The 27th China Hi-Tech Fair concluded in Shenzhen, south China's Guangdong Province, on Sunday, with the signing of intended trade deals worth 170 billion yuan (about 24 billion U.S. dollars).
The three-day event brought together over 1,000 procurement delegations from more than 120 countries and regions across the world, resulting in the signing of 1,023 supply-demand and investment-financing projects on-site.
The fair, recognized as a key platform for high-tech developments in China, was supported by the local government and showcased over 5,000 new technologies, products, and achievements.
This year's event, which run from Nov 14 to 16 at the Shenzhen World Exhibition and Convention Center, covered 400,000 square meters and featured more than 5,000 enterprises and international organizations, according to the fair's organizing committee.
The fair highlighted international technological advancements, China's high-level innovation, and Shenzhen's "20+8" industrial clusters, with 22 major exhibition areas, including artificial intelligence, robotics, semiconductors, consumer electronics, and commercial aerospace.
It aimed to drive China's technological innovation and accelerate the adoption of global advancements, according to the fair's organizing committee.
27th China Hi-Tech Fair concludes with signing of trade deals worth 170 bln yuan
