,850	1,850	1,850
Cache Type	DRAM-less
Product Weight (Excluding Packaging)	Approx. 7g
Endurance (TBW)	600 TBW	1,200 TBW	2,400 TBW
Management Software	ZhiTai UNIMASTER SSD management software
Encryption Function	Supports TCG Pyrite Protocol

Product

ZHITAI TiPlus9100

Capacity

1024 GB

2048 GB

4096 GB

Interface

PCIe™️ Gen 5.0 × 4, NVMe™️2.0

Form Factor

M.2 2280

Warranty Period

5 Years

Sequential Read Speed (MB/s)

12,000

12,000

11,950

Sequential Write Speed (MB/s)

10,700

10,700

10,700

Random Read Speed (K IOPS)

1,850

1,850

1,850

Random Write Speed (K IOPS)

1,850

1,850

1,850

Cache Type

DRAM-less

Product Weight (Excluding Packaging)

Approx. 7g

Endurance (TBW)

600 TBW

1,200 TBW

2,400 TBW

Management Software

ZhiTai UNIMASTER SSD management software

Encryption Function

Supports TCG Pyrite Protocol

 

Product	ZHITAI TiPlus7100s
Capacity	1024 GB	2048 GB	4096 GB
Interface	PCIe™️ Gen 4.0 × 4, NVMe™️2.0
Form Factor	M.2 2280
Warranty Period	5 Years
Sequential Read Speed (MB/s)	7,400	7,400	7,400
Sequential Write Speed (MB/s)	6,900	6,900	6,900
Random Read Speed (K IOPS)	1,500	1,400	1,200
Random Write Speed (K IOPS)	1,500	1,500	1,500
Cache Type	DRAM-less
Endurance (TBW)	600 TBW	1,200 TBW	2,400 TBW

Product

ZHITAI TiPlus7100s

Capacity

1024 GB

2048 GB

4096 GB

Interface

PCIe™️ Gen 4.0 × 4, NVMe™️2.0

Form Factor

M.2 2280

Warranty Period

5 Years

Sequential Read Speed (MB/s)

7,400

7,400

7,400

Sequential Write Speed (MB/s)

6,900

6,900

6,900

Random Read Speed (K IOPS)

1,500

1,400

1,200

Random Write Speed (K IOPS)

1,500

1,500

1,500

Cache Type

DRAM-less

Endurance (TBW)

600 TBW

1,200 TBW

2,400 TBW

 

About ZHITAI

Established in 2020, ZHITAI is the consumer memory brand under Yangtze Memory Technologies Co., Ltd. (YMTC). Focusing on SSDs, mobile memory, and diverse memory solution products, and powered by YMTC's independently innovated "Xtacking®" architecture technology, ZHITAI continuously drives high-performance and high-quality memory experiences, actively expanding across global consumer markets and multi-application fields such as E-sports, PC DIY, and creators. For more brand information, please visit: https://www.ymtc.com/en/

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

ZHITAI at COMPUTEX: Targeting Gamers and High-Performance Creators with Flagship SSD Launches Across the APAC Region

TAIPEI, June 2, 2026 /PRNewswire/ -- MSI showcases a comprehensive portfolio of AI and data center infrastructure platforms at COMPUTEX 2026 (Booth #J0605a), with liquid-cooled infrastructure at the center as increasing compute density drives greater thermal demands across modern data centers. The lineup spans liquid-cooled ORv3 rack-scale architectures for high-density AI infrastructure, NVIDIA MGX platforms for scalable AI training and inference, DGX Station desktop AI supercomputer for local AI development, and DC-MHS multi-node and enterprise server platforms for modular cloud and enterprise deployments.

"Scaling AI infrastructure now requires a balance between compute performance, thermal efficiency, and deployment flexibility," said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "MSI's AI platform portfolio is designed to support AI deployment from rack-scale infrastructure to local AI development."

Liquid-Cooled and Air-Cooled Rack Architectures

MSI expands its infrastructure portfolio with OCP ORv3 liquid-cooled and standard EIA air-cooled rack architectures for modern data centers. The ORv3 platform targets high-density AI and cloud infrastructure, while the EIA architecture supports standardized deployment within existing enterprise environments.

