KLEVV UNVEILS ALL-NEW CRAS V RGB PRIME DDR5 GAMING/OC MEMORY

SUPPORTS AMD EXPO™ Technology: Featuring Ultra Low Latency
WITH AWARD-WINNING FLAGSHIP DESIGN

HONG KONG, Oct. 28, 2026 /PRNewswire/ -- KLEVV, the leading consumer memory and storage brand introduced by Essencore, unveils the all-new CRAS V RGB PRIME DDR5 Gaming/OC Memory. Purpose-built for elite gaming rigs and demanding creative workloads, this new premium memory unleashes ultra-low CAS latency down to CL26 at 6000 MT/s and blazing overclocking speeds of up to 8000 MT/s at CL38, dressed in a striking black-and-gold finish and armed with dual-platform overclocking support for gamers, PC builders, and performance enthusiasts who demand nothing but the best. 

Refined Flagship Design and Craftsmanship
Building on the aluminum heat spreader design of the flagship CRAS V RGB, winner of both the Red Dot and iF Design Awards, the CRAS V RGB PRIME introduces a striking new black-and-gold interpretation of the series' signature look.

An advanced hard-anodizing process, combined with a specialized surface treatment, gives the modules a smooth, piano-lacquer-like sheen that adds depth and sophistication from every angle. The result is an understated yet luxurious aesthetic that offers users a fresh, premium design choice while preserving the refined craftsmanship of the original CRAS V RGB.

High-Speed Performance with Lower Latency
The CRAS V RGB PRIME further advances KLEVV's DDR5 overclocking memory lineup with tested speeds of 6000, 6400, and 8000 MT/s and CAS latencies of CL26, CL28, and CL38, respectively.

The 6000 MT/s configuration features tested timings of 26-36-36-76, while the 6400 MT/s configuration delivers timings of 28-38-38-78. For users seeking extreme frequencies, the 8000 MT/s models operate at tested timings of 38-48-48-128. All configurations are tested at 1.4V.

The 6000 and 6400 MT/s configurations are available in dual-channel kits ranging from 32GB (16GBx2), 64GB (32GBx2), to 128GB (64GBx2), while the 8000 MT/s models are offered in both 32GB (16GBx2) and 48GB (24GBx2) kits. This diverse range gives users greater flexibility to select the ideal balance of speed, latency, and capacity for their systems.

Next-Generation AMD EXPO™ Technology: Featuring Ultra Low Latency
"AMD EXPO™ Technology: Featuring Ultra Low Latency" is the latest evolution of AMD's established memory overclocking technology. The new AMD EXPO ULL profile incorporates optimized memory sub-timing settings designed to reduce latency and improve overall performance on compatible AMD platforms. As the first product in KLEVV's overclocking memory lineup to adopt this technology, the CRAS V RGB PRIME delivers a more responsive gaming and overclocking experience.

The 6000 MT/s and 6400 MT/s 32GB (16GBx2) configurations are certified for AMD EXPO Ultra Low Latency. According to AMD, certified Ultra Low Latency memory can deliver an average 4% improvement in FPS compared with non-ULL AMD EXPO memory on compatible systems.*

Broad Intel and AMD Platform Support
Offering broad support across the latest desktop platforms, the CRAS V RGB PRIME is compatible with AMD Ryzen™ processors on the AM5 platform and Intel^® Core™ Ultra 200S Plus processors.

Each kit comes preloaded with both Intel^® Extreme Memory Profile and AMD EXPO™ Technology overclocking profiles, allowing users to unlock high-speed performance through a simple BIOS setting on compatible motherboards with supported BIOS versions. With both profiles included, users can confidently choose their preferred speed and capacity without the hassle of selecting separate Intel- or AMD-specific models.

Premium Components for Uncompromising Stability
The CRAS V RGB PRIME features rigorously screened, high-quality memory ICs from a leading Korean manufacturer, ensuring consistent high-speed performance and exceptional stability under demanding workloads.

Paired with a high-density 10-layer PCB, the modules deliver enhanced signal integrity and greater resistance to interference during high-speed operation. Integrated PMIC and on-die ECC technologies further support stable power management and long-term reliability, creating a robust foundation for gaming and overclocking performance.

To ensure broad compatibility, the CRAS V RGB PRIME has also been validated on the QVLs (Qualified Vendor Lists) of four major motherboard manufacturers. Its RGB lighting supports ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, and ASRock Polychrome Sync, allowing users to seamlessly coordinate lighting across compatible components and systems.

A Complete DDR5 Gaming/OC Memory Lineup
The introduction of the CRAS V RGB PRIME further expands KLEVV's comprehensive DDR5 Gaming/OC memory portfolio.

With the CRAS, URBANE, BOLT, and FIT series available across a wide range of designs and specifications, KLEVV continues to provide flexible memory choices for different performance requirements, system configurations, and aesthetic preferences.

Warranty and Availability
The CRAS V RGB PRIME DDR5 comes with a limited lifetime peace of mind warranty and will be available from November 2026. Please visit the KLEVV website to check product availability across online and offline retail channels. 

