NEW YORK, April 28, 2026 /PRNewswire/ -- At a recent pan-European launch event at Motorworld Munich, NAVEE's UT5 Max e-scooter secured dual certifications—High Reliability and High Shock Absorption—from TÜV Rheinland. By setting a new benchmark for smart outdoor mobility, NAVEE further underscores its technological prowess in the global smart manufacturing landscape.
As a TÜV Rheinland-certified e-scooter, the NAVEE UT5 Max has earned both High Reliability and High Shock Absorption certifications, demonstrating it has passed rigorous tests covering braking, acceleration, and performance on uneven terrain. By benchmarking its core capabilities against the highest international standards, the product effectively bridges the gap between "on-paper specifications" and "real-world performance", giving users complete confidence in its true reliability.
The superior performance of the NAVEE UT5 Max is anchored by a trio of proprietary technologies. The NavUltrange long-range technology system optimizes the trifecta of energy supply, utilization, and riding resistance. By doing so, it delivers a real-world range over 20% greater than competitors with identical battery capacities, without compromising power or safety. In addition, NavMaxEffex, a tri-system coordination technology integrating the battery, motor, and electronic control system, improves transmission efficiency and reduces energy loss, ensuring that each unit of energy translates into more effective driving range. Completing this ecosystem, NavRollery high-efficiency tires further reduce rolling resistance while ensuring safety and durability, boosting the total range by an additional 10%. Together, these technologies deliver longer range, improved energy efficiency, and a more reliable riding experience.
Built on this integrated architecture, the NAVEE UT5 Max is positioned as a smart flagship, gaining strong market traction since launch. In terms of performance, the UT5 Max delivers dynamic acceleration and exceptional gradeability, powered by a high-performance motor with a 2400W peak output, and a maximum climbing capacity of 39%. The riding experience is equally refined: featuring an advanced high-speed stability control system, adjustable dual hydraulic suspension, and 12-inch self-healing tubeless tires, the scooter maintains precise handling and a comfortable ride across uneven terrain and at higher speeds, while balancing safety, performance, and craftsmanship.
As green mobility advances across Europe, demand for safety, reliability, and comfort continues to rise. The UT5 Max's dual TÜV Rheinland certifications underscore NAVEE's technical strength, offering a more trusted mobility choice worldwide. Moving forward, NAVEE will continue to drive innovation in smart outdoor mobility, working with leading institutions such as TÜV Rheinland to deliver high-performance e-scooters for safer, more efficient, and comfortable mobility.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
NAVEE Products Awarded Dual TÜV Rheinland Certifications for Superior Global Performance
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- Arm AGI CPU-based platforms increase performance-per-watt for modern workloads
- High-density liquid-cooled systems accelerate HPC and AI workloads
- Flexible infrastructure supports agentic AI across cloud and enterprise environments
SAN JOSE, Calif., April 28, 2026 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, 5G/Edge Total Solution provider, today expanded its Data Center Building Block Solutions (DCBBS) portfolio with new Arm®-based server platforms powered by the new Arm AGI CPU, and new Open Compute Project (OCP) ORv3-compliant rack offerings. Supermicro leads the industry with over 20 OCP Inspired™ systems, which incorporate various OCP technologies and form factors, to simplify open data center deployments.
"Supermicro continues to advance its DCBBS with an expanded portfolio of Arm-based platforms and OCP systems for next-gen AI and HPC," said Charles Liang, president and CEO of Supermicro. "With high-density, liquid-cooled systems and energy-efficient Arm architectures, we enable scalable, flexible data centers that maximize performance-per-watt and accelerate AI adoption across cloud and enterprise environments."
DCBBS delivers complete, modular AI infrastructure. Built from validated components and sub-systems, DCBBS provides end-to-end deployment flexibility – from individual GPUs and networking switches to complete racks, site infrastructure, management software, and professional services.
"The rapid growth of AI is reshaping infrastructure requirements across the data center," said Mohamed Awad, Executive Vice President, Cloud AI Business Unit, Arm. "Arm AGI CPU-based platforms, built on Arm Neoverse technology, provide the foundation for this new generation of compute, and our collaboration with Supermicro brings these capabilities to market in flexible, high-density systems optimized for modern AI and cloud environments."
"By integrating energy-efficient Arm Neoverse platforms into Supermicro's ORv3 portfolio, the OCP Community is extending the open supply chain for AI infrastructure. This collaboration delivers the modular, liquid-cooled building blocks required to scale high-performance, energy-efficient data centers across the entire ecosystem," said Steve Helvie, Chief Emerging Ecosystem Officer, OCP Foundation.
Supermicro's expanded OCP ORv3 portfolio includes new rack configurations and purpose-built servers designed for seamless integration and high-performance workloads. A new 2U GPU system, compatible with 21-inch OCP ORv3 racks, features dual Intel® Xeon® 6 6700 series processors with P-cores, a 1400A busbar inspired by OCP with power shelves, and DC-SCM support. The system integrates the NVIDIA HGX™ B300 8-GPU platform with 5th Generation NVLink®, delivering the compute density and bandwidth required for large-scale AI deployments. Learn more here.
Also available for ORv3 environments is Supermicro's FlexTwin™ system, which is a high-density, dual-node platform that integrates two independent servers in a 1-OU chassis. Designed for HPC and AI workloads, the system supports the latest Intel processors and future Intel and AMD CPUs. The FlexTwin leverages Supermicro's DLC-2 liquid cooling solution for CPUs, memory, and VRMs—removing up to 90%* of system generated heat. Learn more here.
In addition, Supermicro is making available two new Arm-based systems powered by the recently announced Arm AGI CPU in 2U and 5U form factors, delivering high core density, expanded memory capacity, and flexible I/O for energy-efficient, scalable agentic AI infrastructure.
