SUZHOU, China, Nov. 10, 2025 /PRNewswire/ -- A news report from Xinhua Finance:
The 2025 Automotive Technology and Equipment Development Forum was held in Suzhou from November 6 to 8. Framed around the theme "Equipment as the Foundation, Technology as the Path Forward", the event was jointly organized by the Equipment Industry Development Center (EIDC) under the Ministry of Industry and Information Technology, the Suzhou Municipal People's Government, and China Automotive Engineering Research Institute Co. Ltd. (CAERI). The forum served as a venue for policy briefings, technical exchanges, showcases of applied results, and matchmaking sessions—with the aim of transitioning the auto sector toward closer integration of manufacturing equipment with intelligent technologies and building an industry ecosystem that is open, partnership-based, and aimed at shared gains.
During the forum, the EIDC released the "China Automotive Industry and Technology Development Report (2025)". The report said China's automotive industry has posted notable gains in recent years and has been a steadying factor for the broader industrial economy. From January to September this year, nationwide automobile output and sales came in at 24.333 million and 24.363 million units, respectively, up 13.3% and 12.9% year-on-year. The electric-vehicle segment stood out in particular, with production reaching 11.243 million units and sales 11.228 million units over the same period—more than 35% higher and accounting for 46.1% of all new passenger- and commercial-vehicle combined sales.
Looking ahead to the future of the automotive industry, several industry experts at the forum offered systematic recommendations. Su Bo, Director of the National Expert Committee on Intelligent Manufacturing and former Vice Minister of the Ministry of Industry and Information Technology, said China needs to channel resources toward clearing core technology chokepoints, notably automotive-grade chips, high-safety solid-state batteries, and in-vehicle operating systems. He added that China should make fuller use of national-level science and technology platforms, including the National Innovation Center of Intelligent and Connected Vehicles, to make sure it keeps control over the pace and direction of technology upgrades.
The forum also saw the launch of a series of initiatives aimed at strengthening the global competitiveness of China's auto industry. These include the "Standards Lead the Way, Quality Drives the Future" campaign, which seeks to lift the international profile of Chinese auto brands through tighter and more export-ready quality benchmarks; the "China Chip" Joint Research Lab, set up to reinforce China's semiconductor capabilities for intelligent and connected electric vehicles; the "Upgrading Automotive Manufacturing with Domestic High-End Equipment" program, designed to raise quality and efficiency through the use of domestically produced advanced machinery; and the "15th Five-Year Plan Synergy for Automotive Technology and Equipment" initiative, which is intended to keep future advances in vehicle technology and supporting industrial equipment on the same track. Taken together, these measures are expected to add momentum to priority areas such as quality, chips, and high-end equipment—key drivers shaping the industry's future.
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Building on Equipment, Leading with Technology: Industry Leaders Explore New Pathways for High-Quality Automotive Development
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SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.
Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.
As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.
Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.
AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.
TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.
Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.
Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.
Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.
TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.
High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.
TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.
Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.
SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.
Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.
As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.
Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.
AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.
TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.
Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.
Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.
Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.
TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.
High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.
TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.
Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.
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TWSC Showcases at CFMS 2026, Expanding Application Boundaries with Full-Stack AI+ Storage Solutions
TWSC Showcases at CFMS 2026, Expanding Application Boundaries with Full-Stack AI+ Storage Solutions
