Aurra Markets wins the 'Most Transparent Broker' award at Money Expo Mumbai 2026. Read about our MT5 infrastructure and Aurra Wallet.
MUMBAI, India, Sept. 3, 2026 /PRNewswire/ -- Aurra Markets Wins 'Most Transparent Broker' Award at Money Expo Mumbai
Aurra Markets, a multi-asset CFD broker, received the 'Most Transparent Broker' award at Money Expo Mumbai 2026. Participating as a Diamond Sponsor at the Jio World Convention Centre, the brokerage presented its institutional-grade trading infrastructure and partnership models to the Indian financial community.
Direct Market Access and Tier-1 Liquidity
Receiving this award reflects the company's focus on maintaining secure trading conditions. In active financial markets, reliability is a primary requirement for retail and institutional traders. By integrating direct Tier-1 liquidity and holding fully segregated client funds, Aurra Markets provides a stable environment for trading forex, precious metals, and indices. The team demonstrated its MetaTrader 5 (MT5) framework at Booth 33, highlighting the 12ms execution speed that supports algorithmic and day traders.
Efficient Funding via the Aurra Wallet
The exhibition also served as a platform to detail the company's advanced funding infrastructure. Clients can manage their capital using the Aurra Wallet. This unified system bridges fiat and digital assets, allowing traders to handle deposits and withdrawals efficiently. Integrating this technology reduces banking delays and provides rapid market access.
Expanding Operations in the Indian Market
"We are honored to receive the Most Transparent Broker award in Mumbai," a senior spokesperson for Aurra Markets stated. "This recognition validates our infrastructural investments designed to lower trading costs and maintain security. Engaging with affiliates and traders in India confirms the demand for high-performance trading solutions. We provide market participants with the stability needed to trade macroeconomic shifts."
About Aurra Markets
Aurra Global Markets Limited is authorized and regulated by the Mauritius Financial Services Commission (FSC) under License No. GB25204837. Aurra Markets provides a global community of traders with the direct infrastructure and technical resources needed to operate in dynamic financial markets. For more information, visit www.aurra.markets.
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Aurra Markets Receives 'Most Transparent Broker' Award in Mumbai
New optical/electrical solution aggregates two simultaneous MIPI-DPHY camera streams, at up to 10 Gbps each, over two serialized links while consuming less than 100 mW per link, eliminating bulky cable bundles with optical fiber or differential copper connectivity. Discover more: https://silicon-line.com/msdl
MUNICH, Sept. 3, 2026 /PRNewswire/ -- EverProX Technologies Munich GmbH, under its Silicon Line® brand—a pioneer in ultra-low-power optical and electrical interconnect technology—today announced the launch of "MSDL™ 20G" which is the first product in the new MSDL™ family, an end-to-end interconnect chipset comprising the SL8582x serializer and SL8581x de-serializer. Engineered to overcome the bandwidth, EMI, and reach limitations of traditional MIPI D-PHY signals, the dual-port chipset delivers up to two simultaneous 10 Gbps serialized links for next-generation vision systems.
Breaking Physical Cabling Bottlenecks
As high-resolution multi-camera systems and high-frame-rate displays drive rapidly increasing bandwidth requirements, traditional copper cabling is increasingly constrained by limited reach and susceptibility to electromagnetic interference (EMI). The "MSDL™ 20G" chipset, comprising SL8582x serializer and SL8581x de-serializer resolves this by aggregating multi-stream video over optical fibers or differential copper pairs, extending link distances to tens of meters while eliminating bulky, shielded cable bundles. The highly integrated architecture delivers ultra-low-power consumption in both optical and electrical modes, with total SerDes power well below 100 mW per 10 Gbps link.
Executive Perspective
"Physical AI is changing the way electronic systems are built. We are seeing more and faster cameras, more sensors, and greater intelligence distributed across devices," said Yifeng Liann, CEO and Managing Director of EverProX Technologies Munich GmbH. "As systems get smarter, moving high-bandwidth data between devices reliably and in real time becomes increasingly challenging. Engineers must balance the flexibility to connect across different subsystems, the reliability that mission-critical applications cannot always get from wireless, and the ultra-low power needed to make it all practical. That's the problem the Silicon Line® team set out to solve: making high-bandwidth connectivity more energy-efficient, more reliable, and easier to integrate into the next generation of intelligent systems."
Key Technical Highlights
- Dual-Port Multi-Camera Aggregation: Supports up to two simultaneous transmissions of single- or stereo-camera streams over one or two serialized links, with one transmission per link
- Optical or Copper Connectivity: Integrated VCSEL drivers and TIA enable optical links over tens of meters, while supporting differential copper links up to 2 meters
- Ultra-Low Power: Consumes just 71 mW per optical link and 87 mW per electrical link, excluding the integrated Sideband SerDes:
- Optical Mode: Serializer 17 mW, De-serializer 54 mW (Typical)
- Electrical Mode: Serializer 27 mW, De-serializer 60 mW (Typical)
- Integrated Bidirectional Sideband SerDes: Transports I²C, GPIO, digital audio, SPI/control signals and sensor clocks alongside MIPI data, reducing cable count, connector complexity, and system components.
- Target Applications:
- AR/VR: Enables lighter, more flexible tethering and greater mobility
- Medical Endoscopy: Supports 4K/8K imaging, ultra-low heat generation, and thin optical connectivity
- Industrial Robotics and Machine Vision: Delivers reliable, EMI-immune high-speed vision connectivity in electrically noisy environments
- Defense and UAVs: Provides lightweight, low-power multi-camera connectivity that reduces cable weight and increases battery life
- Optical Mode: Serializer 17 mW, De-serializer 54 mW (Typical)
- Electrical Mode: Serializer 27 mW, De-serializer 60 mW (Typical)
- AR/VR: Enables lighter, more flexible tethering and greater mobility
- Medical Endoscopy: Supports 4K/8K imaging, ultra-low heat generation, and thin optical connectivity
- Industrial Robotics and Machine Vision: Delivers reliable, EMI-immune high-speed vision connectivity in electrically noisy environments
- Defense and UAVs: Provides lightweight, low-power multi-camera connectivity that reduces cable weight and increases battery life
Availability & Ecosystem Support
The MSDL™ 20G (SL8582x&SL8581x) are sampling now with early-access customers in bare die or compact 4×4 mm µBGA-78 packages. Evaluation Kits (EVKs) are available now for link validation. Backed by EverProX's turnkey assembly, customers can transition seamlessly from IC design to mass production. For more information, visit https://www.silicon-line.com/ or contact sales@silicon-line.com.
About EverProX Technologies Munich GmbH and Silicon Line®
Silicon Line® — a brand of EverProX Technologies Munich GmbH — is a leading IC developer of ultra-low-power optical and electrical interconnect solutions for high-speed video and data transmission. Based in Munich, Germany, the Silicon Line® portfolio includes ultra low power MIPI SerDes ICs (from MSDL™ 2G up to MSDL™ 20G), TIA&VCSEL drivers that enable ultra-thin, lightweight, and EMI-immune active optical cables (AOCs) and embedded optical links for VR/AR, medical, industrial, robotics, defense and consumer markets.
Media Contact:
Emre Oralli
Product Marketing Manager
EverProX Technologies Munich GmbH / Silicon Line®
Email: emre.Oralli@silicon-line.com
Phone: +49 151 20620735
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Silicon Line®, an EverProX® brand, Launches new Ultra-Low-Power SerDes Chipset MSDL™ (MIPI Serial Data Link), Extending 20 Gbps MIPI D-PHY Connectivity to Tens of Meters