The 21" 44OU ORv3 Liquid-Cooled Rack Architecture supports up to 100kW deployments with an integrated Liquid-to-Liquid Coolant Distribution Unit (L2L CDU). Configured with 28x 1OU2N Open Compute multi-node systems, the wider 21" ORv3 design enables higher compute density, efficient liquid cooling, and 48V busbar power distribution for large-scale AI infrastructure.

The 19" 48RU EIA Air-Cooled Rack Architecture supports standardized deployment within existing data center environments. Configured with 16x 2U2N multi-node systems, the platform enables scalable cloud and enterprise infrastructure integration within standard EIA racks, with both AMD EPYC™ 9005 and Intel® Xeon® 6 platform options for deployment flexibility.

NVIDIA MGX AI Servers and NVIDIA DGX Station

MSI's NVIDIA-based AI infrastructure portfolio spans both GPU-accelerated AI servers and desktop AI supercomputing platforms. Built on NVIDIA MGX architecture, the AI server portfolio supports scalable AI training, inference, and HPC deployments across air-cooled and liquid-cooled configurations. Built on NVIDIA DGX Station architecture, the desktop platform delivers data-center-class AI computing for local development, fine-tuning, and inference workloads.

The NVIDIA MGX server portfolio includes 2U, 4U, and 6U GPU platforms designed for AI training, inference, HPC, and data-intensive workloads. Supporting NVIDIA H200 NVL, NVIDIA RTX PRO 6000, and NVIDIA RTX PRO 4500 Blackwell Server Edition GPUs, these systems provide scalable GPU configurations across modern AI infrastructure environments, while extending MSI's collaboration within the NVIDIA MGX ecosystem toward next-generation Vera Rubin rack-scale platforms.

• CG681-S6093: A liquid-cooled 6U dual-socket AMD EPYC platform supporting up to 8 NVIDIA RTX PRO 6000 Blackwell Server Liquid Cooled Edition GPUs, 32 DDR5 DIMMs, and NVIDIA ConnectX-8 SuperNICs with up to 8×400Gbps networking for AI training and HPC deployments.
• CG480-S5063: A 4U dual-socket Intel Xeon 6 platform supporting up to 8 double-wide GPUs, 32 DDR5 DIMMs, 20 E1.S NVMe drives, and 5 additional PCIe 5.0 expansion slots for storage-rich AI and HPC workloads.
• CG481-S6053 / CG480-S6053: 4U dual-socket AMD EPYC 9005 platforms supporting up to 8 double-wide GPUs, 24 DDR5 DIMMs, and 8 U.2 NVMe drives for multi-GPU AI and HPC deployments. The CG481-S6053 features up to 8×400G QSFP112 networking via NVIDIA ConnectX-8 SuperNICs for distributed AI training and high-bandwidth GPU clusters, while the CG480-S6053 provides 5 additional PCIe 5.0 expansion slots for scalable AI infrastructure configurations.
• CG290-S3063: A 2U single-socket Intel Xeon 6 platform supporting up to 4 double-wide GPUs, 16 DDR5 DIMMs, and 4 rear U.2 NVMe drives for inference, edge AI, and space-constrained data center deployments.

The XpertStation WS300 on NVIDIA DGX Station architecture is a desktop AI supercomputer designed for AI development, fine-tuning, inference, and data-intensive workflows with Windows support for local AI application and agent development. Powered by the NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip, the platform supports up to 748GB coherent memory and 7.1TB/s HBM3e bandwidth for high-speed CPU-GPU communication and large AI model processing. Dual 400GbE networking via NVIDIA ConnectX-8 SuperNICs and liquid-cooled thermal design further enable data-center-class AI computing within a compact deskside form factor.

DC-MHS Open Compute and Core Compute Multi-Node Platforms

MSI offers both 21" Open Compute and 19" Core Compute multi-node platforms for hyperscale and cloud data centers. Built on DC-MHS architecture, these systems enable modular platform integration, scalable infrastructure deployment, and simplified platform transition across modern compute environments.

The 21" Open Compute portfolio includes air-cooled and liquid-cooled 1OU2N, 2OU2N, and 2OU4N platforms optimized for high-density AI and cloud infrastructure with 48Vdc busbar power distribution.

