NEW YORK, July 25, 2025 /PRNewswire/ -- The Product Lifecycle Management (PLM) market has witnessed significant developments over the past year with the rise of Software-as-a-Service (SaaS), digital twins, and Generative AI (Gen AI) becoming integral for large discrete manufacturers. ABI Research, a global technology intelligence firm, evaluated 10 PLM vendors and accompanying software to determine which solutions are sufficiently servicing the needs of large discrete manufacturers based on levels of innovation and implementation.
Although distinct in nature, large discrete manufacturers across eight industry verticals (A&D, Automotive, Electronics, Heavy Equipment, Industrial Machinery, Medical Devices, and Other Transportation) share commonalities that are dictating the market. "Large discrete manufacturers are favoring solutions that can be deployed as SaaS, have flexible payment structures, integrated Gen AI copilots, and do not require extensive modification and customization from system integrators or third-party value-added resellers (VARs)," states James Iversen, Industry Analyst.
Siemens, PTC, and Dassault Systèmes are the leading PLM vendors with their respective solutions, Teamcenter, Windchill, and Enovia. Siemens Teamcenter is the overall leader with standout scores coming from incorporating the largest partner ecosystem for external software integration, the highest market share for large discrete manufacturers, and an industry-leading Gen AI position with Teamcenter Copilot. PTC placed second with strengths in digital thread creation, product tracking through real-time updates, and a desirable customer support model for post-sale maintenance. Dassault Systèmes rounds out the leadership category, outperforming the market average by providing robust Model-Based Systems Engineering (MBSE) capabilities, modular and role-based purchasing, along with high scores for digital thread creation with the connection to the 3DEXPERIENCE platform.
Aras and their PLM software Innovator is an Innovation leader, with capabilities rivaling and surpassing those of Siemens, PTC, and Dassault Systèmes. Aras' highest scores came from strengths in low-code API management, the integration of AI assisting chatbots, and robust Out-of-the-Box (OOTB) functionality so manufacturers are less reliant on SIs and VARs.
Large discrete manufacturers share priorities when it comes to the functionality and deployment of PLM solutions. All require fast time-to-value, flexible solution architecture, and new technology additions such as Gen AI. With the Product Lifecycle Management (PLM) for Large Discrete Manufacturers competitive assessment, vendors and end users can see how PLM software competes in the market, and where vendors can improve offerings to better facilitate the needs of large discrete manufacturers.
These findings are from ABI Research's Product Lifecycle Management (PLM) For Large Discrete Manufacturers competitive assessment. This report is part of the company's Industrial and Manufacturing research service, which includes research, data, and ABI Insights.
About ABI Research
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Siemens, PTC, and Dassault Systèmes Named Leaders in ABI Research's PLM Assessment for Large Discrete Manufacturers; Aras Gaining Momentum
HANOI, Vietnam, Jan. 17, 2026 /PRNewswire/ -- Viettel Group has officially broken ground on the construction of Vietnam's first semiconductor chip fabrication plant. The project is implemented by Viettel as a mission assigned by the Ministry of National Defense, in accordance with a Government Resolution.
For the first time, Vietnam is developing domestic chip fabrication capability, laying a foundation for the goal of gradually mastering core technologies and developing a domestic semiconductor ecosystem.
The plant will be built in the Hoa Lac Hi-Tech Park (Hanoi) on an area of 27 hectares, oriented to become national infrastructure serving research, design, testing, and semiconductor chip production.
Once operational, the plant will be able to serve national industries such as aerospace, telecommunications, IoT, automotive manufacturing, medical devices, and automation, among others.
A complete semiconductor chip product typically goes through six main stages: product definition, system design, detailed design, chip fabrication, packaging and testing, and integration and testing. In recent years, Vietnam has gradually participated in five of these stages; however, chip fabrication—the most complex and critical stage—has not yet been possible domestically. Building a semiconductor chip fabrication plant will help complete and close the entire semiconductor chip production process in Vietnam.
Speaking at the groundbreaking ceremony, Prime Minister of Vietnam Pham Minh Chinh emphasized: "The groundbreaking of Vietnam's first high-tech semiconductor chip fabrication plant is an event of particularly important significance. This is a step toward realizing the national semiconductor industry development strategy, creating a foundation for Vietnam to gradually participate more deeply in the global value chain, based on science, technology, and innovation."
According to the Prime Minister, the plant's presence will contribute to completing the domestic semiconductor ecosystem, enabling chip design companies, technology start-ups, and research institutions to shorten testing cycles, quickly finalize products, and bring technology into practical applications.
The plant is also expected to become a hands-on training center for the semiconductor workforce, linking training with a real production environment. Through this, Vietnam aims to train 50,000 chip design engineers under the Semiconductor Industry Human Resources Development Program through 2030, toward a scale of more than 100,000 people in Vietnam's semiconductor industry under the National Semiconductor Strategy through 2040.
For Viettel, being assigned to lead the implementation of the semiconductor chip fabrication plant continues the Group's core technology development strategy, which it has persistently pursued for many years. Viettel has proactively prepared human resources through in-depth training, international cooperation, and technology transfer, while also accumulating experience from research, design, and the application of chips in technology systems and products.
Lieutenant General Tao Duc Thang, Chairman and CEO of Viettel Group, affirmed: "Immediately after today's groundbreaking ceremony, the Group will begin implementing the project, with the set objective that by the end of 2027 we will complete the construction, receive technology transfer, and begin pilot production. The period from 2028 to 2030 will focus on finalizing and optimizing processes and improving line efficiency in accordance with industry standards, thereby serving as a basis for researching chip fabrication technology at more advanced process nodes."
The project will be implemented during 2026–2030, with a roadmap from plant construction and technology transfer to process completion and improved operational efficiency. In the long term, the Hoa Lac plant is planned to be expandable in scale, providing a foundation for Vietnam to gradually access more advanced semiconductor technologies.
The groundbreaking of the high-tech semiconductor chip fabrication plant marks an important milestone in Vietnam's journey to build technological capability, contributing to realizing the goal of "Technological self-reliance, Sustainable Future."
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Viettel Breaks Ground on Vietnam's First Semiconductor Chip Fabrication Plant
