SINGAPORE, Nov. 17, 2025 /PRNewswire/ -- At the Singapore FinTech Festival 2025 (SFF 2025), Jason Cao, CEO of Huawei Digital Finance BU, delivered a keynote titled Beyond Digital: Towards AI-Infused Finance. He highlighted Huawei's innovations in scenario-based agents, AI platforms, data and knowledge platforms, and infrastructure that address the core challenges of AI adoption in finance. Leveraging systematic engineering capabilities, Huawei aims to help financial institutions accelerate their intelligent transformation.
Cao noted, "The intelligent era will be characterized by hyper-personalization. AI in finance has reached a critical stage, and the key lies in its deep integration into core production processes and business scenarios, where it can deliver real business value. To gain a competitive edge in the next decade, financial institutions should harness AI to drive structural transformation across their workflows."
Over the past decade, financial digitalization removed barriers of time and distance but still followed the 80/20 rule—80% of resources serving 20% of core users. In the decade ahead, AI will popularize the "one person, one team" model, empowering each individual with the capabilities of a full team through super AI assistants as the primary service portal. "Future financial services will evolve from recommending products directly to individuals to channeling them to personal super assistants. Those who lead this shift and deliver hyper-personalized services will get a head start." Cao emphasized. He added that AI-driven structural transformation will extend across all aspects including financial service models, collaboration models, risk decisioning, and infrastructure.
Building a Four-Layer Systematic Solution to Achieve All-Scenario Intelligence
Cao outlined two paths global financial institutions are taking to advance AI-native applications: Large institutions build a matrix of agents, providing an AI assistant for each role and a trusted AI advisor for each customer; small and medium-sized institutions focus on high-value scenarios such as credit, deploying agents rapidly to achieve intelligent processes. To date, Huawei has already helped global financial customers deploy more than 500 AI use cases, spanning office, operations, marketing, risk management, and customer service. This helps customers enhance their internal efficiency, deliver greater value to end users, and mark the shift from single scenarios to systematic, comprehensive solutions.
Huawei has placed its intelligent computing platform at the core of a systematic solution covering computing power, platforms, engineering, and scenarios. To meet the demands of high concurrency and low latency in AI inference, Huawei has developed a leading computing power platform. This foundation supports enterprise-wide AI data governance through a unified knowledge and data platform, integrated with financial agent platforms and practices in data and model engineering—together forming a closed loop of end-to-end (E2E) AI capabilities. By collaborating with global ecosystem partners, Huawei is unlocking full-stack technological momentum to accelerate the deployment of AI in high-value scenarios.
In the intelligent mobile banking scenario, Huawei and a major Chinese bank have jointly innovated a next-generation intelligent mobile service architecture. Built on intelligent computing infrastructure and AI platforms, the architecture leverages hierarchical multi-agent collaboration, long-term memory storage, and E2E performance optimization across hardware and software. This has achieved intent recognition accuracy above 90% and latency as low as 1.2 seconds, helping the bank transform from passive response to proactive service.
Looking ahead, Huawei will continue to build on its leading computing power platform, systematic AI engineering expertise, structured ecosystem development, and new co-creation models with customers and partners. These initiatives will strengthen customer engagement, enhance risk management, and drive E2E business transformation, further embedding value-driven AI applications in the financial industry and helping financial institutions accelerate the effective adoption of AI.
Collaborating with More RongHai Partners to Establish a New Financial AI Ecosystem
During this event, Huawei, together with three RonghHai partners—Neuxnet, Speakly AI, and TrustDecision, respectively signed strategic cooperation agreements with Saudi Arabia's leading financial institution Atmaal. The partner network of Huawei's Ronghai program also continued to expand, with three new members onboarding: CMA, which provides stable payment services for central banks worldwide; Instadesk, which offers intelligent outbound calling and marketing capabilities; and MagicEngine, which delivers model development, inference, and services for financial institutions. An increasing number of valued financial solution partners are accelerating global collaboration with Huawei.
Through the Ronghai program, Huawei aims to co-create with global partners a "six-capability cluster" to systematically build an AI ecosystem along the financial production flow. This includes model development, agent engineering, industry knowledge bases, and scenario-based applications, while optimizing AI deployment efficiency through E2E hardware-software synergy.
As the financial industry moves from digitalization to digital and intelligent transformation, Huawei will continue to strengthen collaborative innovation with customers and partners, focusing on reshaping financial workflows and advancing ecosystem development. These efforts will enable AI to move beyond technology enablement toward significant improvement in productivity, opening a new chapter in intelligent finance.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Huawei Digital Finance Brings Partners for a Notable Appearance at SFF 2025, Driving Intelligent Transformation in Global Finance
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SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.
Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.
As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.
Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.
AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.
TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.
Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.
Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.
Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.
TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.
High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.
TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.
Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.
SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.
Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.
As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.
Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.
AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.
TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.
Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.
Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.
Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.
TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.
High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.
TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.
Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.
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TWSC Showcases at CFMS 2026, Expanding Application Boundaries with Full-Stack AI+ Storage Solutions
TWSC Showcases at CFMS 2026, Expanding Application Boundaries with Full-Stack AI+ Storage Solutions
