Skip to Content Facebook Feature Image

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Business

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors
Business

Business

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

2026-04-28 02:02 Last Updated At:02:20

KYOTO, Japan--(BUSINESS WIRE)--Apr 27, 2026--

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs (1) and switch ASICs, which are rapidly scaling in complexity as AI data center architectures evolve. The new product will be unveiled at ECTC 2026, an international conference on semiconductor packaging technologies, in Orlando, Florida, USA, May 26-29, 2026.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260427129166/en/

Built from Kyocera’s proprietary Fine Ceramic materials, the new core substrate is engineered for high‑density wiring and exceptional rigidity. According to the company, these characteristics dramatically reduce deformation (warpage) in high-performance semiconductor packages, a key challenge as demand for greater device integration and higher processing speed continues to rise.

(1): xPU is a general term for various processing units (PUs) such as CPUs and GPUs that handle AI processing.

Key Features

Development Background

The growth of generative AI and large language models is fueling a global proliferation of AI data centers and creating demand for higher-performance xPU and ASIC semiconductors that require larger, denser package substrates, especially for 2.5D packaging (2). Core substrates made of organic materials create a bottleneck to higher performance, especially at larger dimensions, due to warpage and wiring-miniaturization challenges. Kyocera is addressing these limitations with a new multilayer ceramic core substrate, leveraging its expertise in laminated ceramic materials to offer higher rigidity and finer wiring in advanced semiconductor packaging.

(2) 2.5D packaging refers to a structure in which multiple IC chips are placed side-by-side on a high-density interposer (relay substrate) using fine circuit patterning and vertical interlayer wiring to enhance processing speed.

Features

1. Highly rigid multilayer ceramic core substrate minimizes warpage, a key challenge affecting large package substrates

Kyocera’s multilayer ceramic core substrate provides greater rigidity and resistance to deformation (bending) than core substrates made of organic materials, minimizing warpage during each mounting phase. As a result, Kyocera’s multilayer ceramic technology can enable higher device performance using slimmer substrates (3) while facilitating further miniaturization.

(3): Based on Kyocera’s simulation results (February 2026).

2. Multilayer ceramic structure enables finer wiring

In multilayer ceramic substrates, conductive paths between layers of ceramic are called vias. Formed while the ceramic is pliable (before firing or sintering), these vias enable finer wiring through superior micro-fabrication as compared to the drilling processes used to create vias in conventional organic core substrates. The smaller via diameters and tighter via pitches made possible in ceramic substrates address the challenges associated with high-density wiring in traditional organic-core substrates.

3. Supports custom design requirements, and performance simulations in the design phase

During the design phase, Kyocera provides thermal, electrical, and substrate-warpage simulations based on device performance objectives and specified mounting processes. This simulation data ensures greater customer development efficiency and the achievement of design objectives in the finished device.

Kyocera remains committed to developing new packaging materials and technologies that meet evolving customer needs in the semiconductor industry.

About KYOCERA

Kyocera Corporation (TOKYO:6971, https://global.kyocera.com/ ), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of Fine Ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of ceramic components for a wide range of industries, as well as automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2025, the company’s consolidated sales revenue totaled 2.0 trillion yen (approx. US$13.2 billion). Kyocera appears on Forbes magazine’s 2025 “Global 2000” list of the world’s largest publicly traded companies, and has been named among “The World’s 100 Most Sustainably Managed Companies” by The Wall Street Journal. In January 2026, Kyocera was named to Clarivate’s list of the “Top 100” Global Innovators for the fifth consecutive year.

© 2026 Kyocera Corporation

2.5D integration warpage comparison and simulation model

2.5D integration warpage comparison and simulation model

Multilayer ceramic core substrate for advanced semiconductor packaging

Multilayer ceramic core substrate for advanced semiconductor packaging

MELBOURNE, Australia (AP) — A woman was critically injured off a popular Sydney beach on Saturday in the latest in a spate of shark attacks in Australia.

The woman, believed to be in her 30s, suffered serious leg and arm injuries in the attack at 11:15 a.m. off Coogee Beach, a police statement said.

Three spearfishing divers have been killed by sharks off the Australian coast since May 16, bringing the total of fatalities in the nation this year to four.

Australia has averaged between two and three fatal shark attacks a year since 2000, according to the Australian Shark Incident Database, a partnership of the Taronga Conservation Society Australia, Flinders University and the New South Wales state government.

On Saturday, police said the victim was attacked while swimming. Bystanders pulled her from the water and commenced first aid on the beach before paramedics arrived, the statement said.

The victim was taken to a rugby field near the beach from where she was flown by helicopter to a hospital. Police described her condition as critical.

Last Saturday, a 4.5-meter (15-foot) white shark killed Daniel Turpin, 35, as he was spearfishing with family off Michaelmas Island near the port city of Albany in Western Australia state.

On May 24, 39-year-old spearfishing diver Michael Jensz suffered fatal head injuries in an attack on the Great Barrier Reef off Australia’s northeast coast. Bull sharks had been seen in the vicinity.

A week earlier, on May 16, a four-meter (13-foot) white shark fatally mauled 38-year-old spearfishing diver Steve Mattabonni off the coast of Perth, Western Australia.

Australia’s other fatal shark attack this year occurred in January, when a 12-year-old boy died in a hospital days after he was mauled by a bull shark in Sydney Harbor.

Last year, Australia recorded five fatal shark attacks. Attacks in Australia have become more common over the decades as the population has grown and activities such as surfing and scuba diving have gained in popularity.

FILE - A sign is seen at the site of a fatal shark attack at Dee Why Beach in Sydney, Australia, on Sept. 6, 2025. (AP Photo/Mark Baker, File)

FILE - A sign is seen at the site of a fatal shark attack at Dee Why Beach in Sydney, Australia, on Sept. 6, 2025. (AP Photo/Mark Baker, File)

People sit on stairs at Coogee beach following a shark attack in Sydney, Saturday, June 13, 2026. (Nadir Kinani/AAP Image via AP)

People sit on stairs at Coogee beach following a shark attack in Sydney, Saturday, June 13, 2026. (Nadir Kinani/AAP Image via AP)

Recommended Articles