NORTH READING, Mass.--(BUSINESS WIRE)--Nov 9, 2026--
Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today introduced Omnyx Edge, an inline board test platform for physical and edge AI. Omnyx Edge extends the Omnyx family from the data center to the edge, testing the boards that let physical and edge AI devices perceive, decide, and act.
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AI is expanding beyond the data center into the physical world. Robots carry onboard AI compute alongside dense sensing and dozens of joint and actuator drives. Factories and logistics sites are deploying AI at the point of use, and vehicles are consolidating control units into central compute and zonal controllers. Each of these boards is denser, more valuable, more power-hungry, and often more safety-critical than the board it replaces, which raises the value of catching defects inline, before the board is built into a vehicle or robot.
Omnyx Edge tests all three board-level layers of a physical AI system:
“The next wave of AI runs on edge devices that must perceive, decide, and act in real time, and every board inside them carries more compute, more power, and more responsibility than ever before,” said Regan Mills, president of the Product Test group at Teradyne. “Omnyx established our AI board test capability in the data center. Omnyx Edge brings that capability to the edge, so manufacturers catch defects before the board is built into the product as robotics and industrial edge AI programs scale.”
Key Features and Benefits
With Omnyx and Omnyx Edge, Teradyne now tests the boards behind AI wherever it runs, from the data center to the edge devices bringing AI into the physical world. Omnyx Edge will be on display at electronica 2026, Hall A4, Booth 431, November 10-13, 2026, in Munich, Germany, with live demonstrations of PowerSense, boundary scan integration, and line automation. Learn more at https://www.teradyne.com/products/omnyx-edge/.
About Teradyne
Teradyne (NASDAQ: TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its semiconductor and electronics test solutions span the full AI device supply chain, from wafer to data center, enabling customers to meet the quality and reliability standards the AI era demands. Its advanced robotics business deploys intelligent automation across manufacturing, logistics, and data center operations for customers worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.
Teradyne Omnyx Edge brings inline board test to the compute, sensing, and motion boards behind physical and edge AI.
CAMARILLO, Calif.--(BUSINESS WIRE)--Nov 9, 2026--
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, today launched the SGP.32 version of its Smart Connectivity Premium. The global, multi-network, multi-profile eSIM solution gives IoT customers one SKU that pairs the Smart Connectivity profile with local carrier profiles.
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Global IoT deployments need more connectivity flexibility than traditional SIM architectures can deliver. Common challenges include single-carrier dependency, which leads to vendor lock-in and a greater risk of outages; permanent roaming restrictions; and having to replace SIMs in the event of network sunsets or changes in provider.
The GSMA’s SGP.32 standard tackles these challenges. Semtech brings Smart Connectivity Premium and mobile network operator (MNO) partner profiles together in the AirVantage® eSIM orchestrator, a single platform for orchestration, bulk provisioning, subscription and lifecycle management. Customers can manage deployments through the AirVantage user interface or connect to their own platforms through its APIs. AirVantage is built on AWS, giving customers a secure, scalable platform for managing IoT connectivity at global scale.
With Smart Connectivity Premium, customers can add MNO profiles on top of Semtech’s multi-IMSI Smart Connectivity Advanced profile to localize device deployments across technologies and data usage volumes. The PowerSave eSIM, a multi-network, dual-profile solution built for battery-constrained devices, optimizes attach time and is designed to help transfer critical data without impacting battery life.
“Adoption of eSIMs in the cellular IoT market is entering a new phase of growth. With roughly 12% of cellular IoT devices using an eSIM at the end of 2025, SGP.32 is lowering the barriers to adoption by simplifying remote provisioning and profile management. Multi-profile eSIMs combined with centralized orchestration will provide greater flexibility and control over connectivity for enterprises operating across multiple networks and regions,” said Fredrik Stalbrand, principal analyst at Berg Insight.
“Customers’ deployments vary widely, as does the level of control they need. With SGP.32, they can add local carrier profiles to a single SKU and choose the deployment model that fits their business, from a preloaded eSIM to self-configuration, all managed in AirVantage. Smart Connectivity Premium gave multi-profile on SGP.02, and SGP.32 gives more flexibility in deployment,” said Rupa Datta, vice president of IoT Connected Services at Semtech.
Fixed applications like smart metering and video surveillance benefit from a single SKU with a global Smart Connectivity profile and additional MNO profiles. This helps address permanent roaming restrictions and supports failover. Mobile assets gain multi-carrier support for resilience and coverage across regions, with the potential to add alternate connectivity technologies like non-terrestrial networks (NTN).
The solution is automated, so customers do not need to prompt downloads or switches. Semtech’s eSIM applet works with the device to download, enable and switch profiles when needed.
Smart Connectivity Premium is built on GSMA-certified eSIM and eIM technology from Kigen, which holds GSMA eUICC Security Assurance (eSA) certification and supports SGP.32 v1.3.
Key Highlights
Availability
The solution is generally available starting today. Semtech expects to expand this multi-profile capability to additional carriers and markets in the months ahead. Interested businesses can contact Semtech and learn more about their SGP.32 offer at https://www.semtech.com/sgp-32.
Visit Semtech at Electronica Munich
Semtech will exhibit at Electronica Munich 2026, Nov. 10–13, in Munich, Germany. At booth C3.262, visitors can see demonstrations spanning LoRa® wireless, Wi-SUN and Z-Wave on the LR2021, capacitive and force sensing, Transient Voltage Suppression (TVS) circuit protection, and learn more about SGP.32-compatible Smart Connectivity Premium.
About Semtech
Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected IoT devices worldwide. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.
Semtech, the Semtech logo, AirVantage, and LoRa are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners.
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Semtech brings Smart Connectivity Premium and mobile network operator (MNO) partner profiles together in the AirVantage® eSIM orchestrator, a single platform for orchestration, bulk provisioning, subscription and lifecycle management.
