Tender for re-opening of 10-year HKD HKSAR Institutional Government Bonds to be held on January 14
The following is issued on behalf of the Hong Kong Monetary Authority:
The Hong Kong Monetary Authority (HKMA), as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced today (January 8) that a tender of 10-year HKD institutional Government Bonds (Bonds) through the re-opening of existing 10-year Government Bond issue 10GB3507001 under the Infrastructure Bond Programme will be held on Wednesday, January 14, 2026, for settlement on Thursday, January 15, 2026.
An additional amount of HK$1.0 billion of the outstanding 10-year Bonds (issue no. 10GB3507001) will be on offer. The Bonds will mature on July 24, 2035 and will carry interest at the rate of 3.17 per cent per annum payable semi-annually in arrear. The Indicative Pricings of the Bonds on January 8, 2026 are 100.60 with an annualised yield of 3.121 per cent.
Tender is open only to Primary Dealers appointed under the Infrastructure Bond Programme. Anyone wishing to apply for the Bonds on offer can do so through any of the Primary Dealers on the latest published list, which can be obtained from the Hong Kong Government Bonds website at www.hkgb.gov.hk. Each tender must be for an amount of HK$50,000 or integral multiples thereof.
Tender results will be published on the HKMA's website, the Hong Kong Government Bonds website, Bloomberg (GBHK <GO>) and Refinitiv (IBPGSBPINDEX). The publication time is expected to be no later than 3pm on the tender day.
HKSAR Institutional Government Bonds Tender Information
Tender information of 10-year HKD HKSAR Institutional Government Bonds:
Issue Number:
10GB3507001
Stock Code:
4294 (HKGB 3.17 3507)
Tender Date and Time:
Wednesday, January 14, 2026
9.30am to 10.30am
Issue and Settlement Date:
Thursday, January 15, 2026
Amount on Offer:
HK$1.0 billion
Maturity:
10 years
Remaining maturity:
Approximately 9.53 years
Maturity Date:
Tuesday, July 24, 2035
Interest Rate:
3.17 per cent p.a. payable semi-annually in arrear
Interest Payment Dates:
January 24 and July 24 in each year, commencing on the Issue Date up to and including the Maturity Date, subject to adjustment in accordance with the terms of the Institutional Issuances Information Memorandum of the Infrastructure Bond Programme and Government Sustainable Bond Programme (Information Memorandum) published on the Hong Kong Government Bonds website.
Method of Tender:
Competitive tender
Tender Amount:
Each competitive tender must be for an amount of HK$50,000 or integral multiples thereof. Any tender applications for the Bonds must be submitted through a Primary Dealer on the latest published list.
The accrued interest to be paid by successful bidders on the issue date (January 15, 2026) for the tender amount is HK$759.93 per minimum denomination of HK$50,000.
(The accrued interest to be paid for tender amount exceeding HK$50,000 may not be exactly equal to the figures calculated from the accrued interest per minimum denomination of HK$50,000 due to rounding).
Other Details:
Please see the Information Memorandum available on the Hong Kong Government Bonds website or approach Primary Dealers.
Expected commencement date of dealing on the Stock Exchange of Hong Kong Limited:
The tender amount is fully fungible with the existing 10GB3507001 (Stock code: 4294) listed on the Stock Exchange of Hong Kong.
Use of Proceeds:
The Bonds will be issued under the institutional part of the Infrastructure Bond Programme. Proceeds will be invested in infrastructure projects in accordance with the Infrastructure Bond Framework published on the Hong Kong Government Bonds website.
HKMA, Photo source: reference image
