ST. LOUIS, Nov. 17, 2025 /PRNewswire/ -- MiTAC Computing Technology, a global leader in high-performance and energy-efficient server solutions, is proud to announce its participation at the Supercomputing (SC) 2025 (November 18–20, St. Louis, Missouri), booth 3916. Under the theme "AI Cluster Power – Cool Fast Scale Faster" MiTAC will showcase its modular highly scalable rack infrastructure for demanding AI and HPC workloads demonstrating capabilities from single servers to cluster integration focusing on liquid cooling and energy-efficient designs. MiTAC collaborates with AMD, Broadcom, CoolIT, Intel, KIOXIA, Micron, NVIDIA, Samsung and Solidigm to accelerate advanced computing and high-efficiency data centers.
Rack-scale Innovation From Standard Architecture to AI Cluster Excellence
At SC 2025 MiTAC Computing presents its full range of rack-level solutions for cluster-scale deployments including liquid-cooled and air-cooled AI and HPC racks addressing both open architectures and traditional enterprise data centers.
AI Liquid-Cooled Rack with AMD Instinct™ MI355X GPUs | Optimized for Ultra-Scale AI
The high-density 48U EIA AI liquid-cooled rack MR1100 series targets hyperscale AI training and inference. This robust solution supports 64 to 256 AI GPUs. Utilizing cold-plate technology with the latest AMD Instinct™ MI355X GPUs, AMD EPYC™ 9005 CPUs, and AMD Pensando™ Pollara 400 AI NICs, it ensures non-throttled AI throughput with 400/800 Gb/s network architecture.
AI Air-Cooled Rack with AMD Instinct™ MI350X GPUs | Standardized Architecture with High-Speed Interconnect
MiTAC presents its standard EIA 45U air-cooled AI rack, MR1100A, with four MiTAC G8825Z5 systems using AMD Instinct™ MI350X/MI325X GPUs. The 800Gb/s network switch Broadcom Tomahawk 5 chipset ensures low-latency data transmission GC68C-B8056 management and TS70A-B8056 storage servers enable rapid deployment of scalable AI/HPC clusters.
OCP ORv3 Liquid-Cooled Rack | Modular Power and Advanced Thermal Management
MiTAC's 43OU OCP ORv3 liquid-cooled rack, MR is designed for sustainable HPC, accommodating up to 14 C2811Z5 multi-node servers powered by AMD EPYC™ 9005 Series processors. It integrates MiTAC Lake Erie storage, a 33kW Power Shelf, and the CoolIT 200kW CHx200+ In-Rack CDU. This modular design ensures stable, energy-efficient operation for high-density compute servers.
AI Acceleration Platforms
HPC & Cloud Computing Frameworks
- G4520G6: This highly adaptable server, powered by the latest Intel® Xeon® 6 CPUs, delivers superior performance per watt for cloud and HPC roles, leveraging Micron DDR5 DRAM. It also features extensive expansion options, including support for NVIDIA RTX PROTM 6000 Blackwell Server Edition and NVIDIA Hopper GPUs.
- C2811Z5: An OCP-compliant liquid-cooled multi-node server, it uses AMD EPYC™ 9005 series processors. Optimized with NVMe E1.S interfaces and Micron 9550 NVMe SSDs, it guarantees sustained high-speed data delivery for intensive HPC.
Enterprise Data Solutions
- M2810Z5: Optimized for peak storage performance by deploying Kioxia XD8 E1.S Gen5 SSDs, this server unlocks maximum bandwidth for IO-intensive database applications.
- R2520G6: A high-capacity 2U server with dual Intel® Xeon® 6700P series processors integrates Solidigm D7-PS1010 SSDs. PCIe 5.0 bandwidth guarantees stability for data warehousing and analytics.
- M2510G6: This high-reliability platform supports Samsung MZTL67T6HBLC-00AW7 SSDs for mission-critical enterprise settings and demanding data processing.
- R2513G6: This platform provides maximum archival capacity using Seagate EXOS M 30TB HDDs, tailored for organizations with immense data retention needs.
Global Success Stories Demonstrating MiTAC's Value in AI & HPC Deployments Worldwide
At SC 2025, MiTAC showcases real-world success cases highlighting its proven expertise in delivering comprehensive rack-level solutions and its commitment to cluster-scale integration.
- MiTAC and French CSP pioneer sustainable HPC achieving world-class PUE and operational cost reduction: Partnered with Qarnot using the Capri 3 OCP server to capture 95% of server heat for reuse, achieving a PUE of 1.01 and reducing operational costs by 50% for clients in Europe. The exhibit also highlights the integration of the Broadcom N1400GD network adapter.
- OCP deployment accelerated in the US data centers featuring ORv3 platform and resource efficiency: MiTAC partnered with CTCA, a global IT solutions provider, to accelerate OCP deployment across the US data centers. This success leveraged the ORv3-compliant OCP server and advanced rack integration. The SC showcase highlights the OCP server featuring Samsung M321R8GA0EB2-CCP Memory, emphasizing faster rollouts and resource efficiency.
- Rack integration streamlines global operations for leading cloud security provider: MiTAC provided customized, ready-to-deploy rack integration services, utilizing the GC68C-B8056 server. This service streamlined operations by delivering over 380 configurations across 150 data centers worldwide, meeting 48-hour turnaround times, and enabling a GPU-first infrastructure shift within half a year, demonstrating the consistency, agility, and innovation MiTAC provides.
- MiTAC and its software-defined storage partner maximize GPU performance by eliminating AI training bottlenecks: Collaborating with a leading software-defined storage (SDS) partner, MiTAC leveraged the GC68A-B8056 server to remove critical I/O constraints. The pre-validated architecture boosted GPU utilization by 35% and delivered over 200 GB/s throughput, effectively tripling the speed of AI training completion.
For more SC information and product catalogs please visit:
About MiTAC Computing Technology Corporation
MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings, delivers comprehensive, energy-efficient server solutions backed by industry expertise dating back to the 1990s. Specializing in AI, HPC, cloud, and edge computing, MiTAC Computing employs rigorous methodologies to ensure uncompromising quality—across barebones, systems, racks, and cluster levels—fully achieving performance and integration. This commitment to quality at every level sets MiTAC Computing apart in the industry.
With a worldwide presence and end-to-end capabilities—from R&D and manufacturing to global support—MiTAC Computing provides agile, customized platforms for hyperscale data centers, HPC, and AI applications, ensuring optimal performance and scalability to meet unique business needs. By leveraging the latest advancements in AI and liquid cooling, and unifying the MiTAC brand with Intel DSG and TYAN server products, MiTAC Computing stands out for its innovative, efficient, and reliable server technology as well as its hardware and software integrated solutions—empowering businesses to meet future challenges.
MiTAC Computing Technology Corporation website: https://www.mitaccomputing.com/
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
MiTAC Computing Unveils Advanced AI Cluster and Cooling Solutions at Supercomputing 2025
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SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.
Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.
As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.
Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.
AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.
TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.
Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.
Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.
Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.
TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.
High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.
TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.
Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.
SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.
Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.
As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.
Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.
AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.
TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.
Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.
Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.
Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.
TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.
High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.
TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.
Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.
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TWSC Showcases at CFMS 2026, Expanding Application Boundaries with Full-Stack AI+ Storage Solutions
TWSC Showcases at CFMS 2026, Expanding Application Boundaries with Full-Stack AI+ Storage Solutions
