VIENNA, Oct. 14, 2026 /PRNewswire/ -- BingX EU (MEGE zweite GmbH) has secured its Markets in Crypto-Assets Regulation (MiCA or MiCAR) license from Austria's Financial Market Authority (FMA), that will enable the platform to offer regulated crypto services across 29 countries of the European Economic Area (EEA), subject to ongoing passporting arrangements. The authorization marks a significant milestone in BingX's European expansion, providing EEA users with access to digital asset services under a unified regulatory framework built on transparency, security, and investor protection.
The authorization reflects BingX EU's long-term commitment to responsible growth in Europe. As digital assets become increasingly integrated into the financial system, regulatory clarity plays an essential role in strengthening user confidence, supporting institutional participation, and enabling sustainable industry development. Through its regulated European entity, BingX EU will provide compliant crypto services designed to meet the evolving needs of both retail and institutional users across the EEA.
"Our priority is to provide European users with trusted and locally regulated trading experience," said Daniel Lai, Chief Executive Officer of BingX EU. "Operating under MiCAR will allow us to deliver our services under a clear regulatory framework that gives users confidence while supporting the long-term development of Europe's digital ecosystem. It also enables us to combine innovation with the high standards of security, transparency and accountability that European users and institutions expect. We believe this foundation can help create a more accessible and sustainable environment for the continued adoption of digital assets across the region."
Looking forward, BingX EU will continue working closely with Austria's FMA and other European regulators as it prepares for the launch of its regulated services across the European Economic Area. BingX EU remains committed to operating within Europe's regulatory framework while providing users with secure, transparent and compliant access to digital asset services.
About BingX EU
MEGE zweite GmbH ("BingX EU") is a MiCAR-regulated crypto-asset platform, headquartered in Vienna, licensed as a Crypto-Asset Service Provider (CASP) under the Markets in Crypto-Assets Regulation (MiCAR). Dedicated to serving clients across 29 countries in the European Economic Area, BingX EU delivers fully regulated services in alignment with European standards for investor protection and market integrity. Under its MiCAR authorization, BingX EU provides a platform that offers regulated broker services, such as crypto custody, exchange, and other crypto services.
About BingX
Founded in 2018, BingX is one of the world's leading multi-asset trading platform, serving more than 40 million users worldwide. The company has been the Principal Partner of Chelsea FC since 2024 and became the Official Team Partner of Scuderia Ferrari HP in 2026.
Disclaimers: The content qualifies as a marketing communication under the Markets in Crypto-Assets Regulation (MiCAR) and is issued by MEGE zweite GmbH (BingX EU). It does not constitute investment advice.
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BingX EU Secures MiCAR License, Advancing Regulated Crypto Services Across Europe
Advancing Next-Generation Grid-to-Chip Energy Architecture for AI Infrastructure
SAN JOSE, Calif., Oct. 15, 2026 /PRNewswire/ -- LITEON Technology (2301) participates in the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, from October 12 to 15, showcasing its next-generation AI factory infrastructure portfolio centered on 800 VDC architecture. The exhibition features power rack solutions supporting the NVIDIA Vera Rubin platform, integrated power and thermal management solutions designed for NVIDIA MGX and OCP ORv3 architectures, demonstrating its Grid-to-Chip technology portfolio.
800 VDC Advances Power and Cooling Architecture for Megawatt-Scale AI Infrastructure
LITEON showcases its 800 VDC Power Shelf integrated with Battery Backup Unit (BBU), demonstrating next-generation 800 VDC power architectures for AI factories. To address the growing thermal demands of high-density AI computing, LITEON debuts the 2.6MW Enterprise Cooling Distribution Unit (CDU) from its strategic investment partner, DCX Liquid Cooling Systems. The solution delivers up to 2.6MW of heat transfer capacity, achieves an approach temperature of 3°C, and incorporates an N+1 redundant pump design to maximize cooling efficiency while ensuring system reliability for high-density AI and HPC deployments. Also on display is the CDU's next-generation HMI and integrated software layer, designed to enhance operational efficiency and provide clear, at-a-glance visibility into key system parameters.
