KENT, Wash.--(BUSINESS WIRE)--Sep 8, 2026--
Stoke Space Technologies, Inc. the rocket company developing fully and rapidly reusable launch vehicles, announced today that it has completed an initial closing of its billion-dollar Series E financing round. This funding brings Stoke’s total capital raised to $2.3 billion and will support the company as it prepares for its first orbital launch, expands production and launch capacity, and accelerates development of its larger Nova Block 2 launch vehicle.
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The round was co-led by Point72 Ventures and Spark Capital, with participation from General Innovation, Glade Brook Capital, US Innovation Technology, Washington Harbour Partners, Woven Capital, Y Combinator, and other new and existing investors.
“Stoke is pursuing what we see as one of the most important opportunities in space transportation: making launch fully reusable, reliable, and scalable,” said Chris Morales, Partner at Point72 Ventures. “Having supported Stoke through multiple stages of its growth, we believe this company has demonstrated both the exceptional technical progress and the ambition to build a launch system capable of serving the market at industrial scale. That progress has strengthened our conviction in the team. We are proud to support Stoke as it moves toward flight and high-cadence operations.”
“Every mature transportation system is built around fully reusable vehicles. It’s the only way to reach the cost floor while scaling availability. Space transportation will be no different,” said Andy Lapsa, co-founder and CEO of Stoke. “We are humbled by the trust our investors and customers have placed in us in pursuit of this critical generational challenge. This investment enables us to scale toward delivering the capability and cadence our customers require.”
The financing advances the development of Stoke’s core reuse technologies, alongside manufacturing, test, launch, and recovery infrastructure to support high-cadence operations. Stoke’s Nova Pathfinder vehicle is approaching its first flight. Pathfinder will carry payloads to orbit while proving Nova’s core architecture, full reuse technologies, and operational capabilities. Stoke is targeting early 2027 for the first orbital launch of Pathfinder.
Over the last several years, the launch market has been sending a clear and consistent signal demanding more capacity, greater availability, and flexibility to fly larger missions. Accordingly, the Series E funding also supports an expanded product roadmap. Stoke’s higher capacity Nova Block 2 vehicle is already under development and carries forward the architecture and technologies being proven on Pathfinder. Nova Block 2 delivers 15 metric tons to low Earth orbit (LEO) in a 5-meter payload fairing. Its first launch is targeted for 2029, with production and flight cadence ramping quickly from there.
“ Full reusability is the inevitable end state of the market, providing an order-of-magnitude cost and service advantage over partially reusable rockets,” said Clay Fisher, General Partner at Spark Capital. “Stoke had the right thesis seven years ago and has paired that prescient vision with a blistering pace of execution. As a result, they stand uniquely positioned to give customers more choice and capacity when they need it, and to unlock an enormous new economy in space.”
For a deeper look at the vehicle architecture and development strategy, see Stoke’s roadmap from Nova Pathfinder to Nova.
“Nova Pathfinder is how we turn the promise of Nova into flight-proven capability,” Lapsa said. “Pathfinder allows us to learn quickly, reduce risk, and prove the hardest parts of a fully reusable architecture in flight. Nova Block 2 scales those lessons into the capacity and cadence our customers are asking for. This investment allows us to move with urgency on both and brings us closer to delivering payloads to any orbit at any time.”
About Stoke
Stoke is building fully and rapidly reusable launch vehicles designed to provide reliable, on-demand transportation to, through, and from space. Its vehicles are designed for rapid turnaround and high-frequency operation, dramatically lowering the cost of access while expanding the range of missions that launch systems can serve. Stoke’s technology development has been supported by NASA, the U.S. Space Force, the Defense Innovation Unit, the National Science Foundation, and other commercial and government partners.
The upper stage flight article for Flight 1 of Stoke Space’s Nova Pathfinder launch vehicle at the company’s headquarters in Kent, Wash.