ABOUT KLEVV
KLEVV is a premium brand of Essencore, a major vendor of memory modules and NAND flash application products. The KLEVV range focuses on high-performance gaming memory modules and solid-state drives, engineered for enthusiasts who demand world-class quality and reliability. KLEVV memory and SSD products have been recognized with Germany's Red Dot Design Award and iF Design Award for their innovative design. For more information, please visit www.klevv.com.

ABOUT ESSENCORE
Established in 2014, Essencore Limited aims to become the world's top vendor of DRAM modules and NAND flash application products. The company started with one goal: to "Change the world and be a leader in semiconductor distribution." The business strategies of Essencore are to adopt the newest technologies to differentiate themselves from competitors, deliver dedicated Memory products, and offer various product portfolios for customers' competition readiness. For more information, please visit www.essencore.com.

*Based on AMD testing. Actual performance may vary depending on processor, motherboard, BIOS version, memory configuration, and application workload.

Overclocking and/or Undervolting AMD processors and memory, including without limitation, altering clock frequencies / multipliers or memory timing / voltage, to operate outside of AMD's published specifications will void any applicable AMD product warranty, even when enabled via AMD hardware and/or software. This may also void warranties offered by the system manufacturer or retailer. Users assume all risks and liabilities that may arise out of overclocking / undervolting AMD processors, including, without limitation, failure of or damage to hardware, reduced system performance and/or data loss, corruption or vulnerability. GD-106.

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

KLEVV UNVEILS ALL-NEW CRAS V RGB PRIME DDR5 GAMING/OC MEMORY

HLB's strategic partnership unlocks new possibilities in cross-border banking, connecting customers to established global payment networks and building a foundation to serve them across more markets

KUALA LUMPUR, Malaysia, Oct. 28, 2026 /PRNewswire/ -- Hong Leong Bank ("HLB" or the "Bank") today marked its strategic partnership with UnionPay International ("UPI"), strengthening global cross-border payment connectivity for customers travelling, conducting business and pursuing opportunities beyond Malaysia. In line with the proposition of "Connecting Borders, Commerce, Ties, and Horizons", the partnership highlights how HLB and payment networks can enable seamless and secure overseas payments and support closer connections between people and businesses across markets.

By leveraging UPI's integrated network with Weixin Pay, the collaboration enables HLB customers to transact effortlessly at over 120 million merchants across Mainland China, as well as participating merchants in Hong Kong SAR, Macao SAR, and Thailand. Whether shopping at department stores or dining at everyday local stalls, customers can pay directly via HLB QR Pay on HLB Connect. The feature natively complements HLB's existing multi-currency features on the HLB Pay&Save Account, allowing customers to lock-in favorable exchange rates and avoid the hassle of using third-party apps and wallet top-ups.

According to Kevin Lam, HLB's Group Managing Director and Chief Executive Officer, "Our customers take us beyond Malaysia through the businesses they build, the family ties they maintain, and the opportunities they pursue. We want them to have the same confidence paying overseas as they do at home."

"At its core, a cross-border payment only works when trust exists on both sides of the transaction where customers know with certainty that their payment will go through, and merchants trust that they will receive it. Backed by over a century of heritage and innovation in cross-border payments in the community, our priority is ensuring that trust holds wherever our customers go. Partnering with UPI and tapping into their vast international network, including Weixin Pay, allows us to deliver that scale and certainty globally."

Carlson Li, Vice President of UPI, commented, "Our partnership with HLB demonstrates how interoperability can connect different payment ecosystems to deliver practical benefits for customers, where HLB customers can now access a wider merchant network directly from their banking app, making cross-border payments more convenient and supporting commerce between markets. We look forward to building on this partnership to extend payment accessibility, connect more customers and merchants, and create further opportunities for collaboration across the region."

Driven by rapid digital innovation, cross-border payments have expanded well beyond conventional cards and currency exchange, giving consumers more versatile, frictionless ways to transact internationally.

Underscoring the Bank's focus on customer-centric digital solutions, Andrew Jong, HLB's Managing Director of Personal Financial Services, said, "Digital innovation has fundamentally changed how people move and spend money abroad, unlocking greater convenience and flexibility than ever before. We recognise that customers have different payment preferences and needs when travelling across markets. Our focus is on ensuring our solutions remain relevant to those dynamic needs, giving customers true choice, security, and continuity wherever they go. This partnership with UPI is a key milestone in how we leverage innovations and ecosystem partners to expand our suite of cross-border payment capabilities."

HLB's broader cross-border payment offering gives customers multiple ways to pay overseas, including scanning participating merchant QR codes, displaying an in-app QR code for merchants to scan, linking eligible HLB cards to superapps in China like Weixin Pay, making direct credit and debit card payments, and using supported mobile wallets such as Apple Pay, Samsung Pay and Google Pay.

The Bank will continue to build on its international collaborations to expand payment connectivity and support customers as their needs and ambitions grow across markets.

For more information, please visit: www.hlb.com.my/UnionPayQR   

** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **

Hong Leong Bank Strengthens Cross-Border Payment Connectivity through Partnership with UnionPay International