For the NVIDIA Vera Rubin NVL72 platform, LITEON is also showcasing an integrated infrastructure solution featuring a 95kW DC/DC Power Shelf and a 280kW Liquid-to-Liquid (L2L) In-Rack CDU. Designed based on NVIDIA MGX architecture, the solution combines 800 VDC distribution, energy backup, and thermal management technologies to reduce transmission losses and heat generation, improve energy efficiency and power density, simplify power infrastructure, and free additional rack space for high-density AI deployments.
"In the AI era, data center competitiveness is no longer defined solely by compute scale," said John Chang, General Manager of LITEON Cloud Infrastructure Platform and Solution SBG. "Instead, it is measured by tokens per watt and how efficiently power can be converted into meaningful AI output. As AI platforms continue to scale in power density, data centers must simultaneously optimize energy efficiency, cooling performance, and deployment flexibility. High-efficiency power delivery and thermal management architecture have become the critical foundation for scaling future AI Factories."
ORv3 Power and Thermal Management Solutions Support Scalable AI Infrastructure
LITEON is also showcasing an integrated AI power rack solution designed for the ORv3 architecture, integrating an 180kW Power Shelf and a 108kW Capacitor Backup Unit (CBU). Through centralized power delivery and supercapacitor backup capabilities, the solution addresses dynamic AI workloads while enhancing power stability and overall system reliability.
Optimized for liquid cooling compatibility, the ORv3 architecture enables higher-density deployments and greater infrastructure flexibility. LITEON shows key cooling modules including 120kW and 220kW In-Rack CDUs, which can be integrated with advanced cooling technologies such as Direct-to-Chip architectures. These solutions enable greater GPU density, enhanced thermal performance, and flexible infrastructure design for next-generation AI and HPC platforms. By integrating power, backup, and thermal management systems, LITEON helps customers build efficient, reliable, and scalable AI infrastructure.
From 800 VDC Distribution to GPU Power Delivery: Building a Complete Grid-to-Chip Energy Architecture
As AI processors continue to increase in power consumption, efficiently delivering electricity from the rack level to the GPU has become a critical challenge for next-generation AI infrastructure. To address this challenge, LITEON is showcasing its comprehensive DC-DC power conversion portfolio, including 800V Power Bricks, IBC Modules, 50V Power Bricks, and Voltage Regulator Modules (VRM). These product lines bridge every stage of power delivery, from 800 VDC distribution and server-level power conversion to chip-level voltage regulation, demonstrating LITEON's complete Grid-to-Chip energy architecture for future high-density AI computing platforms.
Among these, the 800V DC/DC power brick can be deployed on the HVDC power distribution board (PDB) for downstream distribution and step-down conversion. Multiple bricks can be paralleled to match different power requirements, with active current sharing improving supply stability and reliability. The intermediate bus converter (IBC) then performs the next stage of voltage conversion. This raises overall power delivery efficiency, reduces distribution losses, optimises board area and system cost, and improves supply stability in multi-output architectures. Finally, the voltage regulator module (VRM) delivers a precise, stable operating voltage to the GPU, completing the "last mile" of power delivery from the rack to the chip.
Strengthening the Global Ecosystem to Enable Comprehensive AI Infrastructure Capabilities
As AI computing infrastructure continues evolving toward higher power density and greater energy efficiency, LITEON is expanding its capabilities across power delivery, thermal management, and system-level energy optimization. By extending its expertise from infrastructure power systems to comprehensive Grid-to-Chip energy management, LITEON is building a complete portfolio of AI infrastructure energy solutions.
LITEON continues to deepen collaboration with NVIDIA and the broader OCP ecosystem while leveraging its global manufacturing footprint and localized service capabilities. Through close ecosystem partnerships, LITEON is helping customers address the growing demand for high-performance, highly reliable, and highly scalable infrastructure in the AI Factory era, accelerating deployment and expansion of next-generation AI data centers.
LITEON Technology 2026 OCP Global Summit Exhibition Information:
Date: October 12–15, 2026
Venue: San Jose McEnery Convention Center, USA
Booth: C51, Hall 2
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LITEON Showcases NVIDIA 800 VDC Architecture and Thermal Management Portfolio at OCP Global Summit 2026