SUNNYVALE, Calif.--(BUSINESS WIRE)--Sep 8, 2026--
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide-bandgap power devices, power management ICs and modules, today announced the release of αMOS E2™ 600V Super Junction MOSFETs: AOGT037V60DE2 and AOGT060V60DE2. AOS engineered its newly developed αMOS E2 High-Voltage MOSFET platform to meet the growing demands for enhanced efficiency and increased power density management capabilities. These 600V Super Junction MOSFETs provide excellent performance across a wide range of today’s higher voltage applications, including servers, workstations, telecom rectifiers, solar inverters, motor drives and industrial power systems.
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Users of the latest high-performance SMPS and solar inverters expect higher efficiency, greater power density, lower system cost and uncompromising robustness. The advanced technology features in AOS’ top-side-cooled high-voltage Super Junction MOSFETs address these needs. These devices also meet the critical requirements in multiple topologies such as boost PFC, totem-pole PFC (slow leg), LLC resonant, PSFB and cyclo-converters.
AOS’ αMOS E2 High-Voltage Super Junction MOSFET platform features exceptional body-diode ruggedness (di/dt = 1500 A/µs), superior avalanche (UIS) capability, and short-circuit withstand time (SCWT). This enhanced ruggedness translates into higher system-level reliability, helping to ensure robust operation even under abnormal scenarios. Furthermore, AOS combines this αMOS E2 silicon with its top-side-cooled GTPAK™ package to maximize thermal performance via the top-side cooling pad. As a result, system designers can fully optimize thermal dissipation and reclaim PCB space to maximize overall power density. By co-optimizing both the electrical and thermal paths, system performance and long-term reliability are greatly enhanced.
“Our top-side cooled GTPAK products, such as the AOGT037V60DE2 and AOGT060V60DE2, are engineered to meet the demands of high-performance AC/DC power supplies, DC/DC converters and DC/AC solar inverters. Electromagnetic emission (EMI) and density bottlenecks of traditional bottom-side cooling have been a major engineering hurdle. Our αMOS E2 top-side cooled solutions give designers a premier solution for mid-to-high-power systems, empowering the performance-driven power infrastructure, power supply units, and renewable energy systems,” said Simon Yu, Senior Manager of HV Product Line at AOS.
Technical Highlights
Pricing and Availability
The AOGT037V60DE2 (600 V, 37 mΩ) and AOGT060V60DE2 (600 V, 60 mΩ) in top-side-cooled GTPAK packages are now available in production quantities with a lead time of 16 weeks. The unit prices for 1,000-piece quantities are $6.00 and $3.00, respectively.
About AOS
Alpha and Omega Semiconductor Limited, or AOS, is a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, including a wide portfolio of Power MOSFET, SiC, GaN, IGBT, IPM, TVS, HV Gate Drivers, Power IC, and Digital Power products. AOS has developed extensive intellectual property and technical knowledge that encompasses the latest advancements in the power semiconductor industry, which enables us to introduce innovative products to address the increasingly complex power requirements of advanced electronics. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high-performance power management solutions. AOS’ portfolio of products targets high-volume applications, including personal computers, graphics cards, data centers, AI servers, smartphones, consumer and industrial motor controls, TVs, lighting, automotive electronics, and power supply units for various equipment. For more information, please visit www.aosmd.com.
Forward-Looking Statements
This press release contains forward-looking statements that are based on current expectations, estimates, forecasts, and projections of future performance based on management’s judgment, beliefs, current trends, and anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products and the potential to expand into new markets. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company’s annual report and other filings with the U.S. Securities and Exchange Commission. Although the Company believes that the expectations reflected in the forward-looking statements are reasonable, it cannot guarantee future results, level of activity, performance, or achievements. You should not place undue reliance on these forward-looking statements. All information provided in this press release is as of today’s date unless otherwise stated, and AOS undertakes no duty to update such information except as required under applicable law.
Advanced AOGT037V60DE2 and AOGT060V60DE2 top-side cooled high-voltage MOSFETs deliver the power density and robustness required by high-performance power systems and solar inverters.