• CD281-S4051-X4 (Liquid Cooling): A liquid-cooled 2OU 4-Node platform supporting a single AMD EPYC 9005 processor, 12 DDR5 DIMMs, and 4 E1.S NVMe bays per node for AI inference and cloud-native infrastructure.
• CD281-S4051-X2: A 2OU 2-Node platform supporting a single AMD EPYC 9005 processor, 12 DDR5 DIMMs, 12 E3.S NVMe bays, and dual FHHL PCIe 5.0 expansion slots per node for storage-rich cloud and scale-out deployments.

The 19" Core Compute portfolio spans 2U2N and 2U4N platforms for enterprise and cloud infrastructure deployment within standard 19" EIA rack environments.

• CD270-S3071-X4 / CD270-S3071-X2: Intel Xeon 6/6+ based 2U 4-Node and 2U 2-Node platforms with 12 DDR5 DIMMs per node, supporting Intel Xeon 6+ processors with up to 288 E-cores. The X4 supports 3 U.2 NVMe bays per node for compute-focused cloud infrastructure, while the X2 supports 6 bays per node for virtualization and data-centric services.
• CD270-S3061-X4: A 2U 4-Node Intel Xeon 6 platform supporting 16 DDR5 DIMMs and 3 U.2 NVMe bays per node for mainstream scale-out and containerized deployments.
• CD270-S4051-X4 / CD270-S4051-X2: AMD EPYC 9005-based 2U 4-Node and 2U 2-Node platforms supporting 12 DDR5 DIMMs per node. The X4 supports 3 U.2 NVMe bays per node for compute-dense infrastructure, while the X2 adds 6 U.2 NVMe bays per node for mixed compute and storage environments.

Enterprise Platforms Across DC-MHS and Standard Architectures

MSI's enterprise platform portfolio spans DC-MHS enterprise servers, modular HPMs, and standard enterprise motherboards for cloud and enterprise infrastructure deployment. The portfolio includes GPU-ready server platforms, modular DC-MHS platform integration, and standard server motherboards designed for flexible deployment across enterprise and workstation environments.

DC-MHS Enterprise Servers

• CX270-S5062 (-HE SKU) / CX170-S5062: Dual-socket Intel Xeon 6 based 2U and 1U platforms supporting 32 DDR5 DIMMs. The CX270-S5062 supports 8 U.2 NVMe drives and up to 2 double-wide 600W GPUs for virtualization and GPU-accelerated workloads, while the CX170-S5062 supports 12 U.2 NVMe drives for high-density cloud infrastructure.
• CX271-S4056 (-HE SKU) / CX171-S4056: Single-socket AMD EPYC 9005 based 2U and 1U platforms supporting 24 DDR5 DIMMs. The CX271-S4056 supports 8 U.2 NVMe drives and up to 2 double-wide 600W GPUs for AI inference and accelerated computing, while the CX171-S4056 supports 12 U.2 NVMe drives for scale-out cloud infrastructure.
• CX271-S3066 (-HE SKU) / CX171-S3066: Single-socket Intel Xeon 6 based 2U and 1U platforms supporting 16 DDR5 DIMMs. The CX271-S3066 supports 8 U.2 NVMe drives and up to 2 double-wide 600W GPUs, while the CX171-S3066 supports 12 U.2 NVMe drives for mainstream cloud deployments.

DC-MHS HPMs and Standard Enterprise Motherboards

Supporting M-DNO Type-2, M-DNO Type-4, and M-FLW form factors, the DC-MHS HPM portfolio provides modular DC-MHS platform integration, while standard server motherboards support mainstream enterprise and workstation platforms.

• Dual-Socket Intel Xeon 6 M-FLW HPMs: D5062
• Single-Socket Intel Xeon 6/6+ M-DNO Type-2 HPMs: D3071 / D3061
• Single-Socket Intel Xeon 6 M-DNO Type-4 HPMs: D3066
• Single-Socket AMD EPYC 9005 M-DNO Type-2 HPMs: D4051
• Single-Socket AMD EPYC 9005 M-DNO Type-4 HPMs: D4056
• Standard Intel Xeon 6 Enterprise Motherboard: D3060
• Standard AMD EPYC 9005 Enterprise Motherboard: D4050

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

MSI Showcases Liquid-Cooled AI Infrastructure, NVIDIA MGX, NVIDIA DGX Station and DC-MHS Platforms at COMPUTEX 2026