Systems Overview:
- Compact 2U Server
- Arm AGI CPU with 64, 128, or 136 Arm Neoverse® V3 cores
- 24 DIMM slots, for up to 6TB of DDR5 memory
- 8 front hot-swap 2.5" NVMe drive bays
- Details here
- Expanded 5U server
- Arm AGI CPU with 64, 128, or 136 Arm Neoverse V3 cores
- 24 DIMM slots, for up to 6TB of DDR5 memory
- 8 front hot-swap 2.5" NVMe drive bays
- Additional PCIe lanes for increasing the number of GPUs, in an I/O rich configuration
- Details here
Supermicro promotes staff volunteering at the Open Compute Project Foundation, where the company holds a seat on the OCP Advisory Board. Learn more about how Supermicro supports OCP activities and initiatives here.
*Based on Supermicro estimates
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first-to-market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next-generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).
Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
All other brands, names, and trademarks are the property of their respective owners.
- Arm AGI CPU-based platforms increase performance-per-watt for modern workloads
- High-density liquid-cooled systems accelerate HPC and AI workloads
- Flexible infrastructure supports agentic AI across cloud and enterprise environments
SAN JOSE, Calif., April 28, 2026 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, 5G/Edge Total Solution provider, today expanded its Data Center Building Block Solutions (DCBBS) portfolio with new Arm®-based server platforms powered by the new Arm AGI CPU, and new Open Compute Project (OCP) ORv3-compliant rack offerings. Supermicro leads the industry with over 20 OCP Inspired™ systems, which incorporate various OCP technologies and form factors, to simplify open data center deployments.
"Supermicro continues to advance its DCBBS with an expanded portfolio of Arm-based platforms and OCP systems for next-gen AI and HPC," said Charles Liang, president and CEO of Supermicro. "With high-density, liquid-cooled systems and energy-efficient Arm architectures, we enable scalable, flexible data centers that maximize performance-per-watt and accelerate AI adoption across cloud and enterprise environments."
DCBBS delivers complete, modular AI infrastructure. Built from validated components and sub-systems, DCBBS provides end-to-end deployment flexibility – from individual GPUs and networking switches to complete racks, site infrastructure, management software, and professional services.
"The rapid growth of AI is reshaping infrastructure requirements across the data center," said Mohamed Awad, Executive Vice President, Cloud AI Business Unit, Arm. "Arm AGI CPU-based platforms, built on Arm Neoverse technology, provide the foundation for this new generation of compute, and our collaboration with Supermicro brings these capabilities to market in flexible, high-density systems optimized for modern AI and cloud environments."
"By integrating energy-efficient Arm Neoverse platforms into Supermicro's ORv3 portfolio, the OCP Community is extending the open supply chain for AI infrastructure. This collaboration delivers the modular, liquid-cooled building blocks required to scale high-performance, energy-efficient data centers across the entire ecosystem," said Steve Helvie, Chief Emerging Ecosystem Officer, OCP Foundation.
Supermicro's expanded OCP ORv3 portfolio includes new rack configurations and purpose-built servers designed for seamless integration and high-performance workloads. A new 2U GPU system, compatible with 21-inch OCP ORv3 racks, features dual Intel® Xeon® 6 6700 series processors with P-cores, a 1400A busbar inspired by OCP with power shelves, and DC-SCM support. The system integrates the NVIDIA HGX™ B300 8-GPU platform with 5th Generation NVLink®, delivering the compute density and bandwidth required for large-scale AI deployments. Learn more here.
Also available for ORv3 environments is Supermicro's FlexTwin™ system, which is a high-density, dual-node platform that integrates two independent servers in a 1-OU chassis. Designed for HPC and AI workloads, the system supports the latest Intel processors and future Intel and AMD CPUs. The FlexTwin leverages Supermicro's DLC-2 liquid cooling solution for CPUs, memory, and VRMs—removing up to 90%* of system generated heat. Learn more here.
In addition, Supermicro is making available two new Arm-based systems powered by the recently announced Arm AGI CPU in 2U and 5U form factors, delivering high core density, expanded memory capacity, and flexible I/O for energy-efficient, scalable agentic AI infrastructure.
Systems Overview:
- Compact 2U Server
- Arm AGI CPU with 64, 128, or 136 Arm Neoverse® V3 cores
- 24 DIMM slots, for up to 6TB of DDR5 memory
- 8 front hot-swap 2.5" NVMe drive bays
- Details here
- Expanded 5U server
- Arm AGI CPU with 64, 128, or 136 Arm Neoverse V3 cores
- 24 DIMM slots, for up to 6TB of DDR5 memory
- 8 front hot-swap 2.5" NVMe drive bays
- Additional PCIe lanes for increasing the number of GPUs, in an I/O rich configuration
- Details here
- Arm AGI CPU with 64, 128, or 136 Arm Neoverse V3 cores
- 24 DIMM slots, for up to 6TB of DDR5 memory
- 8 front hot-swap 2.5" NVMe drive bays
- Additional PCIe lanes for increasing the number of GPUs, in an I/O rich configuration
- Details here
Supermicro promotes staff volunteering at the Open Compute Project Foundation, where the company holds a seat on the OCP Advisory Board. Learn more about how Supermicro supports OCP activities and initiatives here.
*Based on Supermicro estimates
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first-to-market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next-generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).
Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
All other brands, names, and trademarks are the property of their respective owners.
** This press release is distributed by PR Newswire through automated distribution system, for which the client assumes full responsibility. **
Supermicro Expands Data Center Building Block Solutions® Flexibility with Arm-Based Platforms and OCP Systems for Next-Gen AI Infrastructure
